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41. 发明专利

JP5033421B2 A sensor which can be used in ultra-pure environment and high-corrosive environment a method of manufacturing the same 有权
标题翻译：空值
公开(公告)号：JP5033421B2
公开(公告)日：2012-09-26
申请号：JP2006533058
申请日：2004-05-14
申请人：インテグリス・インコーポレーテッド
发明人：アール．クッチ、ジェラルド , ディアス、ジョージアンドレスディアス , ピーターソン、トム
IPC分类号： G01L19/04 , G01K7/22 , G01L9/00 , G01L19/06 , H01L29/84
CPC分类号： G01L19/0627 , G01L9/0042 , G01L9/0052 , G01L9/0072 , G01L19/04 , G01L19/0681 , G01L19/069
摘要： The electrical pin lead structure and brazing technique of the present invention provide a brazed lead in a sensor that adheres well to a semiconductor substrate while facilitating lateral flexibility without joint fatigue or breakage. In one example embodiment, the pin lead includes a coil head that is brazed to a silicon layer on a sapphire substrate using a silver-copper-palladium braze material. An advantage to this approach is the ability to both braze the pin lead to the diaphragm and seal the diaphragm to the ceramic backing plate with a high temperature glass in a single process step. Further, the palladium in the braze composition is a factor in reducing surface tension between the metal lead and semiconductor substrate during cooling to avoid stress fractures in the substrate.
摘要翻译：本发明的电引脚引线结构和钎焊技术在传感器中提供钎焊引线，该传感器能很好地粘附到半导体衬底上，同时有助于侧向柔性，而不会发生接头疲劳或断裂。在一个示例实施例中，引脚引线包括线圈头，其使用银 - 铜 - 钯钎焊材料钎焊到蓝宝石衬底上的硅层。这种方法的优点是能够将引脚引线导向隔膜，并在单一工艺步骤中用高温玻璃将隔膜密封到陶瓷背板。此外，钎焊组合物中的钯是在冷却期间降低金属引线和半导体衬底之间的表面张力以避免衬底中的应力断裂的因素。

42. 发明专利

JP4556784B2 Pressure sensor 有权
公开(公告)号：JP4556784B2
公开(公告)日：2010-10-06
申请号：JP2005186271
申请日：2005-06-27
申请人：株式会社デンソー
发明人：宏明田中
IPC分类号： G01L9/00
CPC分类号： G01L19/147 , G01L19/0627

43. 发明专利

JP2009103602A Pressure sensor 审中-公开
标题翻译：压力传感器
公开(公告)号：JP2009103602A
公开(公告)日：2009-05-14
申请号：JP2007276242
申请日：2007-10-24
申请人： Denso Corp , 株式会社デンソー
发明人： AZEYANAGI SUSUMU
IPC分类号： G01L9/00 , G01L19/00
CPC分类号： G01L19/06 , G01L19/0627
摘要： PROBLEM TO BE SOLVED: To provide a pressure sensor, while inhibiting generation of air bubbles, capable of implementing correct pressure detection. SOLUTION: In the pressure sensor, rather than a channel into which the pressure of a pressure medium is introduced is not filled with gel-like material 42, but is basically filled with protective oil 41 so that a structure is obtained, where a surface of protective oil 41 is covered with gel-like material 42 for preventing leakage of protective oil 41. Hence, even if a gel-like material 42 comes into contact with a first lower case 11 to generate air bubbles, because of the small area of the contact part, influence on pressure transmission is hardly produced; whereas, even if air bubbles are generated, because they can be generated at distant locations from the pressure transmission channels, influence on pressure transmission can be made less. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供压力传感器，同时抑制气泡的产生，能够实现正确的压力检测。解决方案：在压力传感器中，不是将压力介质的压力引入其中的通道不填充凝胶状材料42，而是基本上填充有保护油41，从而获得结构，其中保护油41的表面被凝胶状材料42覆盖，以防止保护油41的泄漏。因此，即使凝胶状材料42与第一下壳体11接触而产生气泡，因为小接触部分的面积几乎不产生对压力传递的影响; 而即使产生气泡，因为它们可以在距离压力传递通道的远处产生，所以可以减小对压力传递的影响。版权所有（C）2009，JPO＆INPIT

44. 发明专利

JPWO2007052335A1 半導体圧力センサ审中-公开
公开(公告)号：JPWO2007052335A1
公开(公告)日：2009-04-30
申请号：JP2007542184
申请日：2005-11-01
申请人：株式会社日立製作所 , 富士電機デバイステクノロジー株式会社
发明人：神永　俊明 , 俊明神永 , 雅秀林 , 雅秀林 , 勝道上柳 , 勝道上柳 , 斉藤　和典 , 和典斉藤 , 睦雄西川 , 睦雄西川
IPC分类号： G01L9/00 , H01L21/60 , H01L29/84
CPC分类号： G01L15/00 , G01L19/0038 , G01L19/0084 , G01L19/0627 , G01L19/141 , G01L19/147 , H01L2224/05553 , H01L2224/45124 , H01L2224/45144 , H01L2224/48465 , H01L2924/01004 , H01L2924/01013 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/00
摘要：本発明は、半導体圧力センサで排気ガスなどの腐食性物質を含む圧力媒体の圧力を測定すると、腐食性ガスにより、アルミ電極、アルミワイヤ、入出力端子が腐食してしまうという課題を解決し、センサチップの耐食性を向上させるとともに、特に感圧部となる部分の耐食性を向上させることを目的とする。腐食部位となるアルミ電極をアルミ電極上にチタンタングステンの層と金の層を設けることによって、電極の腐食を防止する。接続ワイヤは金ワイヤを使用することによって、腐食物質による腐食を防止する。入出力端子も金メッキ化することによって、腐食を防止する。

45. 发明专利

JP4185477B2 Pressure sensor 有权
公开(公告)号：JP4185477B2
公开(公告)日：2008-11-26
申请号：JP2004216549
申请日：2004-07-23
申请人：長野計器株式会社
发明人：崇之横山 , 宏誌若林 , 嘉一金子
IPC分类号： G01L19/06 , B23K15/00 , G01L19/14
CPC分类号： G01L9/0051 , G01L19/0038 , G01L19/0627

46. 发明专利

JP2008122182A Pressure sensor apparatus and pressure sensor housing 有权
标题翻译：压力传感器装置和压力传感器外壳
公开(公告)号：JP2008122182A
公开(公告)日：2008-05-29
申请号：JP2006305261
申请日：2006-11-10
申请人： Fuji Electric Device Technology Co Ltd , Hitachi Ltd , 富士電機デバイステクノロジー株式会社 , 株式会社日立製作所
发明人： KAMINAGA TOSHIAKI , KUBO ATSUSHI , SAITO KAZUNORI , ASHINO KIMIYASU , KAMIYANAGI KATSUMICHI
IPC分类号： G01L9/00 , H01L29/84
CPC分类号： G01L19/0038 , G01L19/0627 , G01L19/141
摘要： PROBLEM TO BE SOLVED: To provide a pressure sensor apparatus and a pressure sensor housing capable of preventing the occurrence of frozen moisture, swelling of a gel-like coating member and damage to a pressure sensor element, without causing accumulation of moisture, oil, gasoline or the like on a protective wall even when the pressure sensor apparatus is disposed obliquely caused by the layout etc.
SOLUTION: A pressure sensor apparatus 100A or a pressure sensor housing 100B comprises a pressure detection chamber 102, into which a gas to be measured for pressuring is introduced; a pressure sensor element 201 for detecting the pressure of the gas; and a protective wall 108 for preventing infiltration of foreign matters into the pressure detection chamber 102. The protective wall 108 has an inclined surface 108a at an angle θ
8a , such that a second angle θ
2 sloping downward is retained in between the horizontal line HL and the inclined surface 108a, when the pressure sensor apparatus 100A is disposed obliquely by a first angle θ
1 , with respect to the horizontal line HL. Another inclined surface 102a is formed on the inner periphery wall of the pressure detection chamber 102, as necessary.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决方案：提供一种压力传感器装置和压力传感器壳体，其能够防止冻结湿气的发生，凝胶状涂层部件的膨胀和压力传感器元件的损坏而不会引起水分积聚，油，汽油等，即使当压力传感器装置由布置等倾斜地布置时。解决方案：压力传感器装置100A或压力传感器壳体100B包括压力检测室102，压力检测室引入要测量的用于加压的气体; 用于检测气体压力的压力传感器元件201; 以及用于防止异物渗透到压力检测室102中的保护壁108.保护壁108具有角度θ<8a>的倾斜表面108a，使得第二角度θ< 当压力传感器装置100A相对于水平线HL倾斜设置第一角度θ 1 时，向下倾斜的保持在水平线HL和倾斜面108a之间。根据需要，在压力检测室102的内周壁上形成另一倾斜面102a。版权所有（C）2008，JPO＆INPIT

47. 发明专利

JP2006023109A Pressure sensor and its manufacturing method 审中-公开
标题翻译：压力传感器及其制造方法
公开(公告)号：JP2006023109A
公开(公告)日：2006-01-26
申请号：JP2004199335
申请日：2004-07-06
申请人： Denso Corp , 株式会社デンソー
发明人： NOMURA HIROSHI
IPC分类号： G01L13/00 , G01L23/24
CPC分类号： G01L19/0038 , G01L19/0084 , G01L19/0627 , G01L19/141
摘要： PROBLEM TO BE SOLVED: To prevent the occurrence of oscillation ripples as much as possible and reduce output errors due to the oscillations in a differential pressure detection type pressure sensor in which both pressure receiving surfaces of a pressure detection element are each coated with protective members.
SOLUTION: The pressure sensor is provided with both a case 10 having a recession part 11 open to one surface side and a pressure detection element 20 housed in the recession part 11 in such a way that its one surface side may face the opening-part side of the recession part 11 and that the other surface side may face a bottom part of the recession part 11. The case 10 is provided with a through hole 14 of which one surface side is open to the other surface side of the pressure detection element 20 via the bottom surface of the recession part 11, a middle part is folded back, and the other end side is open to a different location from the recession part 11 in one surface of the case 10. A first protective member 30 fills the recession part 11, and a second protective member 40 fills the through hole 14. The surface 31 of the first protective member 30 facing the opening part of the recession part 11 and the surface 41 of the second protective member 40 facing the opening part of the other end side of the through hole 14 are surfaces of the same height.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题为了尽可能地防止振荡波纹的发生，并且降低由压力检测型压力传感器中的振荡引起的输出误差，其中压力检测元件的压力接收表面均被涂覆有保护成员。解决方案：压力传感器具有壳体10，壳体10具有开口到一个表面侧的凹陷部分11和容纳在凹陷部分11中的压力检测元件20，使得其一个表面侧可面向开口并且另一个表面侧可面向凹部11的底部。壳体10设置有通孔14，该通孔14的一个表面侧与压力的另一个表面侧开口检测元件20经由凹部11的底面，中间部折回，另一端侧与壳体10的一个表面的凹部11不同的位置开口。第一保护部件30填充凹陷部11和第二保护构件40填充通孔14.第一保护构件30的面对凹部11的开口部的表面31和第二保护构件40的面向开口部的开口部的表面41 该通孔14的另一端侧是相同高度的表面。版权所有（C）2006，JPO＆NCIPI

48. 发明专利

JP3692014B2 System to compensate for the effects of pressure and temperature 有权
公开(公告)号：JP3692014B2
公开(公告)日：2005-09-07
申请号：JP2000156863
申请日：2000-05-26
申请人：ラディ・メディカル・システムズ・アクチェボラーグ
发明人：サウリ・トゥルッキ
IPC分类号： G01L7/00 , A61B5/00 , A61B5/01 , A61B5/0215 , A61B5/0295 , G01K1/20 , G01L9/04 , G01L19/04
CPC分类号： A61B5/02156 , A61B5/01 , A61B5/6851 , G01L9/065 , G01L19/0627 , G01L19/149
摘要： A method for temperature compensation is disclosed which comprises the excitation of sensors in a guide wire sensor assembly so as to produce two distinguishable out signals. At least a component of at least one of the signals is representative of the cable resistance and can be used for compensation purposes. There is also provided an apparatus suitable for such measurements having temperature compensation means. The compensation means comprises circuitry for selectively and independently registering a resistance value for the passive resistor on the chip.

49. 发明专利

JP2005147795A Physical quantity sensor and pressure sensor 有权
标题翻译：物理量传感器和压力传感器
公开(公告)号：JP2005147795A
公开(公告)日：2005-06-09
申请号：JP2003383994
申请日：2003-11-13
申请人： Denso Corp , 株式会社デンソー
发明人： IMAI MASATO , MURAKAMI YOSHIFUMI
IPC分类号： G01L9/00 , G01L9/02 , G01L9/04 , G01L19/04 , G01L19/14 , G01L23/24
CPC分类号： G01L9/0055 , G01L19/0627 , G01L19/147 , G01L19/148 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To reduce the sensor size in the direction parallel to an installation surface of a sensor chip in a pressure sensor having the sensor chip and a processing circuit board for processing a sensor signal.
SOLUTION: The pressure sensor S1 comprises: a stem 10 which is hollow tubular in shape, has a diaphragm 11 deformable by pressure on a part of the outer surface, and an opening 12 for introducing pressure into the hollow section; a sensor chip 20 which is placed on the diaphragm 11 and outputs an electrical signal according to the deformation of the diaphragm 11; and the processing circuit board 30 which is placed around the sensor chip 20 and processes the electrical signal from the sensor chip 20. The processing circuit board 30 is placed so that a substrate surface of the processing circuit board 30 is positioned perpendicular to the installation surface 10a in the stem 10 for the sensor chip 20.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：在具有传感器芯片的压力传感器和用于处理传感器信号的处理电路板的平行于传感器芯片的安装表面的方向上减小传感器尺寸。解决方案：压力传感器S1包括：中空管状的杆10，其具有可通过压力在外表面的一部分上变形的隔膜11和用于将压力引入中空部分的开口12; 传感器芯片20，其被放置在隔膜11上并根据隔膜11的变形输出电信号; 以及放置在传感器芯片20周围并处理来自传感器芯片20的电信号的处理电路板30.处理电路板30被放置成使得处理电路板30的基板表面垂直于安装表面定位用于传感器芯片20的杆10中。（C）2005，JPO＆NCIPI

50. 发明专利

JP2003505689A Pressure sensor 审中-公开
公开(公告)号：JP2003505689A
公开(公告)日：2003-02-12
申请号：JP2001512264
申请日：2000-07-15
申请人：ローベルトボツシユゲゼルシヤフトミツトベシユレンクテルハフツング
发明人：コンツェルマンウーヴェ , レンツィングトーマス
IPC分类号： G01L19/06 , G01L23/24
CPC分类号： G01L23/24 , G01L19/0627
摘要： (57)【要約】本発明は、吸気管を備えた内燃機関のための圧力センサであって、センサ面（１１′）と、該センサ面を吸気管（１２）の内部に接続するセンサ通路（１４）とが設けられている形式のものに関する。センサ通路（１４）は、不凍液（２０）で満たされた区分（１８）を有している。

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