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41. 发明专利

JP2014177632A Adhesive and adhesive sheet containing ladder-type polysilsesquioxane 有权
标题翻译：包含梯形聚四氟乙烯的胶粘和粘合片
公开(公告)号：JP2014177632A
公开(公告)日：2014-09-25
申请号：JP2014079036
申请日：2014-04-07
申请人： Lintec Corp , リンテック株式会社
发明人： BEPPU SHIORI , KASHIO MIKIHIRO , SUGIZAKI TOSHIO , KAGEYAMA TOSHIBUMI , MORIYA OSAMU
IPC分类号： C09J183/04 , C08G77/14 , C08G77/20 , C09J7/02
CPC分类号： C08F230/08 , C08G77/04 , C08G77/14 , C08G77/26 , C08G77/28 , C09J7/38 , C09J183/04 , C09J2483/00
摘要： PROBLEM TO BE SOLVED: To provide an adhesive which firmly bonds a metal or a synthetic resin.SOLUTION: An adhesive comprises the following (A) component, (B) component and (C) component. (A) component: one or two or more of a ladder-type polysilsesquioxane having a repeating unit of the following formula (i) and/or a repeating unit of the following formula (ii), (B) component: a curing agent, and (C) component: a solvent.
摘要翻译：要解决的问题：提供一种牢固地粘合金属或合成树脂的粘合剂。溶液：粘合剂包括以下（A）组分，（B）组分和（C）组分。（A）成分：具有下述式（i）的重复单元和/或下式（ii）的重复单元的梯型聚倍半硅氧烷中的一种或两种以上，（B）成分：固化剂，和（C）成分：溶剂。

42. 发明专利

JP2014177299A Sheet sticking device and method 有权
标题翻译：薄片装饰和方法
公开(公告)号：JP2014177299A
公开(公告)日：2014-09-25
申请号：JP2013053794
申请日：2013-03-15
申请人： Lintec Corp , リンテック株式会社
发明人： NAKADA MIKI
IPC分类号： B65C9/08
摘要： PROBLEM TO BE SOLVED: To provide a sheet sticking device capable of suppressing support error of an adhesive sheet.SOLUTION: A sheet sticking device 1 comprises: supply means 2 for supplying an adhesive sheet AS; support means 3 for supporting the adhesive sheet AS supplied by the supply means 2 at a support position PA where is a predetermined position; and moving means 4 for moving the adhesive sheet AS between the support position PA and a sticking position PB where the adhesive sheet AS supported by the support means 3 is stuck to an adherend WF. The moving means 4 comprises: a moving body part 40; and coupling means 60 provided between the moving body part 40 and the support means 3. The coupling means 60 is configured so that its state can be switched between a rigid state for supporting the support means 3 so as not to move with respect to the moving body part 40 and a flexible state for supporting the support means 3 so as to swing with respect to the moving body part 40.
摘要翻译：要解决的问题：提供能够抑制粘合片的支撑误差的片材粘贴装置。解决方案：片材粘贴装置1包括：用于供应粘合片AS的供给装置2; 支撑装置3，用于在作为预定位置的支撑位置PA处支撑由供给装置2提供的粘合片AS; 以及移动装置4，用于将支撑位置PA和支撑位置PB之间的粘合片AS移动，由支撑装置3支撑的粘合片AS粘附到被粘物WF。移动装置4包括：移动体部分40; 以及设置在移动体部40和支撑装置3之间的联接装置60.联接装置60被构造成使得其状态可以在用于支撑支撑装置3的刚性状态之间切换，以便相对于移动主体部40和用于支撑支撑装置3以相对于移动体部40摆动的柔性状态。

43. 发明专利

JP2014177093A Release film for production of green sheet and method of producing release film for production of green sheet 有权
标题翻译：绿色薄膜生产薄膜及生产绿色薄膜生产方法
公开(公告)号：JP2014177093A
公开(公告)日：2014-09-25
申请号：JP2013054208
申请日：2013-03-15
申请人： Lintec Corp , リンテック株式会社
发明人： FUKAYA TOMOMI , ICHIKAWA SHINYA
IPC分类号： B28B1/30 , B32B27/00 , B32B27/38 , H01G4/30
CPC分类号： B28B1/30 , B32B7/06 , B32B27/08 , B32B27/16 , B32B27/38 , B32B2307/538 , B32B2307/748 , B32B2457/16
摘要： PROBLEM TO BE SOLVED: To provide a release film for production of green sheet which prevents occurrence of pinholes in the surface of a green sheet and enables production of a green sheet with high reliability.SOLUTION: A release film for production of a green sheet is used in production of a green sheet and includes a substrate having a first surface and a second surface, a smoothing layer formed on the first surface and a release agent layer formed on the surface of the smoothing layer opposite to the substrate. The smoothing layer is formed by heating a composition for formation of the smoothing layer containing a heat curable compound of an average molecular weight of 950 or smaller to harden the heat curable compound. The outer surface of the release agent layer has an arithmetic average roughness Raof 8 nm and a maximum protrusion height Rpof 50 nm or smaller.
摘要翻译：要解决的问题：提供一种用于生产生片的脱模膜，其防止在生片的表面中产生针孔，并且能够高可靠性地生产生片。解决方案：用于生产生片的脱模膜是用于生产生片，并且包括具有第一表面和第二表面的基板，形成在第一表面上的平滑层和形成在与基板相对的平滑层的表面上的剥离剂层。平滑层是通过加热含有平均分子量为950以下的热固性化合物的平滑层的组合物而形成的，以使该热固性化合物硬化。剥离剂层的外表面的算术平均粗糙度Raof为8nm，最大突出高度Rp为50nm以下。

44. 发明专利

JP2014166753A Film-like sealing material for electronic device, sealing sheet for electronic device and electronic device 有权
标题翻译：用于电子设备的膜状密封材料，电子设备和电子设备的密封片
公开(公告)号：JP2014166753A
公开(公告)日：2014-09-11
申请号：JP2014013746
申请日：2014-01-28
申请人： Lintec Corp , リンテック株式会社
发明人： HAGIWARA YOSHIAKI , TAYA NAOKI , NAGANAWA TOMOHITO
IPC分类号： B32B27/32
CPC分类号： Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide a film-like sealing material for electronic devices and a sealing sheet for electronic devices which are excellent in adhesiveness and water vapor barrier properties and an electronic device.SOLUTION: A film-like sealing material for electronic devices 1a includes an adhesive resin layer 11C which shows adhesiveness to an adherend and a water vapor barrier resin layer 12 which prevents or suppresses permeation of water vapor. The adhesive resin layer 11C contains at least one of acid-modified polyolefin resins and silane-modified polyolefin resins, and the water vapor barrier resin layer 12 contains at least one thermoplastic resin selected from ethylene-(meth)acrylic acid copolymers, rubber type resins and ionomers.
摘要翻译：要解决的问题：提供一种用于电子设备的膜状密封材料和密合性和水蒸气阻隔性优异的电子器件用密封片和电子器件。解决方案：一种用于电子设备1a的膜状密封材料包括粘附树脂层11C，该粘合树脂层11C显示与被粘物的粘合性和防止或抑制水蒸气透过的水蒸气阻隔树脂层12。粘合树脂层11C含有酸改性聚烯烃树脂和硅烷改性聚烯烃树脂中的至少一种，水蒸气阻隔树脂层12含有至少一种选自乙烯 - （甲基）丙烯酸共聚物，橡胶类树脂和离聚物。

45. 发明专利

JP2014165462A Semiconductor chip manufacturing method 审中-公开
标题翻译：半导体芯片制造方法
公开(公告)号：JP2014165462A
公开(公告)日：2014-09-08
申请号：JP2013037774
申请日：2013-02-27
申请人： Lintec Corp , リンテック株式会社
发明人： YONEYAMA HIROYUKI , ICHIKAWA ISAO , WAKAYAMA YOJI , AKUTSU TAKASHI
IPC分类号： H01L21/301 , H01L21/304
CPC分类号： H01L2224/10
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor chip manufacturing method which can prevent contamination of a chip and an adhesive film and obtain a semiconductor chip with an adhesive film in a simple method.SOLUTION: A semiconductor chip manufacturing method comprises: (a) a process of attaching a die bonding adhesive film to a circuit surface of a semiconductor wafer on which the circuit is formed on a surface; (b) a process of laminating an adhesive film and a surface protection sheet; (e) a process of making laser beams enter from a wafer rear face side to form a reformed region layer which is partitioned for each circuit on the wafer; (c) a process of grinding the rear face of the semiconductor wafer to singulate the wafer starting from the reformed region layer with respect to each circuit to obtain a group of divided chips; and (d) a process of singulating the adhesive film with respect to each chip by expanding the surface protection sheet to obtain chips each having the adhesive film on the circuit surface.
摘要翻译：要解决的问题：提供一种能够以简单的方法防止芯片和粘合剂膜的污染并获得具有粘合剂膜的半导体芯片的半导体芯片制造方法。解决方案：一种半导体芯片制造方法包括：（a）将芯片接合粘合剂膜附着到其上形成有电路的半导体晶片的电路表面的工艺; （b）层压粘合膜和表面保护片的工序; （e）使激光束从晶片背面侧进入的过程，形成为晶片上的每个电路划分的重整区域层; （c）研磨半导体晶片的背面以从重整区域开始相对于每个电路分割晶片以获得一组分割的芯片的工艺; 以及（d）通过使表面保护片发生膨胀来形成粘合膜相对于各个芯片的分割处理，得到在电路面上具有粘接膜的芯片。

46. 发明专利

JP2014165379A Sheet peeling device and peeling method 有权
标题翻译：薄膜剥离装置和剥离方法
公开(公告)号：JP2014165379A
公开(公告)日：2014-09-08
申请号：JP2013036026
申请日：2013-02-26
申请人： Lintec Corp , リンテック株式会社
发明人： SUGISHITA YOSHIAKI
IPC分类号： H01L21/683 , C09J5/00
摘要： PROBLEM TO BE SOLVED: To provide a sheet peeling device which can change a folding angle of a release sheet while suppressing increase in the scale of the device.SOLUTION: A sheet peeling device 10 comprises: delivery means 2 for delivering a master roll RS where an adhesive sheet AS is tentatively adhered to one surface of a strip of release sheet RL; and peeling means 4 for peeling the adhesive sheet AS delivered in a prescribed peeling direction DA by the delivery means from the release sheet RL. The peeling means 4 includes: a plurality of peeling media 41A, 41B which fold the peeling sheet RL; and peeling media moving means 48A, 48B which move at least one of the peeling media 41A, 41B along the peeling direction DA.
摘要翻译：要解决的问题：提供一种片材剥离装置，其可以在抑制装置的规模增加的同时改变剥离片的折叠角度。解决方案：片材剥离装置10包括：传送装置2，用于传送主辊RS，粘合片AS暂时粘附在剥离片RL的一个表面上; 以及剥离装置4，用于剥离通过输送装置从剥离片RL沿规定的剥离方向DA输送的粘合片AS。剥离装置4包括：折叠剥离片RL的多个剥离介质41A，41B; 以及剥离介质移动装置48A，48B，其沿剥离方向DA移动至少一个剥离介质41A，41B。

47. 发明专利

JP2014165195A Supporting device and supporting method 审中-公开
标题翻译：支持设备和支持方法
公开(公告)号：JP2014165195A
公开(公告)日：2014-09-08
申请号：JP2013032177
申请日：2013-02-21
申请人： Lintec Corp , リンテック株式会社
发明人： TAKANO TAKESHI
IPC分类号： H01L21/683
摘要： PROBLEM TO BE SOLVED: To provide a supporting device capable of maintaining stability of location means.SOLUTION: A supporting device 5 comprises: a base 50; location means 55 having a location face 56 for locating a supported material WF; and elevation means 6 provided between the base 50 and the location means 55 and elevating the location means 55 relative to the base 50. The elevation means 6 has center elevation means 60 positioned at a center of the location means 55, and outer edge elevation means 70 positioned at an outer edge of the location means 55. The center elevation means 60 and the outer edge elevation means 70 has: first members 61, 71 having first and third inclined faces 62, 72 inclined relative to the location face 56 provided to the location means 55; and second members 64, 74 moving along the first and third inclined faces 62, 72 provided on the base 50. The first members 61, 71 and the second members 64, 74 relatively move along the first and third inclined faces 62, 72, so as to elevate/lower the location means 55.
摘要翻译：要解决的问题：提供能够保持定位装置的稳定性的支撑装置。解决方案：支撑装置5包括：基座50; 位置装置55具有用于定位支撑材料WF的位置面56; 以及设置在基座50和定位装置55之间的升降装置6，并相对于底座50提升定位装置55.升降装置6具有定位在定位装置55中心的中心提升装置60，外边缘提升装置 70定位在定位装置55的外边缘处。中心提升装置60和外边缘提升装置70具有：第一构件61,71具有相对于设置在该位置面56上的位置面56倾斜的第一和第三倾斜面62,72 位置装置55; 以及沿着设置在基座50上的第一和第三倾斜面62,72移动的第二构件64,74。第一构件61,71和第二构件64,74相对于第一和第三倾斜面62,72相对移动，因此以升高/降低位置装置55。

48. 发明专利

JP2014158031A Adhesive composition, adhesive sheet, and method for manufacturing semiconductor device 有权
标题翻译：胶粘组合物，粘合片和制造半导体器件的方法
公开(公告)号：JP2014158031A
公开(公告)日：2014-08-28
申请号：JP2014047427
申请日：2014-03-11
申请人： Lintec Corp , リンテック株式会社
发明人： SAEKI NAOYA , NAKAJIMA EMI , SHIZUHATA HIRONORI
IPC分类号： H01L21/301 , C09J4/00 , C09J5/06 , C09J7/02 , C09J11/06 , C09J133/00 , C09J133/14 , C09J163/00 , H01L21/52
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition in which adhesive layers are not adhered to each other when having been diced using a thin dicing blade, and that can achieve high package reliability even when having been exposed to a severe reflow condition, in a package mounted with a semiconductor chip to be thinned, and to provide an adhesive sheet having an adhesive layer formed from the adhesive composition, and a method for manufacturing a semiconductor device using the adhesive sheet.SOLUTION: An adhesive composition contains an acrylic polymer (A) having a weight average molecular weight (Mw) of 900,000 or more and a molecular weight distribution (Mw/Mn) of 3.9 or more and 7 or less, an epoxy resin (B) and a thermosetting agent (C). The adhesive composition is used in a step of die bonding a semiconductor chip, or a step of dicing a semiconductor wafer and die bonding a semiconductor chip.
摘要翻译：要解决的问题：提供一种粘合剂组合物，其中当使用薄的切割刀片切割时粘合剂层彼此不粘合，并且即使当已经暴露于严重的回流条件时也可以实现高封装可靠性，封装安装有要稀释的半导体芯片，并提供具有由粘合剂组合物形成的粘合剂层的粘合片，以及使用该粘合片制造半导体器件的方法。溶液：粘合剂组合物含有丙烯酸类聚合物（A ），分子量分布（Mw / Mn）为3.9以上且7以下的环氧树脂（B）和热固性化合物（C）的重均分子量（Mw）为900,000以上。粘合剂组合物用于芯片接合半导体芯片的步骤，或半导体晶片的切割步骤和裸片接合半导体芯片。

49. 发明专利

JP2014156551A Pressure-sensitive adhesive composition, pressure-sensitive adhesive and pressure-sensitive adhesive sheet 有权
标题翻译：压敏粘合剂组合物，压敏粘合剂和压敏胶粘剂
公开(公告)号：JP2014156551A
公开(公告)日：2014-08-28
申请号：JP2013028386
申请日：2013-02-15
申请人： Lintec Corp , リンテック株式会社
发明人： ARAI TAKAYUKI , MATANO HITOSHI , SHOSHI SATORU
IPC分类号： C09J133/04 , C09J4/02 , C09J7/02 , C09J11/06
摘要： PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive composition, a pressure-sensitive adhesive and a pressure-sensitive adhesive sheet showing excellent durability even when applied to an optical member such as a polarizing plate.SOLUTION: The pressure-sensitive adhesive composition comprises: a (meth)acrylate polymer (A) having a weight average molecular weight of 900000 to 3000000 and containing, as a monomer unit constituting the polymer, a monomer having an alicyclic structure; an active energy ray-curable component (B); and a silane coupling agent (C) having a mercapto group as a functional group to react with an organic material.
摘要翻译：要解决的问题：提供一种压敏粘合剂组合物，压敏粘合剂和压敏粘合片，即使当应用于诸如偏振片的光学构件时也显示出优异的耐久性。溶液：压敏粘合剂组合物包含：重均分子量为900000〜3000000的（甲基）丙烯酸酯系聚合物（A），作为构成聚合物的单体单元，含有脂环式结构的单体; 活性能量射线固化性组分（B）; 和具有巯基作为官能团的硅烷偶联剂（C）与有机材料反应。

50. 发明专利

JP2014152319A Pressure-sensitive adhesive composition, pressure-sensitive adhesive and pressure-sensitive adhesive sheet 有权
标题翻译：压敏粘合剂组合物，压敏粘合剂和压敏胶粘剂
公开(公告)号：JP2014152319A
公开(公告)日：2014-08-25
申请号：JP2013026093
申请日：2013-02-13
申请人： Lintec Corp , リンテック株式会社
发明人： MATANO HITOSHI , ARAI TAKAYUKI , SHOSHI SATORU
IPC分类号： C09J133/04 , C09J7/02 , C09J11/06 , C09J133/14 , C09J175/04
摘要： PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive composition, a pressure-sensitive adhesive and a pressure-sensitive adhesive sheet having excellent antistatic property as well as excellent durability suitable for an optical member such as a polarizing plate.SOLUTION: The pressure-sensitive adhesive composition comprises: a (meth)acrylate polymer (A) having a weight average molecular weight of 1000000 to 2500000, containing, as monomer units constituting the polymer, a monomer having a hydroxyl group and a monomer having an aromatic ring, and containing no monomer having a carboxyl group; an isocyanate-based crosslinking agent (B); a silane coupling agent (C) having a mercapto group as a functional group to react with an organic material; and an antistatic agent (D). The (meth)acrylate polymer (A) contains, as monomer units constituting the monomer, 1 to 10 mass% of monomers having a hydroxyl group and 1 to 10 mass% of monomers having an aromatic ring.
摘要翻译：要解决的问题：提供一种压敏粘合剂组合物，压敏粘合剂和具有优异的抗静电性能的粘合片以及适用于诸如偏振片之类的光学构件的优异的耐久性。溶液：压力敏感性粘合剂组合物包含：重均分子量为1000000至2500000的（甲基）丙烯酸酯聚合物（A），其包含构成聚合物的单体单元，具有羟基的单体和具有芳环的单体，以及不含有羧基的单体; 异氰酸酯类交联剂（B）; 具有与有机材料反应的巯基作为官能团的硅烷偶联剂（C）; 和抗静电剂（D）。（甲基）丙烯酸酯聚合物（A）作为构成单体的单体单元含有1〜10质量％的具有羟基的单体和1〜10质量％的具有芳香环的单体。

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