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    • 1. 发明专利
    • Release sheet and release sheet laminated body
    • 发布表格并发布片层压体
    • JP2009131977A
    • 2009-06-18
    • JP2007308316
    • 2007-11-29
    • Lintec Corpリンテック株式会社
    • MIYATA TAKESHITAKAHASHI AKIRASUGIZAKI TOSHIO
    • B32B27/00B32B7/06B32B7/12C09J7/00
    • PROBLEM TO BE SOLVED: To provide a release sheet which is excellent in wettability, hardly causes repellence of the adhesive, and is excellent in releasability from the adhesive layer formed by coating when the adhesive is applied on the surface of the release layer, and causes no zipping when the adhesive layer is peeled, and therefore can form a smooth plane surface of the adhesive layer when an adhesive is applied on the surface of a release layer, even if a little coating amount of the adhesive is applied for forming a thin adhesive layer.
      SOLUTION: The release sheet is characterized in that the release layer is formed on at least one surface of a substrate sheet, the release layer is a cured coating film for curing a 1,4-polybutadiene polymer having a functional group at both terminals, and substantially does not contain a silicone compound.
      COPYRIGHT: (C)2009,JPO&INPIT
    • 解决问题的方法:为了提供润湿性优异的剥离片,几乎不引起粘合剂的排斥,并且当将粘合剂涂布在剥离层的表面上时,由通过涂布形成的粘合剂层的剥离性优异 并且当粘合剂层被剥离时不会引起拉伸,因此即使将粘合剂施加到剥离层的表面上也可以形成粘合剂层的光滑的平面表面,即使涂布量少的粘合剂用于形成 薄的粘合剂层。 解决方案:剥离片的特征在于,剥离层形成在基片的至少一个表面上,剥离层是用于固化具有两官能团的1,4-聚丁二烯聚合物的固化涂膜 端子,并且基本上不含有硅氧烷化合物。 版权所有(C)2009,JPO&INPIT
    • 6. 发明专利
    • Pressure-sensitive adhesive sheet
    • 压敏粘合片
    • JP2007051293A
    • 2007-03-01
    • JP2006239052
    • 2006-09-04
    • Lintec Corpリンテック株式会社
    • KASHIO MIKIHIRONAKABAYASHI MASAHITOSUGIZAKI TOSHIO
    • C09J7/02B32B27/00B32B27/30C08F299/00C09J133/06G02B5/30
    • PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive sheet enabling a seasoning period to be shortened, and having a wide application range as a product matching to required properties in various kinds of applications such as the one for permanent adhesion use and the one for removal use.
      SOLUTION: The pressure-sensitive adhesive sheet is obtained by forming a thin film comprising a compound obtained by compounding at least 1-100 pts.wt. acrylic polymer (B) having a radiation-polymerizable group on a side chain with 100 pts.wt. acrylic polymer (A) obtained by polymerizing a monomer consisting essentially of an alkyl (meth)acrylate having a 1-18C alkyl group, and crosslinking the resultant thin film by radial rays.
      COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:提供能够缩短调味期的压敏粘合片,并且具有广泛的应用范围作为与诸如用于永久粘合使用的各种应用中的所需性能匹配的产品 和一个去除使用。 解决方案:通过形成包含通过配混至少1-100重量份得到的化合物的薄膜来获得压敏粘合片。 在侧链上具有放射线聚合性基团的丙烯酸类聚合物(B)为100重量份 通过使基本上由具有1-18个C烷基的(甲基)丙烯酸烷基酯组成的单体聚合而获得的丙烯酸类聚合物(A),并通过径向射线交联所得的薄膜。 版权所有(C)2007,JPO&INPIT
    • 7. 发明专利
    • Process film for manufacturing laminated circuit board
    • 制造层压电路板的工艺薄膜
    • JP2006281488A
    • 2006-10-19
    • JP2005101194
    • 2005-03-31
    • Lintec Corpリンテック株式会社
    • MIYATA TAKESHITAKAHASHI AKIRASUGIZAKI TOSHIO
    • B32B27/00H05K3/46
    • PROBLEM TO BE SOLVED: To provide a process film for manufacturing a laminated circuit board capable of forming a good via-hole when processing the via-hole, capable of being pasted on the laminated circuit board at the normal temperature, preventing the trouble caused by flotation or peeling when filling the hole with conductive paste and excellent in the peelability from the laminated circuit board.
      SOLUTION: In the process film for manufacturing the laminated circuit board having a base material film, the resin layer formed on one side of the base material film and the pressure-sensitive adhesive layer formed on the other side thereof, the resin layer is preferably composed of the cured material of an energy beam curable resin composition and the pressure-sensitive adhesive layer is a layer comprising a silicone pressure-sensitive adhesive.
      COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:为了提供一种用于制造能够在加工通孔时形成良好通孔的层叠电路板的工艺膜,能够在常温下粘贴在层压电路板上,防止了 当用导电膏填充孔时由浮选或剥离引起的故障,并且具有优异的层压电路板的剥离性。 解决方案:在用于制造具有基材膜的层压电路板的制造膜中,形成在基材膜的一侧上的树脂层和在其另一侧上形成的压敏粘合剂层,树脂层 优选由能量束固化树脂组合物的固化物构成,并且压敏粘合剂层是包含硅氧烷压敏粘合剂的层。 版权所有(C)2007,JPO&INPIT
    • 8. 发明专利
    • Process film for manufacturing laminated circuit board
    • 制造层压电路板的工艺薄膜
    • JP2006281481A
    • 2006-10-19
    • JP2005101146
    • 2005-03-31
    • Lintec Corpリンテック株式会社
    • MIYATA TAKESHITAKAHASHI AKIRASUGIZAKI TOSHIO
    • B32B27/30H05K3/46
    • PROBLEM TO BE SOLVED: To provide a process film for manufacturing a laminated circuit board capable of forming a good hole at the time of processing of a via-hole, not causing the trouble caused by flotation or peeling when filling the hole with conductive paste and excellent in the peelability from the laminated circuit board.
      SOLUTION: The process film for manufacturing the laminated circuit board has a base material film and the resin layers formed on both sides of the base material film and is characterized in that each of the resin layers on both sides of the base material film is a layer comprising the cured material of an active energy beam curable resin composition or a layer comprising an alkyd resin and/or an acrylic resin.
      COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:提供一种用于制造在通孔加工时能够形成良好孔的层叠电路板的工艺膜,而不会在填充孔时引起由浮选或剥离引起的故障 导电糊,并且从层叠电路板的剥离性优异。 解决方案:用于制造层压电路板的工艺膜具有基材膜和形成在基材膜两侧的树脂层,其特征在于,基材膜两侧的每个树脂层 是包含活性能量束固化树脂组合物的固化物或包含醇酸树脂和/或丙烯酸树脂的层的层。 版权所有(C)2007,JPO&INPIT
    • 9. 发明专利
    • Release agent composition and release liner
    • 发布代理人组成和发布内部
    • JP2006008991A
    • 2006-01-12
    • JP2005143890
    • 2005-05-17
    • Lintec Corpリンテック株式会社
    • BEPPU SHIORIKAMESHIMA ATSUKOSUGIZAKI TOSHIO
    • C09K3/00C08G18/16C08G18/30
    • PROBLEM TO BE SOLVED: To provide an acrylic resin release agent composition bearing a long chain alkyl group which exhibits excellent solvent resistance, heat resistance and adhesion to a substrate without exerting bad influences on electronic parts and the like and is capable of controlling peel strength, and a release liner having a release layer comprised of the composition.
      SOLUTION: The release agent composition comprises a polymer (A) comprising a (meth)acrylate containing a constituting unit represented by general formula (1) (wherein R
      1 is a hydrogen atom or a methyl group; and R
      2 is a 12-28C long chain alkyl group) and a crosslinking agent (B) comprising an isocyanate group-containing compound and a compound bearing a functional group reactive with the isocyanate group, preferably a hydroxyl group, an amino group or a carboxyl group.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:提供一种带有长链烷基的丙烯酸树脂脱模剂组合物,其对溶剂性,耐热性和对基材的粘附性没有对电子部件等产生不利影响并且能够控制 剥离强度和具有由该组合物组成的剥离层的剥离衬垫。 解决方案:脱模剂组合物包含含有(甲基)丙烯酸酯的聚合物(A),其含有由通式(1)表示的构成单元(其中R SP 1为氢原子或甲基 基团; R 2是12-28C长链烷基)和包含含异氰酸酯基的化合物和具有与异氰酸酯基反应的官能团的化合物的交联剂(B),优选 羟基,氨基或羧基。 版权所有(C)2006,JPO&NCIPI
    • 10. 发明专利
    • Polysilsesquioxane graft polymer, method for producing the same, and pressure-sensitive adhesive
    • 聚甲基丙烯酸聚合物,其制造方法和压敏粘合剂
    • JP2005105246A
    • 2005-04-21
    • JP2004019023
    • 2004-01-27
    • Lintec Corpリンテック株式会社
    • KIMURA ATSUKOKASHIO MIKIHIROSUGIZAKI TOSHIOMORIYA OSAMU
    • C09J7/02C08F283/12C08G77/442C09J151/08C09J183/10
    • PROBLEM TO BE SOLVED: To obtain a new polysilsesquioxane graft polymer capable of being used as a pressure-sensitive adhesive together having excellent heat resistance and cohesive force, to provide a method for producing the polymer, to provide the pressure-sensitive adhesive by using the polysilsesquioxane graft polymer, and to provide a pressure-sensitive adhesive tape by using the polymer.
      SOLUTION: The polysilsesquioxane graft polymer has a repeating unit expressed by formula (1) (A is a bond; R
      1 is a hydrocarbon radical which may be substituted; R
      2 is H or a 1-18C alkyl; R
      3 is a polar radical or an aryl which may be substituted; (l), (m) and (n) are each 0 or a natural number, provided that (m) and (n) are not allowed to be 0 at the same time; and k1, k2 and k3 are each a natural number) in its molecule. The method for producing the polymer is provided. Further, the pressure-sensitive adhesive and the pressure-sensitive adhesive tape are provided by using the polysilsesquioxane graft polymer, respectively.
      COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题为了获得能够用作压敏粘合剂的新的聚倍半硅氧烷接枝聚合物一起具有优异的耐热性和内聚力,提供聚合物的制备方法,以提供压敏粘合剂 通过使用聚倍半硅氧烷接枝聚合物,并通过使用该聚合物提供压敏粘合带。 解决方案:聚倍半硅氧烷接枝聚合物具有由式(1)表示的重复单元(A是键; R 1是可被取代的烃基; R 2 = SP>是H或1-18C烷基; R 3是极性基团或可被取代的芳基;(1),(m)和(n)各自为0或自然数 条件是(m)和(n)不能同时为0;并且k1,k2和k3各自为自然数)。 提供聚合物的制造方法。 此外,分别通过使用聚倍半硅氧烷接枝聚合物来提供压敏粘合剂和压敏粘合带。 版权所有(C)2005,JPO&NCIPI