专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2014165462A Semiconductor chip manufacturing method 审中-公开
标题翻译：半导体芯片制造方法
公开(公告)号：JP2014165462A
公开(公告)日：2014-09-08
申请号：JP2013037774
申请日：2013-02-27
申请人： Lintec Corp , リンテック株式会社
发明人： YONEYAMA HIROYUKI , ICHIKAWA ISAO , WAKAYAMA YOJI , AKUTSU TAKASHI
IPC分类号： H01L21/301 , H01L21/304
CPC分类号： H01L2224/10
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor chip manufacturing method which can prevent contamination of a chip and an adhesive film and obtain a semiconductor chip with an adhesive film in a simple method.SOLUTION: A semiconductor chip manufacturing method comprises: (a) a process of attaching a die bonding adhesive film to a circuit surface of a semiconductor wafer on which the circuit is formed on a surface; (b) a process of laminating an adhesive film and a surface protection sheet; (e) a process of making laser beams enter from a wafer rear face side to form a reformed region layer which is partitioned for each circuit on the wafer; (c) a process of grinding the rear face of the semiconductor wafer to singulate the wafer starting from the reformed region layer with respect to each circuit to obtain a group of divided chips; and (d) a process of singulating the adhesive film with respect to each chip by expanding the surface protection sheet to obtain chips each having the adhesive film on the circuit surface.
摘要翻译：要解决的问题：提供一种能够以简单的方法防止芯片和粘合剂膜的污染并获得具有粘合剂膜的半导体芯片的半导体芯片制造方法。解决方案：一种半导体芯片制造方法包括：（a）将芯片接合粘合剂膜附着到其上形成有电路的半导体晶片的电路表面的工艺; （b）层压粘合膜和表面保护片的工序; （e）使激光束从晶片背面侧进入的过程，形成为晶片上的每个电路划分的重整区域层; （c）研磨半导体晶片的背面以从重整区域开始相对于每个电路分割晶片以获得一组分割的芯片的工艺; 以及（d）通过使表面保护片发生膨胀来形成粘合膜相对于各个芯片的分割处理，得到在电路面上具有粘接膜的芯片。

2. 发明专利

JP2013120805A Adhesive sheet for wafer processing and method for processing semiconductor wafer using sheet 有权
标题翻译：用于加工的粘合片和使用薄片加工半导体波形的方法
公开(公告)号：JP2013120805A
公开(公告)日：2013-06-17
申请号：JP2011267306
申请日：2011-12-06
申请人： Lintec Corp , リンテック株式会社
发明人： TOMINAGA TOMOCHIKA , AKUTSU TAKASHI
IPC分类号： H01L21/304 , C09J7/02 , C09J201/02 , H01L21/301
摘要： PROBLEM TO BE SOLVED: To provide an adhesive sheet for wafer processing which satisfies characteristics such as (1) protection of a circuit surface having irregularities when ground by an adhesive force prevented from being excessively too small, (2) easy re-peeling after processing and (3) less adhesive matter residue on a wafer, and preferably used as a re-peeling type BG sheet or the like.SOLUTION: An adhesive sheet for wafer processing includes a base material, and an adhesive layer formed on the base material. The adhesive layer includes: an adhesive polymer (A); and polyrotaxane (B) in which straight-chain molecules penetrate through openings of at least two cyclic molecules and block groups are provided at both terminals of the straight-chain molecule. A crosslinked structure is formed by coupling the adhesive polymer (A) and the cyclic molecule of the polyrotaxane (B).
摘要翻译：解决问题的方案为了提供一种满足以下特征的晶片加工用粘合片，（1）通过防止过度接合的接合力而研磨时具有凹凸的电路面的保护，（2）加工后剥离，（3）晶片上的粘合剂残渣少，优选用作再剥离型BG片等。解决方案：用于晶片加工的粘合片包括基材和形成在基材上的粘合剂层。粘合剂层包括：粘合剂聚合物（A）; 和其中直链分子贯穿至少两个环状分子和嵌段基团的开口的聚轮烷（B）。通过使粘合剂聚合物（A）和聚轮烷（B）的环状分子结合而形成交联结构体。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2013077758A Base film and pressure-sensitive adhesive sheet with base film 有权
标题翻译：基膜和压敏粘合片与基膜
公开(公告)号：JP2013077758A
公开(公告)日：2013-04-25
申请号：JP2011217760
申请日：2011-09-30
申请人： Lintec Corp , リンテック株式会社
发明人： AKUTSU TAKASHI , TAMURA KAZUYUKI
IPC分类号： H01L21/304 , B32B27/00 , C09J7/02 , C09J201/00
摘要： PROBLEM TO BE SOLVED: To provide a base film of a pressure-sensitive adhesive sheet capable of suppressing dimpling and cracking of a wafer by dispersing grinding stress applied to a step on a wafer surface.SOLUTION: There is provided a base film 22 comprising (A) a step absorption layer which is 100-400 μm thick and has a storage elastic modulus of 0.2-6.0 MPa at 23°C and (B) a layer made of thermoplastic resin. In a reverse-surface grinding process in which a top-surface side of the wafer having a device region where a plurality of devices are sectioned with streets and an outer peripheral surplus region surrounding the device region is held on a holding table of a grinding device so as to form a recessed part by grinding a region 16 of a reverse surface of the wafer which corresponds to the device region and also to form a ring-shaped reinforcement part 17 on an outer peripheral side of the recessed part, the base film is used for the pressure-sensitive adhesive sheet stuck on the wafer surface.
摘要翻译：要解决的问题：提供一种能够通过将施加在台阶上的研磨应力分散在晶片表面上来抑制晶片的凹凸和破裂的压敏粘合片的基膜。解决方案：提供了一种基膜22，其包括（A）台阶吸收层，其厚度为100-400μm，在23℃下的储能弹性模量为0.2-6.0MPa，（B）由热塑性树脂。在其中具有多个器件被划分为街道的器件区域的晶片的顶表面侧和围绕器件区域的外周剩余区域的反面研磨工艺被保持在磨削装置的保持台上通过研磨晶片的与装置区域相对的面的区域16形成凹部，并且在凹部的外周侧形成环状的加强部17，基膜为用于粘贴在晶片表面上的压敏粘合片。版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2012196906A Base film, and pressure-sensitive adhesive sheet provided with the same 有权
标题翻译：基膜和压敏粘合片
公开(公告)号：JP2012196906A
公开(公告)日：2012-10-18
申请号：JP2011062947
申请日：2011-03-22
申请人： Lintec Corp , Arakawa Chem Ind Co Ltd , リンテック株式会社 , 荒川化学工業株式会社
发明人： TAMURA KAZUYUKI , AKUTSU TAKASHI , ETO YUKI , FUKUZAKI I
IPC分类号： B32B27/16 , C08G18/67 , C09J7/02 , H01L21/304
CPC分类号： C09J7/0296 , B32B27/36 , B32B2255/10 , B32B2255/26 , B32B2310/0831 , B32B2405/00 , C08G18/4825 , C08G18/672 , C08G18/755 , C08G18/8029 , C08G2170/40 , C09J7/0282 , C09J7/25 , C09J7/29 , C09J175/16 , C09J2203/326 , C09J2475/006 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , Y10T428/2809 , Y10T428/31551 , C08G18/48
摘要： PROBLEM TO BE SOLVED: To provide a base film and a pressure-sensitive adhesive sheet provided with the base film which protects a circuit surface of a bump-bearing wafer by using a surface protective sheet, at the same time, prevents bumps on the circuit surface from being crushed when grinding the rear surface and, moreover, suppresses the formation of dimples and cracks on the ground surface.SOLUTION: The base film is a base film for the pressure-sensitive adhesive sheet to be bonded to a semiconductor wafer and is composed of: a layer (A) made of a cured material prepared by curing a formulation containing a polyether polyol urethane (meth)acrylate oligomer and an energy-ray curable monomer with energy rays; and a layer (B) made of a thermoplastic resin.
摘要翻译：要解决的问题：提供一种基膜和设置有基膜的压敏粘合片，其通过使用表面保护片保护凸起轴承晶片的电路表面，同时防止凸起在研磨后表面时在电路表面上被破碎，并且还抑制在地面上形成凹坑和裂纹。解决方案：基膜是用于粘合到半导体晶片的压敏粘合片的基膜，由以下组成：由固化物制成的层（A），该固化物通过固化含有聚醚多元醇氨基甲酸酯（甲基）丙烯酸酯低聚物和具有能量射线的能量射线固化性单体; 和由热塑性树脂制成的层（B）。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2008214368A Pressure-sensitive adhesive sheet 有权
标题翻译：压敏粘合片
公开(公告)号：JP2008214368A
公开(公告)日：2008-09-18
申请号：JP2007049282
申请日：2007-02-28
申请人： Lintec Corp , リンテック株式会社
发明人： AKUTSU TAKASHI , ITO MASAHARU , KANO KEIKO , TAKAHASHI KAZUHIRO
IPC分类号： C09J7/02 , C09J4/00 , C09J133/04 , C09J175/16 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To achieve a pressure-sensitive adhesive sheet having excellent adhesive strength, following properties to unevennesses for a wafer circuit surface etc., and capable of preventing penetration of grinding water, etc., into the wafer circuit surface during grinding without producing residues of a pressure-sensitive adhesive.
SOLUTION: The pressure-sensitive adhesive sheet comprises a substrate and an energy ray curing type pressure-sensitive adhesive layer formed on the surface of the substrate. In the energy ray curing type pressure-sensitive adhesive layer, an energy ray curing type acrylic copolymer using highly polar 2-acetoxyethyl methacrylate without adversely affecting a polymerization reaction etc., as a monomer and a highly polar energy ray curing type urethane acrylate oligomer are used in combination thereof. Thereby, the sheet has the excellent following performances to the unevennesses for the wafer circuit surface etc., and the excellent adhesive strength and is capable of preventing the penetration of the grinding water etc., into the wafer circuit surface during grinding without causing a kerf shift and without producing the residues of the pressure-sensitive adhesive.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了获得具有优异的粘合强度的粘合片，对于晶片电路表面等的不均匀性具有以下特性，并且能够防止研磨水等渗入晶片电路表面在研磨时不产生压敏粘合剂的残留物。解决方案：压敏粘合片包括基材和形成在基材表面上的能量射线固化型压敏粘合剂层。在能量射线固化型粘合剂层中，作为单体和高极性能量射线固化型氨基甲酸酯丙烯酸酯低聚物的使用高极性2-乙酰氧基乙基甲基丙烯酸酯而不会影响聚合反应等的能量射线固化型丙烯酸共聚物是其组合使用。因此，该片材对于晶片电路表面等的不均匀性以及优异的粘合强度具有优异的以下性能，并且能够在研磨期间防止研磨水等渗入晶片电路表面而不引起切口并且不产生压敏粘合剂的残留物。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2013136690A Adhesive sheet for processing plate-like member 有权
标题翻译：用于处理类似板材的粘合片
公开(公告)号：JP2013136690A
公开(公告)日：2013-07-11
申请号：JP2011288689
申请日：2011-12-28
申请人： Lintec Corp , リンテック株式会社
发明人： TOMINAGA TOMOCHIKA , AKUTSU TAKASHI
IPC分类号： C09J7/02 , B32B27/00 , C09J11/08 , C09J175/04 , C09J201/02 , H01L21/304 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide an adhesive sheet for processing a plate-like member, suitable as a removable BG sheet in which an adhesive layer can absorb projections and the generation of a residue of the adhesive layer can be suppressed, even when having projections such as bumps on a surface to which a wafer is adhered, without complicating a production step.SOLUTION: The adhesive sheet for processing a plate-like member includes: a base; and an adhesive layer formed on one surface thereof, wherein the adhesive layer has a thickness of 100 to 300 μm, the adhesive layer is prepared by forming a crosslinked structure in which a specific adhesive polymer (A) and polyrotaxane (B) are bound through a crosslinking agent (C), the adhesive polymer (A) and the polyrotaxane (B) have the same reactive functional group, and assuming that the number of reactive functional groups included in the adhesive polymer (A) is 1, the relative ratio α of the number of reactive functional groups included in the polyrotaxane (B) and the relative ratio β of the number of crosslinkable groups included in the crosslinking agent (C) satisfy the relationship of 1+α-β≤0.8.
摘要翻译：要解决的问题：为了提供一种用于加工板状构件的粘合片，适合作为其中粘合剂层可以吸收突起的可移除的BG片材，并且可以抑制粘合剂层残留物的产生，即使当具有突起例如在粘附有晶片的表面上的凸起，而不会使生产步骤复杂化。解决方案：用于处理板状构件的粘合片包括：基底; 以及在其一个表面上形成的粘合剂层，其中所述粘合剂层的厚度为100至300μm，所述粘合剂层通过形成其中结合有特定粘合聚合物（A）和聚轮烷（B）的交联结构而制备）交联剂（C），粘合性聚合物（A）和聚轮烷（B）具有相同的反应性官能团，假设粘合性聚合物（A）中包含的反应性官能团的数量为1，相对比例α 包括在聚轮烷（B）中的反应性官能团的数目和相对比率＆bgr; 包含在交联剂（C）中的可交联基团的数目满足1 +α-＆bgr;≤0.8的关系。

7. 发明专利

JP2012199406A Substrate film and adhesive sheet including the same 有权
标题翻译：基片和粘合片包括它
公开(公告)号：JP2012199406A
公开(公告)日：2012-10-18
申请号：JP2011062942
申请日：2011-03-22
申请人： Lintec Corp , Arakawa Chem Ind Co Ltd , リンテック株式会社 , 荒川化学工業株式会社
发明人： TAMURA KAZUYUKI , AKUTSU TAKASHI , ETO YUKI , FUKUZAKI I
IPC分类号： H01L21/304 , C09J7/02
CPC分类号： H01L24/29 , C09J7/25 , C09J7/385 , C09J2203/326 , C09J2475/006 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , H01L2924/12042 , Y10T428/2848 , Y10T428/31551 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To protect a circuit surface of a bumped wafer using a surface protective sheet, prevents collapse of bumps on the circuit surface during grinding of a back surface, and suppresses occurence of dimples and cracks on a grinding surface.SOLUTION: A substrate film according to the present invention, which is a substrate film of an adhesive sheet attached to a semiconductor wafer, comprises: (A) a layer formed of a hardener obtained by hardening a composition containing an urethane (meth)acrylate oligomer and a thiol group-containing compound with an energy line; and (B) a layer formed of a thermoplastic resin.
摘要翻译：要解决的问题：为了使用表面保护片保护凸起的晶片的电路表面，防止在后表面研磨期间电路表面上的凸块的塌陷，并且抑制研磨表面上的凹坑和裂纹的发生。＆lt; P＆gt;解决方案：作为安装在半导体晶片上的粘合片的基材膜的本发明的基材薄膜，包括：（A）由硬化剂形成的层，所述硬化剂是将含有氨基甲酸酯（甲基））丙烯酸酯低聚物和含硫醇基的化合物与能量线; 和（B）由热塑性树脂形成的层。版权所有（C）2013，JPO＆INPIT

8. 发明专利

JP2013159692A Sheet and self-adhesive sheet obtained by using the same 有权
标题翻译：使用它的薄片和自粘胶片
公开(公告)号：JP2013159692A
公开(公告)日：2013-08-19
申请号：JP2012022384
申请日：2012-02-03
申请人： Lintec Corp , リンテック株式会社 , Arakawa Chem Ind Co Ltd , 荒川化学工業株式会社
发明人： TAMURA KAZUYUKI , AKUTSU TAKASHI , ETO YUKI , FUKUZAKI I
IPC分类号： C08F299/06 , B32B7/12 , C09J7/02
摘要： PROBLEM TO BE SOLVED: To provide a sheet obtained by curing an energy ray-curable composition containing urethane acrylate oligomers and a compound having a thiol group in one molecule thereof, to provide a self-adhesive sheet obtained by using the sheet as a constituent layer, and to improve preservation stability of raw materials of the sheet.SOLUTION: The sheet comprises a cured product obtained by curing a blended product, which contains urethane (meth)acrylate oligomers, the compound having the thiol group in one molecule thereof and an N-nitrosoamine-based polymerization inhibitor and/or an N-oxyl compound-based polymerization inhibitor, by using an energy ray.
摘要翻译：要解决的问题：提供通过使含有氨基甲酸酯丙烯酸酯低聚物的能量射线固化性组合物和其一分子中具有硫醇基的化合物固化而获得的片材，以提供通过使用该片材作为构成层获得的自粘片材，并提高片材原料的保存稳定性。解决方案：片材包含通过固化含有氨基甲酸酯（甲基）丙烯酸酯低聚物的共混产物得到的固化产物，其一分子中具有硫醇基的化合物和N - 亚硝基三胺系聚合抑制剂和/或N-氧基化合物系聚合抑制剂。

9. 发明专利

JP2009231491A Base film for adhesive sheet, and adhesive sheet 有权
标题翻译：粘合片基片和胶粘剂片
公开(公告)号：JP2009231491A
公开(公告)日：2009-10-08
申请号：JP2008074196
申请日：2008-03-21
申请人： Lintec Corp , リンテック株式会社
发明人： AKUTSU TAKASHI , FUJIMOTO YASUSHI , YAMAZAKI OSAMU
IPC分类号： H01L21/02 , B32B27/00 , B32B27/18 , B32B27/30 , C09J7/02
摘要： PROBLEM TO BE SOLVED: To provide a base film for an adhesive sheet and an adhesive sheet which enable grinding a wafer to a wafer with an extremely small thickness while preventing bending of the wafer, and prevent the development of air bubbles due to heat resulting from grinding.
SOLUTION: The base film for the adhesive sheet is made of an urethane acrylate oligomer and an energy-rays copolymerizing monomer. An acrylic ester compound not containing a hydroxyl group is used as the energy-rays copolymerizing monomer. This prevents the infiltration of moisture into the base film, thus prevents development of air bubbles when the adhesive sheet is heated. Use of the energy-rays copolymerizing monomer having a bulky molecule structure improves a stress relaxation property of the base film.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够在防止晶片弯曲的同时将晶片研磨到具有极小厚度的晶片的粘合片和粘合片的基膜，并且防止由于研磨产生的热量。解决方案：用于粘合片的基膜由氨基甲酸酯丙烯酸酯低聚物和能量线共聚单体制成。使用不含羟基的丙烯酸酯化合物作为能量线共聚单体。这防止了水分渗透到基膜中，从而防止当粘合片被加热时气泡的展开。使用具有大体积分子结构的能量线共聚单体提高了基膜的应力松弛性能。版权所有（C）2010，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式