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31. 发明专利

JP4446300B2 Fifth harmonic generation device 有权
公开(公告)号：JP4446300B2
公开(公告)日：2010-04-07
申请号：JP2003382935
申请日：2003-11-12
申请人：サイバーレーザー株式会社
发明人：純佐久間 , 雄一淺川
IPC分类号： G02F1/37 , H01S3/109

32. 发明专利

JP2009034691A Laser marking apparatus and its method 审中-公开
标题翻译：激光标记装置及其方法
公开(公告)号：JP2009034691A
公开(公告)日：2009-02-19
申请号：JP2007198785
申请日：2007-07-31
申请人： Cyber Laser Kk , サイバーレーザー株式会社
发明人： KAMATA MASANAO , SUMIYOSHI SATOMI , SEKIDA HITOSHI
IPC分类号： B23K26/00
摘要： PROBLEM TO BE SOLVED: To provide a laser marking method and its apparatus for marking patterns having microperiodic surface characteristics.
SOLUTION: In the laser marking apparatus and the laser marking method for laser marking the patterns of figures and characters by changing the surface characteristics by irradiating the surface of an object with a laser beam when the structure of microsurface characteristics within the patterns is irradiated with a very short pulse laser beam having a pulse width of 100 ps or less and a wavelength of 1.1 μm or less with a fluence of 0.01 to 10 J/cm
2 , laser beam parameters, such as polarization direction, wavelength, power, are controlled, and nanoperiod microsurface characteristics having a periodic structure of 1 μm or less is formed.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于标记具有微周期表面特性的图案的激光打标方法及其装置。解决方案：在激光打标设备和激光打标方法中，通过在图案中的微表面特征的结构是通过用激光束照射物体的表面来改变表面特性来激光标记图形和字符的图案用脉冲宽度为100ps以下且波长为1.1μm以下的非常短的脉冲激光束以0.01〜10J / cm 2的浓度照射激光束参数，例如偏振方向，波长，功率，并且形成具有1μm以下的周期性结构的纳秒微表面特性。版权所有（C）2009，JPO＆INPIT

33. 发明专利

JP4226851B2 Non-linear optical crystal element and coherent light generator 有权
公开(公告)号：JP4226851B2
公开(公告)日：2009-02-18
申请号：JP2002206317
申请日：2002-07-15
申请人：サイバーレーザー株式会社
发明人：純佐久間 , 雄一浅川
IPC分类号： G02F1/39 , G02F1/35
CPC分类号： G02F1/3501 , G02F1/3534 , G02F1/39 , G02F2203/15

34. 发明专利

JP2006305580A Method for cutting-off wire material, and method for re-forming end face of wire material 审中-公开
标题翻译：切割丝材料的方法以及重新形成线材末端的方法
公开(公告)号：JP2006305580A
公开(公告)日：2006-11-09
申请号：JP2005128183
申请日：2005-04-26
申请人： Cyber Laser Kk , Hikari Physics Kenkyusho:Kk , Univ Kinki , サイバーレーザー株式会社 , 学校法人近畿大学 , 株式会社光フィジクス研究所
发明人： OKUNO MASAFUMI , TSUGITA HIROSHI , WATABE AKIRA , SUMIYOSHI SATOMI , YOSHIDA MINORU
IPC分类号： B23K26/38 , B23K26/12 , B23K26/14 , B23K26/40 , G02B6/00 , G02B6/032
摘要： PROBLEM TO BE SOLVED: To form a flat end face of the cut-off end face produced by cutting-off a wire material, such as photonic crystal fiber (PCF), and further to achieve an excellent optical property by preventing polishing abrasive grains from intruding into pores exposed on the end face. SOLUTION: The wire material is cut off along a locus of a machining spot caused by a converged light point by forming the converged light point of a femto second laser beam on the surface portion or the inside of the wire material, such as PCF, along a required scanning path. Further, the end face of the wire material is smoothed by irradiating the end face with the femto second laser beam. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了形成通过切断诸如光子晶体纤维（PCF）的线材制造的切断端面的平坦端面，并且还通过防止抛光来获得优异的光学性能磨粒侵入到暴露在端面上的孔中。解决方案：通过在线材的表面部分或内部形成毫微微第二激光束的会聚光点，由会聚光点引起的线材的轨迹被切断，例如 PCF沿着所需的扫描路径。此外，通过用毫微微第二激光束照射端面来平滑线材的端面。版权所有（C）2007，JPO＆INPIT

35. 发明专利

JP2006289443A Laser beam machining device 审中-公开
标题翻译：激光加工设备
公开(公告)号：JP2006289443A
公开(公告)日：2006-10-26
申请号：JP2005114024
申请日：2005-04-11
申请人： Cyber Laser Kk , Hikari Physics Kenkyusho:Kk , サイバーレーザー株式会社 , 株式会社光フィジクス研究所
发明人： OKUNO MASAFUMI , WATABE AKIRA
IPC分类号： B23K26/04 , B23K26/067 , H01S3/00
摘要： PROBLEM TO BE SOLVED: To provide a laser beam machining device capable of securing stability of the optical axis of a laser beam and dealing with machining accuracy not more than a nanometer unit by arranging a position detector for monitoring the position of the optical axis of a laser beam and by correcting deviation of the optical axis of a laser beam to be emitted to a workpiece. SOLUTION: This laser beam machining device 1 is equipped with: a light source 2 for outputting a laser beam; an optical path adjusting part 4 for adjusting the optical path of the laser beam; a first spectroscope 8 for separating the laser beam into spectral components; a movable base 6 having a prescribed movable area and a place for putting on a workpiece 11; a movable base position detector 12 for detecting the position of the movable base; a first optical axis position detector 10 for detecting the optical axis of the spectral laser beam; a stage 7 on which the movable base, the movable base position detector and the first optical axis position detector are placed; and an optical axis controller 5 which receives an output from the first optical axis position detector to control the optical path adjusting part and to adjust the optical axis of the spectral laser beam. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够确保激光束的光轴的稳定性并且通过布置用于监视光学器件的位置的位置检测器来处理不超过纳米单位的加工精度的激光束加工装置并且通过校正要发射到工件的激光束的光轴的偏差。解决方案：该激光束加工装置1配备有：用于输出激光束的光源2; 用于调整激光束的光路的光路调整部4; 用于将激光束分离成光谱分量的第一分光器8; 具有规定的可移动区域的可移动基座6和放置在工件11上的位置; 用于检测可移动基座的位置的可动基座位置检测器12; 用于检测光谱激光束的光轴的第一光轴位置检测器10; 放置有可动基座，可动基座位置检测器和第一光轴位置检测器的平台7; 以及光轴控制器5，其接收来自第一光轴位置检测器的输出，以控制光路调节部分并调节光谱激光束的光轴。版权所有（C）2007，JPO＆INPIT

36. 发明专利

JP2006039166A Spatial phase modulator having elastic deforming part for inclination control 审中-公开
标题翻译：具有弹性变形部分的空间相位调制器进行控制
公开(公告)号：JP2006039166A
公开(公告)日：2006-02-09
申请号：JP2004218286
申请日：2004-07-27
申请人： Cyber Laser Kk , サイバーレーザー株式会社
发明人： NAKAMURA ARATA , TAMEGAI MASASHI , TAKASAGO KAZUYA
IPC分类号： G02B26/06 , G02B27/00
摘要： PROBLEM TO BE SOLVED: To contrive miniaturization, stable performance and cost reduction of a spatial phase modulator for short pulse laser.
SOLUTION: This is the wide band spatial phase modulator which is provided with a plurality of parallel plates composed of an optically transmissive material, a holding means for arraying the parallel plates in a freely spatially movable state, and a tilting means for changing the inclination of the parallel plates. The comprising parallel plates are made up of an optically transmissive material having a transparent laser beam-transmitting material. As the tilting means for changing the inclination of the parallel plates, the parallel plates are supported by a member that tends to be more elastically deformable than a light transmitting optical path section, with the part in question elastically deformed by an actuator.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了实现短脉冲激光器的空间相位调制器的小型化，稳定的性能和降低成本。解决方案：这是宽带空间相位调制器，其设置有由透光材料组成的多个平行板，用于在可自由空间移动的状态下排列平行板的保持装置和用于改变平行板的倾斜度。所述平行板由具有透明激光束透射材料的透光材料构成。作为用于改变平行板的倾斜的倾斜装置，平行板由比透光光路部分更易弹性变形的部件支撑，所述部分由致动器弹性变形。版权所有（C）2006，JPO＆NCIPI

37. 发明专利

JP2006035710A Glass processing method using laser and device 审中-公开
标题翻译：使用激光和器件的玻璃加工方法
公开(公告)号：JP2006035710A
公开(公告)日：2006-02-09
申请号：JP2004220922
申请日：2004-07-28
申请人： Cyber Laser Kk , サイバーレーザー株式会社
发明人： SUMIYOSHI SATOMI
IPC分类号： B28D5/00 , B23K26/00 , C03B33/09
摘要： PROBLEM TO BE SOLVED: To provide a laser cutting method for cutting a glass for enabling improvement of processing precision and processing speed, in which a first laser is cast along a cutting line for modification by using very high frequency pulse laser and a second laser is cast to a modified part for cutting. SOLUTION: In the cutting and processing method of glass, a crack is generated by a heat source using a processing start point provided on a work made of glass as a starting point, and the crack is extended along a planned cutting line. The first laser is irradiated to the processing start point so as to modify a glass main component of SiO 2 to Si or Si x O y, or to generate the modified part containing free radicals of B, Na, K, Ca, Zn, Al or Pb from at least one component of glass such as B 2 O 3 , Na 2 O, K 2 O, CaO, B 2 O 2 , ZnO, Al 2 O 3 , PbO or the like. The second laser is cast to the modified part so that the modified part absorbs light energy and discharges thermal stress energy resulting from local thermal expansion so as to cut the glass. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于切割玻璃以提高加工精度和加工速度的激光切割方法，其中通过使用非常高频的脉冲激光器沿着切割线铸造第一激光器以进行修改，并且第二个激光器被铸造到一个改进的零件进行切割。解决方案：在玻璃的切割和加工方法中，使用设置在由玻璃制成的工件上的加工起点作为起点，通过热源产生裂纹，并且裂缝沿着规划的切割线延伸。将第一激光照射到加工起点，以将SiO 2 的玻璃主成分改性为Si或Si X O 或者从玻璃的至少一种成分（例如B 2，S 3，S 3，B 3，...，S 3）制备含有B，Na，K，Ca，Zn，Al或Pb自由基的改性部分，，Na 2，K，SB，O，CaO，B，SB，SO 2，SB， 2 O 3，SBO 3，PbO等。将第二激光器投射到改性部分，使得改性部分吸收光能并释放由局部热膨胀产生的热应力能量以切割玻璃。版权所有（C）2006，JPO＆NCIPI

38. 发明专利

JP2005305462A Method and apparatus for breaking object by laser beam 审中-公开
标题翻译：用于激光束击穿目标的方法和装置
公开(公告)号：JP2005305462A
公开(公告)日：2005-11-04
申请号：JP2004122256
申请日：2004-04-16
申请人： Cyber Laser Kk , サイバーレーザー株式会社
发明人： SEKIDA HITOSHI
IPC分类号： B26F3/16 , B23K26/00 , B23K26/40 , B28D5/00 , C03B33/09
CPC分类号： B23K26/0057
摘要： PROBLEM TO BE SOLVED: To provide a method and apparatus which can accurately break or cut an object composed of a material transparent or translucent with respect to a laser beam. SOLUTION: This is a method to help breaking of the object transparent or translucent with respect to a laser beam. In this method, a physical or chemical change is caused inside the object by irradiating it with a laser beam and specifying the breaking position of the object as well as reducing the breaking resistance of the object at that breaking position. The laser beam may be a femtosecond pulsed laser beam. By the irradiation of the laser beam, there is continuously or intermittently caused physical or chemical change along the surface inside the object. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够精确地打破或切割由相对于激光束透明或半透明的材料构成的物体的方法和装置。
解决方案：这是一种有助于破坏物体相对于激光束透明或半透明的方法。在这种方法中，通过用激光束照射物体并且指定物体的断裂位置以及降低该断裂位置处的物体的抗断裂性，在物体内产生物理或化学变化。激光束可以是飞秒脉冲激光束。通过激光束的照射，沿着物体内的表面连续地或间断地引起物理或化学变化。版权所有（C）2006，JPO＆NCIPI

39. 发明专利

JP2005079084A Ionization device mounting infrared-ray light source 审中-公开
标题翻译：离子装置安装红外光源
公开(公告)号：JP2005079084A
公开(公告)日：2005-03-24
申请号：JP2003347598
申请日：2003-08-29
申请人： Cyber Laser Kk , サイバーレーザー株式会社
发明人： SUMIYOSHI SATOMI , TAKADA YASUTOSHI
IPC分类号： G01N27/64 , H01J49/16
摘要： PROBLEM TO BE SOLVED: To provide an ionization device quickly and efficiently ionizing an object substance for the analysis of a trace chemical substance.
SOLUTION: A light source capable of continuously changing a wave length at 1.3 μm or longer is constructed by an OPO having an excitation source of an LD excitation solid laser, and the light source is mounted on the ionization device. There exist PPLN, PPLT, PPSLN, PPSLT or the like as wave length conversion elements, and it is effective to dope MgO for avoiding photorefractive damage. Unprecedented high speed ionization is made possible by making an OPO output pulse follow, by operating the LD excitation solid laser with high repetition. Various materials can be ionized by changing a wave length in compliance with absorption spectrum characteristics of a sample material.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供离子化装置快速有效地电离目标物质以分析痕量化学物质。解决方案：通过具有LD激光固体激光器的激发源的OPO构成能够连续地改变1.3μm以上的波长的光源，并且将光源安装在电离装置上。存在PPLN，PPLT，PPSLN，PPSLT等作为波长转换元件，并且有效地掺杂MgO以避免光折射损伤。通过以高重复的方式操作LD激光固体激光器，通过使OPO输出脉冲跟随，可以实现前所未有的高速电离。可以通过根据样品材料的吸收光谱特性改变波长来离子化各种材料。版权所有（C）2005，JPO＆NCIPI

40. 发明专利

JP2017148829A 超短パルスレーザー加工装置审中-公开
公开(公告)号：JP2017148829A
公开(公告)日：2017-08-31
申请号：JP2016032633
申请日：2016-02-24
申请人：サイバーレーザー株式会社
发明人：田原大和 , 門澤拓也 , 石井恭 , 住吉哲実 , 伊東明美
IPC分类号： B23K26/067 , B23K26/03 , B23K26/00 , B23K26/08 , B23K26/382 , F02F5/00 , B23K26/352
摘要：【課題】高速加工のためにビーム分岐をして或る加工領域を同時加工する際に必ずしも各加工点と集光レンズからの距離が一定にならない状態であっても、高精度、高効率、任意のパターン形成ができるようにした超短パルスレーザー加工装置を提供すること。【解決手段】シードレーザーと再生増幅器からなる超短パルスレーザー光源装置と、超短パルス光を開閉する高速シャッターと、超短パルス光を複数のビームに分岐するビーム分岐手段と、ビーム走査手段と、集光レンズと、被加工物を保持し三次元の並進動作および回転動作をする走査手段と、被加工物の加工面の特性を加工前または加工中に観測するビジョン手段とを備えたこと。【選択図】図1

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