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1. 发明专利

JP2010066020A Optical surface inspecting device 审中-公开
标题翻译：光学表面检测装置
公开(公告)号：JP2010066020A
公开(公告)日：2010-03-25
申请号：JP2008230095
申请日：2008-09-08
申请人： Hikari Physics Kenkyusho:Kk , 株式会社光フィジクス研究所
发明人： OKUNO MASAFUMI , WATABE AKIRA , KUNIMOTO TAKASHI , TSUGITA HIROSHI , NOSE HIDETOSHI , KOJIMA TAKANORI
IPC分类号： G01N21/95 , G01B11/24 , G01N21/956 , G11B5/84 , G11B7/26
摘要： PROBLEM TO BE SOLVED: To solve a problem wherein, in a method for inspecting a substrate having an optical surface, since a method for properly inspecting the surface of a substrate especially duplicated from a primary standard or master is not developed, the mass production of a highly densified recording medium or optical element is delayed.
SOLUTION: By constructing a Michelson interferometer or Mach-Zehnder interferometer constituted so that the primary standard or master and the substrate duplicated from the same may serve respectively as reflecting mirrors, the light containing phase data reflected from the primary standard or master and the light reflected from an inspection target interfere with each other to observe an interference fringe. By analyzing the interference fringe, the difference between the specific optical structure possessed by the surface of the primary standard or master, and the surface structure of the inspection target is observed and the surface state of the inspection target is detected.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题为了解决在用于检查具有光学表面的基板的方法中的问题，由于没有发展用于正确地检查由主要标准或主机重复的基板的表面的方法，所以，高密度记录介质或光学元件的批量生产被延迟。解决方案：通过构建迈克尔逊干涉仪或马赫 - 策德尔干涉仪，使得主要标准或主机和从其复制的基板可以分别用作反射镜，包含从主要标准或主机反射的相位数据的光和从检查对象反射的光线相互干涉，观察干涉条纹。通过分析干涉条纹，可以观察到主要标准或母板的表面所具有的特定光学结构与检查对象的表面结构之间的差异，并检测检查对象的表面状态。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2009297719A Laser working apparatus and method for capillary 审中-公开
标题翻译：激光工作装置和毛细管法
公开(公告)号：JP2009297719A
公开(公告)日：2009-12-24
申请号：JP2006270731
申请日：2006-10-02
申请人： Cyber Laser Kk , Hikari Physics Kenkyusho:Kk , サイバーレーザー株式会社 , 株式会社光フィジクス研究所
发明人： OKUNO MASAFUMI , TSUGITA HIROSHI , WATABE AKIRA , SUMIYOSHI SATOMI
IPC分类号： A61F2/91 , A61M29/02 , B23K26/00 , B23K26/067 , B23K26/08 , B23K26/12 , B23K101/06
CPC分类号： C03B33/0855 , A61F2/91 , B23K26/0006 , B23K26/0066 , B23K26/0624 , B23K26/067 , B23K26/0823 , B23K2203/50 , C03B33/04
摘要： PROBLEM TO BE SOLVED: To provide a capillary working apparatus and a working method using a femto-second laser. SOLUTION: The laser working apparatus includes a femto-second laser device, a chuck having a rotating axis, and an optical system having a beam splitter and a reflecting mirror. A workpiece is installed on the rotating axis of the chuck. One laser beam of a femto-second is split into a plurality of beams by the optical system, the split individual femto-second laser beams is irradiated on the workpiece by the reflecting mirror and moved in a direction parallel to the rotating axis by rotating the chuck; thus, the laser working operation is performed by the apparatus. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种使用毫微微秒激光的毛细管工作装置和工作方法。解决方案：激光加工装置包括毫微微秒激光装置，具有旋转轴的卡盘和具有分束器和反射镜的光学系统。工件安装在卡盘的旋转轴上。毫微微秒的一个激光束通过光学系统被分割为多个光束，分离的单个毫微微秒激光束通过反射镜照射在工件上并通过旋转平行于旋转轴线的方向在平行于旋转轴线的方向上移动卡盘因此，通过该装置执行激光加工操作。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2006297458A Method for machining cutting tool and working apparatus using the same 审中-公开
标题翻译：用于加工切割工具和使用其的工作装置的方法
公开(公告)号：JP2006297458A
公开(公告)日：2006-11-02
申请号：JP2005124667
申请日：2005-04-22
申请人： Cyber Laser Kk , Hikari Physics Kenkyusho:Kk , サイバーレーザー株式会社 , 株式会社光フィジクス研究所
发明人： OKUNO MASAFUMI , TSUGITA HIROSHI , WATABE AKIRA
IPC分类号： B23K26/38 , B23K26/00 , B23K26/40 , H01L21/301
摘要： PROBLEM TO BE SOLVED: To provide a method for machining a material having a high hardness such as a diamond by means of femtosecond laser, and for manufacturing a cutting tool used to separate a semiconductor wafer into chips, and also to provide a method and an apparatus for cutting or separating a semiconductor wafer into chips using this cutting tool. SOLUTION: In this method for machining the cutting tool, a workpiece is fixed on a moving stage, the end of the workpiece is irradiated with femtosecond laser in such a manner that the optical axis of the laser beam is parallel to the vertical axis of the movable stage, and cutting is carried out in a circular-arc shape with a prescribed pitch to form a plurality of cutting blades in the end part. Further, grooves are formed by the cutting tool, and a semiconductor wafer is separated into chips on a deformable mount. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种通过飞秒激光来加工具有高硬度的材料例如金刚石的方法，并且用于制造用于将半导体晶片分成芯片的切割工具，并且还提供方法和使用该切割工具将半导体晶片切割或分离成芯片的装置。解决方案：在这种加工切削刀具的方法中，将工件固定在移动台上，以飞秒激光照射工件的端部，使激光束的光轴平行于垂直方向并且以规定间距进行圆弧形切割，以在端部形成多个切割刀片。此外，通过切割工具形成凹槽，并且将半导体晶片分离成可变形安装件上的切屑。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2006284427A Optical device having high rigidity structure 有权
标题翻译：具有高刚度结构的光学装置
公开(公告)号：JP2006284427A
公开(公告)日：2006-10-19
申请号：JP2005106129
申请日：2005-04-01
申请人： Cyber Laser Kk , Hikari Physics Kenkyusho:Kk , サイバーレーザー株式会社 , 株式会社光フィジクス研究所
发明人： OKUNO MASAFUMI , WATABE AKIRA , TSUGITA HIROSHI
IPC分类号： G01M11/04
摘要： PROBLEM TO BE SOLVED: To provide an optical structure of which the optical characteristic does not get out of order even under accelerating environment such as a robot arm.
SOLUTION: The optical device has an optical block loading an optical element and a box shape base unit for fixing the optical block. The box shape base unit has walls defining the space inside. Inside the region surrounded by the walls, at least one rib is provided. On the walls of the region formed by the rib and the walls, at least one opening is formed. By inserting the optical block in the opening, a light path is formed inside the box shape base unit. The tolerance of a contact surface between the base unit and the optical block of the optical device is within 0.01 to 0.005 mm.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供即使在诸如机器人手臂的加速环境下光学特性也不会失控的光学结构。解决方案：光学装置具有装载光学元件的光学块和用于固定光学块的盒形基座单元。盒形基座单元具有限定内部空间的壁。在由墙壁包围的区域内，提供至少一个肋。在由肋和壁形成的区域的壁上，形成至少一个开口。通过将光学块插入开口中，在盒形基座单元内形成光路。基片与光学元件的光学块之间的接触面的公差在0.01〜0.005mm的范围内。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2006049491A Principal pulse laser generator by pre-pulse removal 审中-公开
标题翻译：主动脉冲激光发生器通过预除脉冲去除
公开(公告)号：JP2006049491A
公开(公告)日：2006-02-16
申请号：JP2004226854
申请日：2004-08-03
申请人： Cyber Laser Kk , Hikari Physics Kenkyusho:Kk , サイバーレーザー株式会社 , 株式会社光フィジクス研究所
发明人： OKUNO MASAFUMI , WATABE AKIRA
IPC分类号： H01S3/20
摘要： PROBLEM TO BE SOLVED: To provide a method of removing pre-pulses effectively from the reason why as an output of a short pulse laser is increased, the occurrence of the pre-pulses of a low peak pulse incidental to principal pulses of a high peak output by a spontaneous light amplification action, etc. is found out in the prior part of the principal pulse, but this occurs coaxially with the principal pulses. SOLUTION: This method is materialized by such a device that a thin film shaped jet stream of a saturable pigment solution is formed by a nozzle. By passing the pulses in a direction of crossing a thin film in the thin film solution, only a pre-pulse part is selectively absorbed by the saturable pigment. As the thickness of the thin film is controlled in accordance with energy of the pre-pulse part, only the principal pulses can selectively be emitted in response to a degree of inclusion of the pre-pulses. Thus, it becomes possible to enhance a processing accuracy or a processing efficiency in a processing field of short pulses. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供从短脉冲激光器的输出增加的原因有效地去除预脉冲的方法，发生与主脉冲相关的低峰值脉冲的预脉冲的发生，在主脉冲的先前部分中发现了通过自发光放大作用的高峰值输出，但是这与主脉冲同轴地发生。解决方案：该方法通过这样的装置实现，即通过喷嘴形成可饱和颜料溶液的薄膜形喷射流。通过使脉冲在薄膜溶液中与薄膜交叉的方向通过，只有预脉冲部分被可饱和颜料选择性吸收。由于根据预脉冲部分的能量来控制薄膜的厚度，所以只有主脉冲可以响应于预脉冲的包含程度而被选择性地发射。因此，可以提高短脉冲的处理场中的处理精度或处理效率。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2005305470A Ultraviolet ray-assisted ultra short pulsed laser beam machining apparatus and method 审中-公开
标题翻译：超紫外线辅助超短脉冲激光束加工设备和方法
公开(公告)号：JP2005305470A
公开(公告)日：2005-11-04
申请号：JP2004122719
申请日：2004-04-19
申请人： Cyber Laser Kk , Hikari Physics Kenkyusho:Kk , サイバーレーザー株式会社 , 株式会社光フィジクス研究所
发明人： OKUNO MASAFUMI , WATABE AKIRA
IPC分类号： B23K26/06
CPC分类号： B23K26/0613 , B23K26/0624
摘要： PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus and method that make unique precision microfabrication possible at high speed by efficiently applying a ultra short pulsed laser beam to a workpiece.
SOLUTION: The laser beam machining apparatus works by possessing a machining head which is equipped with an optical system for guiding and converging the ultra short pulsed laser beam from a femtosecond laser oscillator 15 onto a machining point 30 of the workpiece 31 and also possessing a ultraviolet light source 22 which is for emitting the light near the machining point. The laser beam machining method includes an energy absorbing process in which two processes occur synchronously, namely, a ultraviolet electron exciting/absorbing process which excites to a higher level the valence band electron of an object to be irradiated with the ultraviolet ray and an absorbing process for a multi-photon which emits the ultra short pulsed laser beam to the object. Accordingly, the high precision and high-speed microfabrication by laser is implemented.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种激光束加工装置和方法，其通过有效地将超短脉冲激光束施加到工件来高速实现独特的精密微细加工。解决方案：激光束加工装置具有加工头，该加工头配备有用于将来自飞秒激光振荡器15的超短脉冲激光束引导和收敛到工件31的加工点30上的光学系统，并且还具有用于在加工点附近发射光的紫外光源22。激光束加工方法包括能量吸收过程，其中两个过程同步发生，即紫外线电子激发/吸收过程，其激发要用紫外线照射的物体的价带电子和吸收过程用于将超短脉冲激光束发射到物体的多光子。因此，实现了通过激光的高精度和高速微细加工。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2005221807A Wavelength converting apparatus 有权
标题翻译：波长转换装置
公开(公告)号：JP2005221807A
公开(公告)日：2005-08-18
申请号：JP2004030236
申请日：2004-02-06
申请人： Hikari Physics Kenkyusho:Kk , 株式会社光フィジクス研究所
发明人： OKUNO MASAFUMI , WATABE AKIRA
IPC分类号： G02F1/37 , G02F1/35
CPC分类号： G02F1/3544 , G02F2001/3546
摘要： PROBLEM TO BE SOLVED: To control a wavelength converting apparatus so as to always stably maintain the maximum energy conversion efficiency from objective light to converted light. SOLUTION: The apparatus includes a laser light source 10 to generate fundamental light waves; a nonlinear optical crystal 16 where the fundamental light waves enter to generate converted light; and an optical path controlling unit 30 to control the propagation direction of the fundamental light waves and the position of the fundamental light beam so as to input the fundamental light wave to the nonlinear optical crystal by satisfying the phase matching conditions. An electric signal 23 sent from a photodetector enters a control value calculating means 26, where a required controlled value in an controlling part of the optical path controlling unit is calculated by means of algorithm and fuzzy reasoning to output the result to an optical path controlling device 28. The optical path controlling device controls the optical path on the basis of the output signals 27 from the control value calculating means. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了控制波长转换装置，以便始终稳定地保持从目标光到转换光的最大能量转换效率。解决方案：该装置包括产生基本光波的激光光源10; 基本光波入射以产生转换光的非线性光学晶体16; 以及光路控制单元30，用于控制基波光的传播方向和基本光束的位置，以便通过满足相位匹配条件将基波光输入到非线性光学晶体。从光电检测器发送的电信号23进入控制值计算装置26，其中通过算法和模糊推理计算光路控制单元的控制部分中所需的控制值，以将结果输出到光路控制装置光路控制装置根据来自控制值计算装置的输出信号27控制光路。版权所有（C）2005，JPO＆NCIPI

8. 发明专利

JP4852256B2 The optical device having a high rigidity structure 有权
公开(公告)号：JP4852256B2
公开(公告)日：2012-01-11
申请号：JP2005106129
申请日：2005-04-01
申请人：サイバーレーザー株式会社 , 株式会社光フィジクス研究所
发明人：雅史奥野 , 浩次田 , 明渡部
IPC分类号： G02B7/00 , G01M11/04
摘要： PROBLEM TO BE SOLVED: To provide an optical structure of which the optical characteristic does not get out of order even under accelerating environment such as a robot arm. SOLUTION: The optical device has an optical block loading an optical element and a box shape base unit for fixing the optical block. The box shape base unit has walls defining the space inside. Inside the region surrounded by the walls, at least one rib is provided. On the walls of the region formed by the rib and the walls, at least one opening is formed. By inserting the optical block in the opening, a light path is formed inside the box shape base unit. The tolerance of a contact surface between the base unit and the optical block of the optical device is within 0.01 to 0.005 mm. COPYRIGHT: (C)2007,JPO&INPIT

9. 发明专利

JP2010151562A Far-infrared spectrometry apparatus 审中-公开
标题翻译：红外光谱仪器
公开(公告)号：JP2010151562A
公开(公告)日：2010-07-08
申请号：JP2008328955
申请日：2008-12-25
申请人： Hikari Physics Kenkyusho:Kk , 株式会社光フィジクス研究所
发明人： OKUNO MASAFUMI , WATABE AKIRA , TSUGITA HIROSHI , KUNIMOTO TAKASHI
IPC分类号： G01N21/3554 , G01N21/3586
摘要： PROBLEM TO BE SOLVED: To overcome the problem that an inspection of a mixture containing water and an aqueous solution possibly has an erroneous measurement at a pulse width of the degree of 100 femtoseconds, and the inspection is not correctly implemented although laser light having the pulse width is utilized for an electromagnetic wave generating light source in a terahertz spectroscopy. SOLUTION: A characteristic absorption band of water is spread over 0.4-10 THz. It is preferable to generate electromagnetic waves in the region so as to achieve a correct measurement in the inspection of the mixture containing the water and the aqueous solution. A titanium-sapphire laser having the adjustable pulse width from 10 femtoseconds to 50 femtoseconds is utilized for an excitation light source of terahertz electromagnetic waves. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题为了克服含有水和水溶液的混合物的检查在脉冲宽度为100飞秒时可能具有错误测量的问题，并且尽管激光不能正确地进行检查脉冲宽度用于太赫兹光谱学中的电磁波发生光源。解决方案：水的特征吸收带扩散在0.4-10 THz。优选在该区域中产生电磁波，以便在含有水和水溶液的混合物的检查中实现正确的测量。具有10飞秒到50飞秒的可调脉冲宽度的钛蓝宝石激光器用于太赫兹电磁波的激发光源。版权所有（C）2010，JPO＆INPIT

10. 发明专利

JP2009269084A Beam decentering optical system for laser beam machine 审中-公开
标题翻译：光束激光束光束光束系统
公开(公告)号：JP2009269084A
公开(公告)日：2009-11-19
申请号：JP2008148632
申请日：2008-05-08
申请人： Hikari Physics Kenkyusho:Kk , 株式会社光フィジクス研究所
发明人： OKUNO MASAFUMI , WATABE AKIRA , TSUGITA HIROSHI , NOSE HIDETOSHI
IPC分类号： B23K26/073 , B23K26/08 , B23K26/16
摘要： PROBLEM TO BE SOLVED: To provide a laser beam machine intended for microfabrication, which can bore a hole having an aspect ratio of 5 or more in a constant diameter and also can achieve boring of a non-through hole.
SOLUTION: In the laser beam machining, the non-through hole having a high aspect ratio is bored by technologies of decentering laser beams by making a positional relationship among the base point of decentering, the position of a condensing lens and the focal length of the condensing lens constant, and of eliminating off-scourings generated during laser beam machining.
COPYRIGHT: (C)2010,JPO&INPIT

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