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21. 发明专利

JP2001284229A ELECTRON BEAM DRAWING DEVICE AND METHOD 失效
公开(公告)号：JP2001284229A
公开(公告)日：2001-10-12
申请号：JP2000097109
申请日：2000-03-31
申请人： TOSHIBA CORP
发明人： KINOSHITA HIDETOSHI , HASHIMOTO SUSUMU , HAYASHI MASAKAZU , AKAMA YOSHIAKI
IPC分类号： G03F7/20 , H01J37/06 , H01J37/147 , H01J37/305 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide an electron beam drawing device and a method which are maintenance-free and capable of forming an optional pattern by each shot and drawing it on a specimen at a high speed without providing a stencil on which a cell pattern is previously formed in the optical path of an electron beam. SOLUTION: An electron beam drawing device for drawing a pattern on a specimen with an electron beam is equipped with an electron optical system composed of micro emitter-type electron guns (1), blanking control circuits which each control the discharge of an electron beam of the electron gun (1), an objective lens (3) which reduces the electron beam in size, and a deflector (4) which deflects the electron beam reduced by the objective lens (3) to a specimen (6).

22. 发明专利

JP2001244186A ELECTRON BEAM LITHOGRAPHY SYSTEM AND METHOD 失效
公开(公告)号：JP2001244186A
公开(公告)日：2001-09-07
申请号：JP2000055756
申请日：2000-03-01
申请人： TOSHIBA CORP
发明人： HASHIMOTO SUSUMU , KINOSHITA HIDETOSHI , ANDO KOJI , WAKAYAMA SHIGERU
IPC分类号： G03F7/20 , H01J37/153 , H01J37/305 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide an electron beam lithography system and a method, where influence of lens aberration can be removed, a larger deflection region can be ensured through a simple structure, dispensing with a pre-auxiliary deflector, and a drawn pattern can be kept high in resolution. SOLUTION: An electro-optical system comprises a primary deflection object lens (25), which reduces, deflects, and projects an electron beam onto a sample (13), a pre-main deflector (29) which controls and deflects the electron beam so as to reduce aberration in the above primary deflection object lens (25), and an auxiliary deflector 28 which adjusts the electron beam in deflection. The main deflector (29), the main deflection object lens (25), and the auxiliary deflector (28) are arranged in this sequence from the upper side of the electron beam, and the auxiliary deflector (28) is provided outside of the lens field of the main deflection main object lens (25).

23. 发明专利

JPH11111598A MACHINING METHOD, MATCHING DEVICE, AND ELECTRON BEAM DRAWING DEVICE 失效
公开(公告)号：JPH11111598A
公开(公告)日：1999-04-23
申请号：JP27114197
申请日：1997-10-03
申请人： TOSHIBA CORP
发明人： KINOSHITA HIDETOSHI , SUGIHARA KAZUYOSHI , OKUMURA KATSUYA , ANDO KOJI
IPC分类号： H01J37/16 , H01J37/305 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To improve machining accuracy by correcting the amount of relative fluctuation between the machining position of a machining body due to relative movement for the machining body of a body to be machined being machined by the matching body and the body to be machined. SOLUTION: Vibration from an external part during drawing allows the amount of the fluctuation of acceleration to be detected by an acceleration sensor 14 being mounted to a vacuum tank 13, allows it to be inputted to an acceleration detection control part 41a, allows an outer active damper 12 to be driven via a coordinates operation part 41b and an actuator control operation part 41c based on the amount of the fluctuation being obtained at part 41 for detecting the amount of the fluctuation, and allows the vibration of the vacuum tank 13 to be reduced. Displacement being generated by vibration due to the actuation of an XY stage 20 is obtained by detecting a reflection electron B' by a reflection electron detector 33. The signal is inputted into a control part 42a of a device for detecting the amount of the fluctuation, an inner active damper 21 is driven via a coordinates operation part 42b and an actuator control operation part 42c, and the relative vibration between a sample rest 22 and a semiconductor wafer W and an electron beam drawing part 30 is reduced.

24. 发明专利

JPH10335287A SUBSTRATE PROCESSING APPARATUS 失效
公开(公告)号：JPH10335287A
公开(公告)日：1998-12-18
申请号：JP14784097
申请日：1997-06-05
申请人： TOSHIBA CORP
发明人： INO TAKAO , KINOSHITA HIDETOSHI
IPC分类号： H01L21/683 , H01L21/304 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To satisfactorily prevent a substrate from floating, by a method wherein a spin head which is driven to rotate and mounted with the substrate and a clamp mechanism which holds the periphery of the substrate are provided. SOLUTION: A spin head 26 which is driven to rotate and hold a substrate 22 is provided to nearly the internal center of a processing chamber, and lateral holes 29 are provided to the spin head 26 so as to be adjacent to a substrate holder 28 formed on the upside of the spin head 26. The upper edge face of the lateral hole 29 is set to be flush with the upside of the spin head 26 so as to enable a chuck pawl 30 which functions as a clamp mechanism to prevent the substrate 22 from rising to be provided inside the lateral hole 29. By this setup, the substrate 22 can be well prevented from rising, the spin head 26 is restrained from changing in substrate holding force, and the substrate 22 can be protected against damage.

25. 发明专利

JPH07243834A METHOD AND DEVICE FOR TESTING ELECTRON BEAM 失效
公开(公告)号：JPH07243834A
公开(公告)日：1995-09-19
申请号：JP3114794
申请日：1994-03-01
申请人： TOSHIBA CORP
发明人： KANO MASAAKI , KINOSHITA HIDETOSHI , NISHIGAKI HISASHI , FUKUTOME YUJI , HASHIMOTO SUSUMU
IPC分类号： G01B15/00 , H01J37/28 , H01L21/027 , H01L21/66
摘要： PURPOSE:To improve an SN ratio and shorten the testing time by scanning a sample while the beam shape of an electron beam is formed rectangular and detecting generated charged particles thereafter. CONSTITUTION:Apertures 10 and 11 are both formed rectangular and electron beams directed from an electron gun 2 are formed rectangular through the aperture 10, further they are formed into long rectangular beams through the aperture 11. The beam is deflected by a deflector 6 and converged by an objective lens 7 for scanning a sample 15. The sample 15 generates secondary electrons and reflection electrons, which are detected by electron detectors 16-18, and respective electric signals depending upon the charged particle quantity are outputted. A calculation controlling part 20 processes these signals to obtain pattern widths on the basis of respective peaks of output waveforms. Thus, the multipled scanning operations of electron beam are not necessitated and the scanning is completed for a short time, thereby shortening the testing time and improving an SN ratio.

26. 发明专利

JPH03243293A BRAZING METHOD 失效
公开(公告)号：JPH03243293A
公开(公告)日：1991-10-30
申请号：JP3724490
申请日：1990-02-20
申请人： TOSHIBA CORP
发明人： KINOSHITA HIDETOSHI
IPC分类号： B23K1/19 , B23K33/00 , C04B37/00 , C04B37/02
摘要： PURPOSE:To make improvement in brazing workability by inserting and fixing a 2nd member into the insertion hole of a 1st member apart a clearance provided therebetween and packing a brazing material into the clearance, thereby brazing the members. CONSTITUTION:A fan blade 5 (2nd member) 6 is press-fitted (pressure spring) into the insertion hole 2 of a partition plate (1st member) 1 and both are fixed at points T1, T2 and T3 in the case of insertion of the 2nd member into this hole apart the clearance provided therebetween. The pasty brazing material is then packed into the clearance 8 and both are brazed by heating in a vacuum heating furnace; thereafter, the members are slowly cooled in a vacuum. The brazing is executed without using the assembly jigs to be exclusively used which are costly and difficult to handle. The improvement in working efficiency is thus made.

27. 发明专利

JPH03131460A SPHERE WORKING DEVICE 失效
公开(公告)号：JPH03131460A
公开(公告)日：1991-06-05
申请号：JP26576989
申请日：1989-10-12
申请人： TOSHIBA CORP
发明人： KINOSHITA HIDETOSHI , HASHIMOTO MASAHIRO
IPC分类号： B24B11/04
摘要： PURPOSE:To easily manufacture a sphere having good sphericity by providing an adjusting mechanism to adjust inclination and distance of a second roller against a par of first rollers. CONSTITUTION:The inclination theta2 of a second roller 2 against first rollers 1a, 1b on the plane making square with the arranged plane of the first rollers 1a, 1b is adjusted with an adjusting mechanism. Hereby, by appropriate adjusting cut-in against a sphere to be worked (w) and the other part gap between the first rollers 1a, 1b and the second roller 2, the sphere (w) is moved at a pre scribed speed from one end part side to the other end part side of the first and second rollers 1a,1b accompanying with adjustment of the inclination theta1, and the sphere of good sphericity worked in a prescribed diameter is automati cally taken out from the other end part.

28. 发明专利

JPS63185576A GRINDING WHEEL 失效
公开(公告)号：JPS63185576A
公开(公告)日：1988-08-01
申请号：JP1601387
申请日：1987-01-28
申请人： TOSHIBA CORP
发明人： KINOSHITA HIDETOSHI
IPC分类号： B24D7/00 , B24B11/06 , B24B13/00
摘要： PURPOSE:To markedly prolong the service life of a grindstone by preventing the breakage and the sharp abrasion of the grindstone by interposing a buffer member between a basic plate and a grindstone piece. CONSTITUTION:When a grinding wheel 1 is revolved in the direction of arrow 13 by a motor 10, a rough spherical body 14 made of sintered ceramics starts following revolution together with the grinding wheel 1, and pressed onto the rubber plate 17 side of the side plate 15 of a cylindrical body 2a by a centrifugal force, and is rolled on a grindstone piece 17. In this rolling, a part of the accumulated rough spherical body 14 collides with a grindstone piece 7, and an excessive impact force is applied onto the grindstone piece 7 by the collision. Then, almost all the impact force is absorbed by a buffer member 5 holding the grindstone piece 7, and the destruction and the sharp abrasion of the grindstone piece 7 can be prevented.

29. 发明专利

JPS63146444A CAPILLARY TIP 失效
公开(公告)号：JPS63146444A
公开(公告)日：1988-06-18
申请号：JP29253086
申请日：1986-12-10
申请人： TOSHIBA CORP
发明人： HASHIMOTO MASAHIRO , NAKADA JUNJI , KINOSHITA HIDETOSHI
IPC分类号： H01L21/60
摘要： PURPOSE:To reduce the bonding pad of an LSI by decreasing one side end of the tip to be wire bonded in outer diameter smaller than the other side end, and forming the minimum thickness of the one end 10mum or less, in a capillary tip. CONSTITUTION:A compression bonding member 4 is composed of a first tapered part 6 connected to a part 2 to be held, a second tapered part 7 for directly compressing a wire 3, and a rounded (R) part 8 formed on a boundary between the parts 6 and 7. The part 7 is formed smaller in diameter than the part 6. The minimum thickness of the tapered part 7 is 10mum or less. Then, even in wire bonding for pads at 150mum intervals or less, the tapered part 7 will not interfere the previously bonded wire. Thus, the bonding pad of an LSI can be reduced.

30. 发明专利

JPS6334062A SPHERICAL BODY WORKING DEVICE 失效
公开(公告)号：JPS6334062A
公开(公告)日：1988-02-13
申请号：JP17557486
申请日：1986-07-28
申请人： TOSHIBA CORP
发明人： KINOSHITA HIDETOSHI
IPC分类号： B24B11/02 , B24B37/025
摘要： PURPOSE:To execute the working for a spherical body with high precision and high efficiency by detecting the rotary driving load values as polishing pressure of a pair of board bodies for squeezing a workpiece and carrying out the servocontrol so that the squeezing pressure becomes a prescribed value. CONSTITUTION:A spherical body 1 is squeezed by an upper board 6 and a grinding machine 7, and the first and second rotary driving parts 12 and 14 are started, and the boards 6 and 7 are turned in the direction of arrows 10a and 10b, and a supporting part 16 is swung in the directions 18a and 18b by a feeding part 6. At the same time, polishing agent 4 is supplied to a worked part by a polishing agent feeding mechanism 5. While, in a polishing agent control part 23 which receives a load signal SL outputted from a load detecting part 22, the load value P represented by the signal SL and a set standard value P0 are compared, and the signal SC for obtaining a constant cutting quantity is always outputted into a motor 19 so that the both values accord and the difference DELTAP between the load values P and P0 becomes zero. Then, a rotary shaft 13 and the upper board 6 are pressed onto the spherical body 1, and when the difference DELTAP of the load values becomes zero similarly, the transmission of the signal SC is suspended, and the polishing pressure is kept constant during working, and the working with high precision and high efficiency is carried out.

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