专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2007258305A Electron-beam drawing device, electron-beam drawing method, and semiconductor device manufacturing method 审中-公开
标题翻译：电子束绘图装置，电子束绘图方法和半导体器件制造方法
公开(公告)号：JP2007258305A
公开(公告)日：2007-10-04
申请号：JP2006078189
申请日：2006-03-22
申请人： Toshiba Corp , 株式会社東芝
发明人： KINOSHITA HIDETOSHI
IPC分类号： H01L21/027 , G03F7/20 , H01J37/305
摘要： PROBLEM TO BE SOLVED: To provide an electron-beam drawing device that enables to obtain high throughput with simple control, an electron-beam drawing method, and a semiconductor device manufacturing method. SOLUTION: The electron-beam drawing device includes a plurality of micro-emitter electron guns 20 arranged into a half-array shape, a plurality of charge accumulators 10 respectively connected to each of the micro-emitter electron guns, a charge writing circuit capable of writing charges into the charge accumulators, and an electron optical system for emitting electron beams emitted from the micro-emitter electron guns to a body to be processed. The charge writing circuit accumulates charges into the charge accumulators corresponding to an electronic-beam pattern to be drawn. The electronic-beam pattern is emitted to a body to be irradiated by collectively emitting the electronic beams corresponding to a charge amount accumulated in each of the charge accumulators from the micro-emitter electron guns respectively connected to each of the charge accumulators. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种电子束拉制装置，其能够通过简单的控制获得高产量，电子束拉制方法和半导体器件制造方法。解决方案：电子束描绘装置包括排列成半阵列形状的多个微发射电子枪20，分别连接到每个微发射电子枪的多个电荷蓄积器10，电荷写入能够向电荷蓄积器写入电荷的电路，以及用于将从微发射电子枪发射的电子束发射到待处理体的电子光学系统。电荷写入电路根据要绘制的电子束图案将电荷累积到电荷累加器中。电子束图案通过从分别连接到每个电荷累加器的微发射电子枪共同发射对应于累积在每个电荷累加器中的电荷量的电子束来发射到被照射的物体。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2003163149A METHOD OF CONTROLLING ELECTRON BEAM EXPOSURE AND ELECTRON BEAM EXPOSURE APPARATUS 审中-公开
公开(公告)号：JP2003163149A
公开(公告)日：2003-06-06
申请号：JP2001360593
申请日：2001-11-27
申请人： TOSHIBA CORP
发明人： HASHIMOTO SUSUMU , KINOSHITA HIDETOSHI , ANDO KOJI , NAGANO OSAMU
IPC分类号： H01J37/12 , H01J37/153 , H01J37/305 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide a highly accurate method of controlling electron beam exposure where optical aberration or an electron beam shape dimensional error due to deflection is corrected, and its electron beam exposure apparatus. SOLUTION: When the electron beam 2 is made to perform exposure on an XY arbitrary deflection position, lens correction control voltage is added and applied to polar lenses (18, 19), and thus beam deflection control is performed. COPYRIGHT: (C)2003,JPO

3. 发明专利

JP2000090866A ELECTRON GUN, ELECTRON BEAM GENERATING METHOD BY ELECTRON GUN, AND EXPOSING DEVICE USING ELECTRON GUN 失效
公开(公告)号：JP2000090866A
公开(公告)日：2000-03-31
申请号：JP26315198
申请日：1998-09-17
申请人： TOSHIBA CORP
发明人： HAYASHI MASAKAZU , KINOSHITA HIDETOSHI , ANDO KOJI
IPC分类号： H01J37/06 , H01J37/073 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To enable the fine adjustment of the current angular density of the electron beam passing through an aperture for use by applying a magnetic field to the electron beam on a beam axis generated by a negative electrode inside of a vacuum container, and accelerating the beam with a positive electrode so as to form a passage so as to generate an electric field to be converged by an electron lens. SOLUTION: A magnetic pole unit 14 applies the magnetic field to the electron beam generated by an emitter 3 inside of a vacuum container, and an anode electrode 7 accelerates the beam in a beam axis 2 direction so as to form a passage. An electron lens electrode 6 converges the accelerated electron beam onto the beam axis 2 by generating the electric field, and the electron beam is emitted from a blanking aperture 8. A permanent magnet 10 and an electromagnetic coil 11 of the magnetic pole unit 14 are arranged in a closed space formed by an outside magnetic pole 12, an inside magnetic pole 13 and non-magnetic material 15a, 15a, and a tip of the magnetic pole is connected to an extractor electrode 5 through an insulating material 16. With this structure, the electron gun 1 is mounted and remarkably accurate processing of the fine patterns is realized.

4. 发明专利

JPH08162055A SCANNING ELECTRON MICROSCOPE 失效
公开(公告)号：JPH08162055A
公开(公告)日：1996-06-21
申请号：JP29660594
申请日：1994-11-30
申请人： TOSHIBA CORP
发明人： KINOSHITA HIDETOSHI
IPC分类号： G21K1/093 , H01J37/141 , H01J37/28
摘要： PURPOSE: To select a required contracting ratio of electron beam without enlarging a device. CONSTITUTION: When an electron beam E emitted from an electron gun 22 is converted and irradiates a sample 10, each permanent magnet 26a or 26b, 27a or 27b differed in contracting ratio to the electron beam E is selectively arranged on the advancing route of the electron beam E by each revolver replacing mechanism 26c, 27c, respectively. The electron beam E is converged by the selected contracting ratio and irradiates the sample 10, and the secondary electron generated from the sample 10 is detected to observe the enlarged image of the sample 10.

5. 发明专利

JPH0557603A SPHERICAL BODY POLISHING DEVICE 失效
公开(公告)号：JPH0557603A
公开(公告)日：1993-03-09
申请号：JP33496691
申请日：1991-12-18
申请人： TOSHIBA CORP
发明人： KINOSHITA HIDETOSHI , SATO EIJI
IPC分类号： B24B37/02
摘要： PURPOSE:To provide a polishing device with which spherical bodies can be accurately polished without generation of seizure against upper and lower level blocks. CONSTITUTION:This spherical body polishing device is provided with a lower level block 18 of which the boundary part for dividing itself into an inner ring 16 and an outer ring 17 includes a holding part 28 formed to rollably hold spherical bodies 29, a holding ring 19 and a repulsive ring 22 to hold the outer ring 17 in floating condition by magnetic force so as to be in a prescribed position against the inner ring 16, and an upper level block 31 which is arranged opposite to the lower level block 18 and presses the spherical bodies 29 held on the holding part 28.

6. 发明专利

JPH03121760A WORKING METHOD FOR SPHERICAL BODY 失效
公开(公告)号：JPH03121760A
公开(公告)日：1991-05-23
申请号：JP26134589
申请日：1989-10-06
申请人： TOSHIBA CORP
发明人： HASHIMOTO MASAHIRO , KINOSHITA HIDETOSHI
IPC分类号： B24B11/06
摘要： PURPOSE:To correct a rotating grinding wheel in process and to prevent the deterioration of the active face thereof, by working the spherical body to be worked in the limited area of a rolling contact with the relative rotating movement of a rotating grinding wheel and link like correction grinding wheel. CONSTITUTION:A link like correction grinding wheel 12 is placed on the active face 11 of a rotating wheel 11. The spherical body to be worked W is then stored inside this link like correction wheel 12, the rotating wheel 10 and correction grindstone 12 are subjected to a relative rotating movement and the spherical body W to be worked is worked in a rolling generation limited area while correcting the active face 11 of the rotating wheel 10 by the link like correction wheel 12.

7. 发明专利

JPH02270972A WIRE ETCHING DEVICE 失效
公开(公告)号：JPH02270972A
公开(公告)日：1990-11-06
申请号：JP5720889
申请日：1989-03-09
申请人： TOSHIBA CORP
发明人： KINOSHITA HIDETOSHI
IPC分类号： C23F1/08
摘要： PURPOSE:To etch a wire having an extremely small diameter to a desired taper shape with good reproducibility by providing means for tilting an arm mounted with a holder for a metallic wire and immersing the wire into an etching soln., then taking the wire out of the soln. CONSTITUTION:The arm 8 mounted to a revolving shaft 10 is tilted upward to crimp the metallic wire 17 to the holder 12 mounted to the rear surface of the arm 8 in the state of applying a prescribed tension to the metallic wire. The wire 17 part held to the holder 12 near the revolving shaft 10 is immersed first in the etching soln. 5 and finally the wire part 17 at the other end is immersed therein when the arm 8 is tilted downward by revolving a motor 9 backward. The wire 17 part held by the holder 8 further from the revolving shaft 10 is taken out of the etching soln. 5 when the arm 8 is tiled upward. The wire part 17 near the revolving shaft 10 is finally taken out. The tapered wire which is large in the diameter at the left end and is gradually decreased in the diameter toward the right end is obtd. in this way.

8. 发明专利

JPS63312808A MOLD FOR POWDER MOLDING 失效
公开(公告)号：JPS63312808A
公开(公告)日：1988-12-21
申请号：JP14904487
申请日：1987-06-17
申请人： TOSHIBA CORP
发明人： KINOSHITA HIDETOSHI
IPC分类号： B28B3/02
摘要： PURPOSE:To uniformize filling density, by press-molding powder along a guide channel on the inner wall face of a molding hold crossing to the axial direction and opening to the outside when the power filled in a cylindrical molding hole is compressed by means of punches. CONSTITUTION:A spiral guide channel 5 whose both ends are open to the outside with a molding hole 2 is engraved on the inner wall face of the molding hole 2. The cross-sectional face of this guide channel 5 is semispherical and the crest line is smoothly ground. The distance between upper and lower dead points of upper and lower punches 3 and 4 is 5 times or more of the outer diameters of the upper and lower punches. After fine ceramic powder 8 is filled in the molding hole 2, it is press-molded by means of the upper and lower punches 3 and 4 in the arrow mark directions 9 and 10 to the top and bottom dead points 6 and 9. Pressing operation is slided along the guide channel 5 and air in the molding hole 2 is well evacuated to form a uniform filling density over the whole range.

9. 发明专利

JPS63136539A CAPILLARY-CHIP 失效
公开(公告)号：JPS63136539A
公开(公告)日：1988-06-08
申请号：JP28075786
申请日：1986-11-27
申请人： TOSHIBA CORP
发明人： NAKADA JUNJI , HASHIMOTO MASAHIRO , KINOSHITA HIDETOSHI
IPC分类号： H01L21/607 , H01L21/60
摘要： PURPOSE:To improve the transmission efficiency of ultrasonic waves by forming an outer surface, to which at least ultrasonic vibrations are applied directly, under a satin state. CONSTITUTION:A tabular upper surface plate 18 is moved in the direction of the arrow 19 under the state in which a chip 1 is held and pressed at pressure such as 1-7kgf by a platform-shaped lower surface plate 17 and the upper surface plate 18 consisting of Si3N4, SiC, ZrO2, etc. Abrasives 20 in which powdered diamond abrasive grains are mxied in a pasty state are positioned previously onto the lower surface plate 17 at that time. The grain size of diamond abrasive grains is approximately decuple as large as desired roughness. Consequently, the chip 1 is rolled through abrasives 20 on the lower surface plate 17. Accordingly, an outer circumferential surface 16 is polished into a satin state by abrasives 20. The outer Circumferential surface 16 of a section to be held 3 is brought to the satin state in the chip 1, thus improving the transmission efficiency of ultrasonic waves through a bonding-arm 2.

10. 发明专利

JPH07306028A PATTERN INSPECTION DEVICE 失效
公开(公告)号：JPH07306028A
公开(公告)日：1995-11-21
申请号：JP9859294
申请日：1994-05-12
申请人： TOSHIBA CORP
发明人： NISHIGAKI HISASHI , NISHIMURA CHIKASUKE , HOSAI HIROAKI , KINOSHITA HIDETOSHI , FUKUTOME YUJI
IPC分类号： G01B15/00 , H01L21/66
摘要： PURPOSE:To accurately inspect a pattern defect according to the size of an inspection pattern by varying the diameter of an electron beam. CONSTITUTION:After electron beams applied from an electron gun 2 are formed into arbitrary beam shapes, the beams converged by reduction lenses 5 and 6 and further axial deviation is compensated and the beams are converged by objective lenses 9 and 10 and the images are formed on the surface of a sample 12, where the focus distances of the reduction lenses 5 and 6 and the objective lenses 9 and 10 are controlled.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式