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21. 发明专利

JPS5527356A MANUFACTURE OF PREPREG SHEET 失效
公开(公告)号：JPS5527356A
公开(公告)日：1980-02-27
申请号：JP10058678
申请日：1978-08-17
申请人： NITTO ELECTRIC IND CO
发明人： KAWAMOTO NORIO , TAJIRI KAZUHIRO , YAMAMOTO TAKU
IPC分类号： C08J5/24
摘要： PURPOSE:To obtain a prepreg sheet usable in the next stage favorably free from falling off of the resin in the cutting and transportation operations, having improved impregnation properties and heat resistance, by drying a slurry comprising a bisimide, a polyamine, and water applied to a fibrous substrate. CONSTITUTION:A fibrous substrate is coated with a slurry composition comprising (A) one equivalent of a bisimide of the formula (A is bifunctional organic group having an ethylenic double bond; B is bifunctional organic group having an aromatic nucleus), (B) 0.1-2 equivalents of a polyamine of the formula R(NH2)n (R is n-functional organic group having an aromatic nucleus; n is an integer 2- 5), and (C) water, and dried to give a prepreg sheet. Preferably, the substrate is dried by a method to heat the slurry composition and to make the drying proceed simultaneously, preferably heat radiation. The slurry has a viscosity of 1-200 poises, preferably 5-120 poises.

22. 发明专利

JPS54153837A COMPOSITE ADHESIVE SHEET AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JPS54153837A
公开(公告)日：1979-12-04
申请号：JP6204678
申请日：1978-05-23
申请人： NITTO ELECTRIC IND CO
发明人： KAWAMOTO NORIO , SHIMOKUBO KATSUFUMI , TAJIRI KAZUHIRO , KOJIMA MAKOTO
IPC分类号： C09J7/02 , B32B7/12 , B32B27/00 , C09J5/00 , C09J7/00
摘要： PURPOSE:To manufacture a composite adhesive sheet having excellent adhesive strength, without using solvents and fiber substrate, by coating a fusible sheet with a powdery resin having a melting point lower than that of the sheet. CONSTITUTION:A sheet substrate which is solid at room temperature, e.g. made of polyethylene, ethylene-vinyl acetate copolymer, polyester, etc., is sprayed with powdery resin having an average particle size of 5-1000mu, and a melting point lower than that of the sheet, e.g. powders of a thermoplastic resin such as polyethylene, nylon, etc., and a thermosetting resin such as epoxy resin, etc., by electrostatic spraying, scattering, etc., and heated at a temperature between the melting point of the sheet and the melting point of the resin powder, thereby fusing and fixing the powder to the sheet.

23. 发明专利

JPS5443983A WATERPROOFING METHOD 失效
公开(公告)号：JPS5443983A
公开(公告)日：1979-04-06
申请号：JP11104477
申请日：1977-09-14
申请人： NITTO ELECTRIC IND CO
发明人： KAWAMOTO NORIO , NODA KEN , SHIMOKUBO KATSUFUMI , SHIMAMURA TOSHIO
IPC分类号： C08J5/12 , B29C55/00 , B29C65/00 , B29C65/02 , C08J7/04
摘要： PURPOSE:To seal the jointing part of a waterproof resin product having rubber- elasticity with a specific chlorinated polyethylene-containing resin, thereby giving improved adhesive properties and processability. CONSTITUTION:A waterproof resin product having rubber-elasticity, e.g. a product of acrylic resin, urethane resin etc., is sealed e.g. by laying a chlorinated polyethylene-containing resin having a torque of 10-55kg.cm and a viscosity of 10 -10 poise at the sealing temperature, on the top of the sewn part of the sheet, and heat- pressing thereof.

24. 发明专利

JPS53111369A RESINNIMPREGNATED BASE MATERIAL AND ITS MANUFACTURE 失效
公开(公告)号：JPS53111369A
公开(公告)日：1978-09-28
申请号：JP2681577
申请日：1977-03-10
申请人： NITTO ELECTRIC IND CO
发明人： KAWAMOTO NORIO , NODA KEN , SHIMAMURA TOSHIO , IGARASHI KAZUMASA
IPC分类号： B32B5/14 , B29B11/00 , B29C57/00 , B29C70/06 , C08J5/24
摘要： PURPOSE:To manufacture the title base material having a resin-concentration gradient in the direction of its thickness, by application of resin powder to a fiber base material heated at a temperature exceeding the melting point of said resin powder, and immediately after that, by melting the powder to effect contituous impregnation into the base material.

25. 发明专利

JPS5335963A FLEXIBLE PRINTED CIRCUIT SUBSTRATE 失效
公开(公告)号：JPS5335963A
公开(公告)日：1978-04-03
申请号：JP11054476
申请日：1976-09-14
申请人： NITTO ELECTRIC IND CO
发明人： KAWAMOTO NORIO , NODA KEN , IGARASHI KAZUMASA , SHIMOKUBO KATSUFUMI
IPC分类号： B32B15/04 , B32B15/08 , H05K1/00 , H05K1/03

26. 发明专利

JPS63301264A COATING COMPOSITION 失效
公开(公告)号：JPS63301264A
公开(公告)日：1988-12-08
申请号：JP13622787
申请日：1987-05-30
申请人： NITTO ELECTRIC IND CO
发明人： SHIMIZU MASAHITO , KAWAMOTO NORIO , HAMABUCHI KAZUFUMI
IPC分类号： C09D163/00
摘要： PURPOSE:To obtain a coating composition which can form a thick film excellent in properties after curing even on a wet surface or underwater in good applicability, by using a curing agent based on a xylylenediamine derivative as a curing agent for a coating composition containing an epoxy resin, a curing agent and a thixotropic agent. CONSTITUTION:A coating composition containing an epoxy resin, a curing agent and a thixotropic agent, wherein the thixotropic index is 3-20. Said curing agent is based on a combination of a polyamideamine (A) derived from xylylenediamine and an acryl derivative (B) of xylylenediamine. It is desirable that 10-150pts.wt. component B is present per 100pts.wt. component A. Examples of component A include condensation products of xylylenediamine with a dimer or trimer acid, obtained by polymerizing an unsaturated fatty acid such as linoleic acid or oleic acid. Examples of component B include reac tion products of xylylenediamine with an acrylic compound having a structure of formula I (wherein X is H or CH3).

27. 发明专利

JPS636160B2 失效
公开(公告)号：JPS636160B2
公开(公告)日：1988-02-08
申请号：JP4440581
申请日：1981-03-25
申请人： NITTO ELECTRIC IND CO
发明人： SUGIMOTO MASAKAZU , KANEHARA MATSURO , KAWAMOTO NORIO
IPC分类号： H01C17/06 , H01K1/16 , H05K1/05 , H05K1/16 , H05K3/20 , H05K3/44

28. 发明专利

JPS633023B2 失效
公开(公告)号：JPS633023B2
公开(公告)日：1988-01-21
申请号：JP17557985
申请日：1985-08-08
申请人： NITTO ELECTRIC IND CO
发明人： TAJIRI KAZUHIRO , KAWAMOTO NORIO , SAITO KYOSHI , TAKAHIRA HITOSHI
IPC分类号： C23C22/00 , B32B15/04 , B32B15/092 , C23C22/07 , C23C22/28

29. 发明专利

JPS62290784A ADHESIVE IN RING FORM 失效
公开(公告)号：JPS62290784A
公开(公告)日：1987-12-17
申请号：JP13345086
申请日：1986-06-09
申请人： NITTO ELECTRIC IND CO
发明人： KAWAMOTO NORIO , SAITO KIYOSHI , AKATA YUZO , TAKAHIRA HITOSHI
IPC分类号： C09J7/02 , B29C61/06 , B29C63/42 , B32B7/02 , B32B7/10
摘要： PURPOSE:To obtain the title adhesive which is capable of uniting objects to be held together easily, rapidly and surely, by forming an adhesive sheet obtained by laminating or impregnating a heat-shrinkable base material with an adhesive material into a tube in such a manner that the adhesive material is present on the inside thereof. CONSTITUTION:An adhesive sheet is obtained by laminating or impregnating 100pts.wt. base material 2 (A) which comprises a film or a (non)woven fabric, has a heat shrinkage of less than 5%, a thickness of 0.05-0.5mm, a basis weight of 20-400g/m , and a melting point of 150 deg.C or higher, and shrinks at 150 deg.C or lower (e.g., a nonwoven polyester fabric) with 50-300pts.wt. adhesive material 3 (B) which comprises preferably a thermosetting resin (e.g., an epoxy resin) and, if necessary, a surfactant, a coupling agent, an inorganic filler, etc., and has a viscosity of 5-50 P (150 deg.C). This sheet is formed into a tube in such a manner that the component B (3) is present on the inside thereof.

30. 发明专利

JPS62240375A THERMOSETTING AND BONDING SHEET 失效
公开(公告)号：JPS62240375A
公开(公告)日：1987-10-21
申请号：JP8462186
申请日：1986-04-11
申请人： NITTO ELECTRIC IND CO
发明人： TAKAHIRA HITOSHI , SAITO KIYOSHI , KAWAMOTO NORIO
IPC分类号： C09J7/02
摘要： PURPOSE:The titled sheet, obtained by impregnating a fibrous base material with an adhesive composition consisting of a powdery mixture of a crystalline epoxy resin which is a solid at room temperature with a curing agent which is a solid at room temperature and having improved adhesive force and good punchability as well as operability and suitable for bonding fine parts of mechanical parts, etc. CONSTITUTION:A sheet, obtained by impregnating (B) a fibrous base material with (A) an adhesive composition, consisting of a powdery mixture of a crystalline epoxy resin, e.g. 4,4'-bis(2'',3''-epoxypropoxy)-3,3',5,5'-tetramethylbiphenyl, etc., with a curing agent and having 0.5-2P melt viscosity at a temperature 20 deg.C higher than the melting point not to leave preferably >=0.1mm above- mentioned adhesive composition layer and having improved operability, etc., without sagging the excess adhesive and scattering the adhesive in punching, etc., since the thick fibrous base material is used and melting degree is adjusted.

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