会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 3. 发明专利
    • ELECTRICALLY CONDUCTIVE PASTE COMPOSITION
    • JPS60206884A
    • 1985-10-18
    • JP6483484
    • 1984-03-30
    • NITTO ELECTRIC IND CO
    • IGARASHI KAZUMASAINOUE NAOKIKITAMURA FUJIO
    • C08K5/00C08K5/20C08L79/08H01B1/20
    • PURPOSE:To provide the titled compsn. having thixotropic properties suitable for coating by a dispensing method, by adding a specified alkylenebis (aliph. monocarboxylic acid amide) to a polyimide precursor soln. contg. an electrically conductive filler. CONSTITUTION:150-1,900pts.wt. electrically conductive filler having a particle size of 100 mesh or below (e.g. silver powder) is blended with 100pts.wt. (on a solid basis) soln. of a polyimide precursor having an intrinsic viscosity of 0.3- 3.0, composed of 0.1-50mol% of a repeating unit of formula I (wherein R is a bivalent hydrocarbon group; R' is a monovalent hydrocarbon group; n is at least 1) obtd. by reacting a diaminosiloxane, an org. diamine contg. no Si atom and a tetracarboxylic acid dianhydride and 99.9-50mol% of a repeating unit of formula II (wherein R'' is a tetravalent org. group; R''' is a bivalent org. group which is a residue of an org. diamine contg. no Si atom). 0.5-5wt% alkylenebis (aliph. monocarboxylic acid amide) of formula III (wherein R1 and R2 are each a 6- 24C monovalent hydrocarbon group; R3 is a 1-6C bivalent hydrocarbon group) is added to the resulting soln.
    • 10. 发明专利
    • Electrically conductive paste composition for electronic part
    • 电子部件电导电胶组成
    • JPS6183250A
    • 1986-04-26
    • JP20525484
    • 1984-09-29
    • Nitto Electric Ind Co Ltd
    • IGARASHI KAZUMASAINOUE NAOKIYAMAGUCHI KATSUHIKO
    • C08L79/08C08K3/08C09J179/08H01B1/20H01L21/52H01L21/58H05K3/32
    • H01L2224/32245H01L2224/48247H01L2224/49175H01L2224/73265H01L2924/181H05K3/321H01L2924/00H01L2924/00012
    • PURPOSE: The title pastwe compsn. having excellent heat resistance, moisture resistance and thick-film forming capability and being highly thixotropic and easily workable, which is prepf. by incorporating a specified polyimide resin precursor, an org. solvent and an electrically conductive filler.
      CONSTITUTION: A diamino compd. comprising (A) 99W80mol% diamine consisting of (a) 100W70mol% arom. tetranuclear diamine of the formula I (wherein R
      1W2 is H, 1W4C alkyl or CF
      3 ; R
      3W6 is H, halogen or 1W4C alkyl) and (b) 0W30mol% diamine not contg. Si in the molecule other than that of the componenets (a) and (b), and (B) 1W20mol% diaminosiloxane of the formula II (wherein R
      7 is a divalent org. group; R
      8 is a monovalent org. group; n is 1W1000), and (c) on org. tetracarboxylic ester of MW 200W700 are dissolved in about equal mol ratio in an inert solvent and reacted by heating at 80W200°C to obtain a polyimide resin precursor comprising an imide ring-contg. low-molecular polymer. Then it is mixed with an org. solvent and an electrically conductive filler such as silver powder.
      COPYRIGHT: (C)1986,JPO&Japio
    • 目的:标题pastwe compsn。 具有优异的耐热性,耐湿性和厚膜形成能力,并且具有高触变性并且易于加工,这是制备的。 通过加入指定的聚酰亚胺树脂前体, 溶剂和导电填料。 构成:二氨基化合物 包括(A)99-80mol%二胺,由(a)100-70mol%芳烃组成。 式I的四核二胺(其中R1-2为H,1-4C烷基或CF3; R3-6为H,卤素或1-4C烷基)和(b)0-30mol%二胺, (a)和(b)的分子中的Si,和(B)1-20摩尔的式II的二氨基硅氧烷(其中R 7是二价的有机基团; R 8是一价的有机基团; n 是1-1000),(c)在组织。 MW 200-700的四羧酸酯在惰性溶剂中以约相等摩尔比溶解,并在80-200℃下加热反应,得到包含酰亚胺环的聚酰亚胺树脂前体。 低分子聚合物。 然后它与组织混合。 溶剂和导电填料如银粉。