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1. 发明专利

JPS633023B2 失效
公开(公告)号：JPS633023B2
公开(公告)日：1988-01-21
申请号：JP17557985
申请日：1985-08-08
申请人： NITTO ELECTRIC IND CO
发明人： TAJIRI KAZUHIRO , KAWAMOTO NORIO , SAITO KYOSHI , TAKAHIRA HITOSHI
IPC分类号： C23C22/00 , B32B15/04 , B32B15/092 , C23C22/07 , C23C22/28

2. 发明专利

JPS62290784A ADHESIVE IN RING FORM 失效
公开(公告)号：JPS62290784A
公开(公告)日：1987-12-17
申请号：JP13345086
申请日：1986-06-09
申请人： NITTO ELECTRIC IND CO
发明人： KAWAMOTO NORIO , SAITO KIYOSHI , AKATA YUZO , TAKAHIRA HITOSHI
IPC分类号： C09J7/02 , B29C61/06 , B29C63/42 , B32B7/02 , B32B7/10
摘要： PURPOSE:To obtain the title adhesive which is capable of uniting objects to be held together easily, rapidly and surely, by forming an adhesive sheet obtained by laminating or impregnating a heat-shrinkable base material with an adhesive material into a tube in such a manner that the adhesive material is present on the inside thereof. CONSTITUTION:An adhesive sheet is obtained by laminating or impregnating 100pts.wt. base material 2 (A) which comprises a film or a (non)woven fabric, has a heat shrinkage of less than 5%, a thickness of 0.05-0.5mm, a basis weight of 20-400g/m , and a melting point of 150 deg.C or higher, and shrinks at 150 deg.C or lower (e.g., a nonwoven polyester fabric) with 50-300pts.wt. adhesive material 3 (B) which comprises preferably a thermosetting resin (e.g., an epoxy resin) and, if necessary, a surfactant, a coupling agent, an inorganic filler, etc., and has a viscosity of 5-50 P (150 deg.C). This sheet is formed into a tube in such a manner that the component B (3) is present on the inside thereof.

3. 发明专利

JPS62240375A THERMOSETTING AND BONDING SHEET 失效
公开(公告)号：JPS62240375A
公开(公告)日：1987-10-21
申请号：JP8462186
申请日：1986-04-11
申请人： NITTO ELECTRIC IND CO
发明人： TAKAHIRA HITOSHI , SAITO KIYOSHI , KAWAMOTO NORIO
IPC分类号： C09J7/02
摘要： PURPOSE:The titled sheet, obtained by impregnating a fibrous base material with an adhesive composition consisting of a powdery mixture of a crystalline epoxy resin which is a solid at room temperature with a curing agent which is a solid at room temperature and having improved adhesive force and good punchability as well as operability and suitable for bonding fine parts of mechanical parts, etc. CONSTITUTION:A sheet, obtained by impregnating (B) a fibrous base material with (A) an adhesive composition, consisting of a powdery mixture of a crystalline epoxy resin, e.g. 4,4'-bis(2'',3''-epoxypropoxy)-3,3',5,5'-tetramethylbiphenyl, etc., with a curing agent and having 0.5-2P melt viscosity at a temperature 20 deg.C higher than the melting point not to leave preferably >=0.1mm above- mentioned adhesive composition layer and having improved operability, etc., without sagging the excess adhesive and scattering the adhesive in punching, etc., since the thick fibrous base material is used and melting degree is adjusted.

4. 发明专利

JPS6270416A EPOXY RESIN POWDER COMPOSITION 失效
公开(公告)号：JPS6270416A
公开(公告)日：1987-03-31
申请号：JP21080085
申请日：1985-09-24
申请人： NITTO ELECTRIC IND CO
发明人： TAKAHIRA HITOSHI , SAITO KIYOSHI , AKATA YUZO , KAWAMOTO NORIO
IPC分类号： C08G59/00 , C08G59/62 , C08L63/00 , C09D5/03 , C09D163/00 , C09J163/00
摘要： PURPOSE:To obtain the titled composition low in melt viscosity and excellent in caulking property, moisture resistance and blocking resistance, by mixing a crystalline epoxy resin with a specified novolak phenolic resin curing agent. CONSTITUTION:A compound (a) having a group of formula I (wherein R is a 1-3C alkyl) and a compound (b) having a group of formula II (wherein R' is a 4-9C alkyl) are cocondensed with formaldehyde (c) at a ratio of the groups of component (a) to the groups of component (b) of 100:20-100 to obtain a novolak phenolic resin curing agent (B) of a softening point of 70-130 deg.C and a melt viscosity at 150 deg.C of 1-15 P. A crystalline epoxy resin of a m.p. of 50-150 deg.C [e.g., 4,4'-bis(2'',3''-epoxypropoxy)-3,3',5,5'-tetramethylbiphenyl] in an amount to provide 1 eq. of epoxy groups is mixed with component B in an amount to provide 0.5-1.5 eq. of the functional groups.

5. 发明专利

JPS6112763A Epoxy resin powder coating 失效
标题翻译：环氧树脂粉末涂料
公开(公告)号：JPS6112763A
公开(公告)日：1986-01-21
申请号：JP13349484
申请日：1984-06-27
申请人： Nitto Electric Ind Co Ltd
发明人： TAJIRI KAZUHIRO , KAWAMOTO NORIO , SAITOU KIYOSHI , TAKAHIRA HITOSHI
IPC分类号： C09D5/03 , C09D5/46 , C09D163/00
摘要： PURPOSE: To obtain the titled coating capable of giving coating film with high impact resistance even at low temperatures for use in preventing ships or vehicles from corrosion, by incorporating an epoxy resin with, as fillers, needle-like glass powder having each specific length and aspect ratio and powdery inorganic filler of specific size.
CONSTITUTION: The objective coating can be obtained by incorporating (A) 100pts.wt. of an epoxy resin in which the proportion of non-reactive terminal group is
摘要翻译：目的：为了获得即使在低温下具有高耐冲击性的涂膜，用于防止船舶或车辆腐蚀的标题涂层，通过加入环氧树脂作为填料，每个特定长度的针状玻璃粉末和长宽比和特定尺寸的粉末状无机填料。构成：目标涂层可以通过掺入（A）100pts.wt。的环氧树脂，其中非活性末端基团的比例在整个末端基团（例如双酚A型环氧树脂）中（B）为30-100pts.wt。平均长度>50μm，长径比> = 5的针状玻璃粉末（例如，氨基硅烷，环氧硅烷或巯基硅烷处理的玻璃粉末）和（C）> = 30pts.wt。的平均粒径<1.0μm的粉末状无机填料（例如，表面处理以使环氧树脂润湿性更高的粉末）。

6. 发明专利

JPS63227622A EPOXY RESIN POWDER COMPOSITION 失效
公开(公告)号：JPS63227622A
公开(公告)日：1988-09-21
申请号：JP6165687
申请日：1987-03-16
申请人： NITTO ELECTRIC IND CO
发明人： TAKAHIRA HITOSHI , AKATA YUZO , SAITO KIYOSHI , KAWAMOTO NORIO
IPC分类号： C08G59/40 , C08G59/00 , C08G59/62 , C08L63/00 , C09D5/03 , C09D163/00
摘要： PURPOSE:To obtain the titled composition containing a crystalline epoxy resin, specific phenolic curing agent and dicyandiamide, having good moisture resistance, flowability and blocking resistance, capable of preventing lowering of adhesion at high temperature of the curing product of the epoxy resin and suitable for adhesive, etc. CONSTITUTION:The aimed composition containing (A) crystalline epoxy resin [preferably 4,4'-bis(2'',3''-epoxypropoxy)-3,3',5,5'-tetramethylbiphenyl], (B) novolak type phenolic curing agent obtained by reaction of 100pts.wt. compound expressed by formula I [R is 4-9C alkyl (preferably formula III)] with 20-100 pts.wt. compound expressed by formula II [R' is 1-3C alkyl (preferably CH3)] and a proper amount of formaldehyde and (C) dicyandiamide and containing 2-15pts.wt. blended component (C) based on 100pts.wt. component (B). The component (B) consists of preferably a reaction product obtained by previously reacting the compounds expressed by formulas I and II with formaldehyde respectively.

7. 发明专利

JPS6332829B2 失效
公开(公告)号：JPS6332829B2
公开(公告)日：1988-07-01
申请号：JP3072285
申请日：1985-02-19
申请人： NITTO ELECTRIC IND CO
发明人： TAJIRI KAZUHIRO , KAWAMOTO NORIO , SAITO KYOSHI , TAKAHIRA HITOSHI
IPC分类号： C09D5/03 , C09D163/00

8. 发明专利

JPS6295373A THERMOSETTING ADHESIVE SHEET 失效
公开(公告)号：JPS6295373A
公开(公告)日：1987-05-01
申请号：JP23589085
申请日：1985-10-22
申请人： NITTO ELECTRIC IND CO
发明人： SAITO KIYOSHI , TAKAHIRA HITOSHI , KAWAMOTO NORIO
IPC分类号： C09J7/02 , C09J163/00
摘要： PURPOSE:The titled sheet, obtained by compressing and integrating an adhesive composition consisting of a specific crystalline epoxy resin and specific curing agent at a temperature below the melting point of the constituent components, having improved adhesive force, gap filling property and operability and suitable for metal members of mechanical parts or various apparatuses. CONSTITUTION:An adhesive sheet obtained by compressing and integrating an adhesive composition consisting of a powdery mixture (preferably having =50 deg.C melting point at a temperature below the melting points of the respective components constituting the above-mentioned adhesive between two sheets of fibrous base materials, preferably having 50-200mu thickness. USE:Members consisting of high polymeric materials, etc.

9. 发明专利

JPS6286078A THERMOSETTING ADHESIVE SHEET 失效
公开(公告)号：JPS6286078A
公开(公告)日：1987-04-20
申请号：JP22759185
申请日：1985-10-11
申请人： NITTO ELECTRIC IND CO
发明人： SAITO KIYOSHI , TAKAHIRA HITOSHI , KAWAMOTO NORIO
IPC分类号： C09J7/02 , C09J163/00
摘要： PURPOSE:To obtain the titled adhesive sheet which is excellent in electrical insulation and gap-filling properties, etc., applying a mixture of a solid crystalline epoxy resin with a curing agent and a mixture of a solid non-crystalline epoxy resin with a curing agent respectively onto the sides of a fibrous substrate. CONSTITUTION:A compsn. (A) comprising a crystalline epoxy resin which is solid at room temp. [e.g., 4,4'-bis(2'',3''-epoxypropoxy)-3,3',5,5'-tetramethyl biphenyl] and a curing agent which is solid at room temp. (e.g., novolak phenol resin) and a compsn. (B) comprising a non-crystalline epoxy resin which is solid at room temp. (e.g., solid bisphenol A epoxy resin) and a curing agent which is solid at room temp. are applied respectively onto the sides of a fibrous substrate to obtain an intended thermosetting adhesive sheet. The sheet thus formed is advantageously used for enhancement in adhesion and insulation of a member, such as electromagnetic valve coil, having an uneven bonding surface by filling the gaps with the sheet.

10. 发明专利

JPS61261371A EPOXY RESIN POWDER COMPOSITION 失效
公开(公告)号：JPS61261371A
公开(公告)日：1986-11-19
申请号：JP10230185
申请日：1985-05-14
申请人： NITTO ELECTRIC IND CO
发明人： TAKAHIRA HITOSHI , SAITO KIYOSHI , AKATA YUZO , KAWAMOTO NORIO
IPC分类号： C08G59/00 , C08G59/62 , C08L63/00 , C09D5/03 , C09D163/00
摘要： PURPOSE:To provide the titled compsn. having a low melt viscosity and excellent gap filling ability, consisting of a crystalline epoxy resin and a phenolic hardener. CONSTITUTION:100pts.wt. novolak type phenolic resin hardener (a) prepd. from a compd. of formula I (wherein R is 3C or higher alkyl) is blended with 20-100 pts.wt. novolak type phenolic resin hardener (h) prepd. from a compd. of formula II (wherein R' is H, CH3) to obtain a phenolic hardener (B) having a softening point of 70-130 deg.C and a melt viscosity of 1-15 P at 150 deg.C. 100pts.wt. crystalline epoxy resin (A) having a m.p. of 50-150 deg.C [e.g. 4,4'-bis(2'',3''- epoxypropoxy)-3,3',5,5'-tetramethylbiphenyl], 0.5-1.5 equivalents (per equivalent of the epoxy group of component A) of component B and optionally 0.3-8pts.wt. curing accelerator (e.g. imidazole) and 0.5-200wt% additives such as filler (e.g. talc), pigment (e.g. red iron oxide), flow modifier, etc. are blended together.

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