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21. 发明专利

JP2004160514A Solder ball, and solder ball coating method 审中-公开
公开(公告)号：JP2004160514A
公开(公告)日：2004-06-10
申请号：JP2002331036
申请日：2002-11-14
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： IWATA KENGO , UEMURA NORIO , KUBOI TAKESHI , SATO KOJI
IPC分类号： B23K35/14 , B22F1/02 , B23K35/40 , H01L21/60 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide solder balls for solving a weak-bonding problem that originally loose, very small solder balls of the diameter of ≤ 300 μm are bonded to each other with weak bonding force, and a solder ball coating method.
SOLUTION: The solder ball is coated with a fluororesin. In the solder ball coating method, the solder balls are immersed in a solution with the fluororesin dissolved, the solder balls are taken out of the solution, and the solvent adhering to the surface of the solder balls is volatilized to coat the surface of the solder balls with the fluororesin.
COPYRIGHT: (C)2004,JPO

22. 发明专利

JP2004154845A Solder and solder ball for electronic device connection, and electronic device using the same 审中-公开
公开(公告)号：JP2004154845A
公开(公告)日：2004-06-03
申请号：JP2002324957
申请日：2002-11-08
申请人： Hitachi Ltd , Hitachi Metals Ltd , 日立金属株式会社 , 株式会社日立製作所
发明人： MORITA TOSHIAKI , KAJIWARA RYOICHI , SHOJI TATSUYA , DATE MASAYOSHI , SATO KOJI
IPC分类号： B23K35/26 , C22C13/00 , H01L23/12 , H05K3/34
CPC分类号： H01L2224/48091 , H01L2224/48227 , H01L2924/15311 , Y02P70/613 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a solder and solder ball for connection of lead-free electronic device and the electronic device using it, which can suppress growth of an intermetallic compound formed in the boundary between a package metallized with a soldering material and Cu and a terminal surface on a printed circuit board, and can solve the problem of a defect caused by the boundary fracture related to the impact resistance property. SOLUTION: The solder for the connection of the electronic device is mainly composed of Sn and contains Ag of 5.0 mass%, Cu of 1.0 mass%, and trace elements of 0.008-0.10 mass% of at least 1 kind among P, Sb and Bi. Furthermore, at least one of those two relationships is satisfied that the ratio of the trace elements to Ag is 0.002-0.05 and that the ratio of the trace elements to Cu is 0.01-0.35. COPYRIGHT: (C)2004,JPO

23. 发明专利

JP2013052441A Anvil for hot forging and hot forging method 审中-公开
标题翻译：用于热锻和热锻方法的ANVIL
公开(公告)号：JP2013052441A
公开(公告)日：2013-03-21
申请号：JP2012174773
申请日：2012-08-07
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： SASAKI SHOHEI , SATO KOJI
IPC分类号： B23K35/30 , B21J13/06 , C22C19/03 , C22C38/00 , C22C38/52 , C22F1/00 , C22F1/10
摘要： PROBLEM TO BE SOLVED: To provide a new anvil for hot forging and a hot forging method capable of prolonging the service life of the anvil.SOLUTION: The anvil for hot forging has on a striking face, a precipitation-strengthening heat-resistant alloy layer which is a building-up layer having an Ni-based alloy composition. The building-up layer contains, by mass, 0-0.02% B, 0.01-0.15% C, 0-0.01% Mg, 0.5-2% Al, 0-1% Si, 0-1% Mn, 1-3% Ti, 15-22% Cr, 2-15% Co, 0-3% Nb, 3-7% Mo, 3-7% W, 1-7% Ta alone or (Ta+2Nb), and the balance Ni with impurities. The anvil for hot forging has such a composition that the percentage of total of a γ' phase is 20-45 atom%, wherein the γ' phase can be obtained provided that all elements M thus contained (M represents four elements of Al, Ti, Ta and Nb) form the γ' phase represented by NiM.
摘要翻译：要解决的问题：提供能够延长砧座的使用寿命的用于热锻的新砧座和热锻造方法。解决方案：用于热锻的砧座在醒目的表面上，是具有Ni基合金组成的增强层的析出强化耐热合金层。堆积层质量含有0-0.02％B，0.01-0.15％C，0-0.01％Mg，0.5-2％Al，0-1％Si，0-1％Mn，1-3％ Ti，15-22％Cr，2-15％Co，0-3％Nb，3-7％Mo，3-7％W，1-7％Ta单独或（Ta + 2Nb），余量为Ni 杂质。用于热锻的砧座具有如下组成：γ'相的总量的百分比为20-45原子％，其中可以获得γ'相，只要所有元素M如此含有（M表示Al，Ti的四种元素，Ta和Nb）形成由Ni 3 M表示的γ'相。版权所有（C）2013，JPO＆INPIT

24. 发明专利

JP2006307265A Fine metal sphere production device 审中-公开
标题翻译：精细金属球形生产设备
公开(公告)号：JP2006307265A
公开(公告)日：2006-11-09
申请号：JP2005129748
申请日：2005-04-27
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： IKEDA TAKAFUMI , OCHIAI MASANORI , AKISHIGE MANABU , SATO KOJI
IPC分类号： B22F9/08
摘要： PROBLEM TO BE SOLVED: To provide a fine metal sphere production device capable of continuously producing a fine metal sphere having reduced variation in particle diameters and also having high roundness for a long time, and further having excellent maintainability.
SOLUTION: The metal sphere production device comprises a tapping part 4 of tapping molten metal from an orifice; and a solidifying part 5 of solidifying the tapped molten metal into a spherical shape by surface tension. The tapping part is provided with: a tapping crucible 41 having the orifice of tapping molten metal at the bottom part; a vibration applying part 47 of applying vibration to the molten metal held at the inside of the tapping crucible; a melting crucible 32 of melting a solid raw material and forming the molten metal to be fed to the tapping crucible; and a chamber 31 including the tapping crucible and the melting crucible, shielding them from the open air, and further holding the atmosphere on the molten metal. The atomic space of the chamber is interposed in a molten metal flow passage from the melting crucible to the tapping crucible.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供能够连续生产粒径变化小且长时间高圆度的细小金属球的细金属球制造装置，并且还具有优异的可维护性。解决方案：金属球生产装置包括从孔口出来熔融金属的攻丝部分4; 以及固化部5，其通过表面张力使分解的熔融金属固化为球形。攻丝部分设置有：具有在底部开口熔融金属孔口的攻丝坩埚41; 振动施加部47，其对保持在排出坩埚内侧的熔融金属施加振动; 熔化坩埚32，其熔化固体原料并形成要供给到排水坩埚中的熔融金属; 以及包括排水坩埚和熔融坩埚的室31，将其从露天空气中遮蔽，并进一步将气氛保持在熔融金属上。室的原子空间插入熔融金属流通道中，从熔融坩埚到出钢坩埚。版权所有（C）2007，JPO＆INPIT

25. 发明专利

JP2005046882A Solder alloy, solder ball, and solder joined body 审中-公开
标题翻译：焊接合金，焊球和焊接接合体
公开(公告)号：JP2005046882A
公开(公告)日：2005-02-24
申请号：JP2003281984
申请日：2003-07-29
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： SHOJI TATSUYA , DATE MASAYOSHI , SATO KOJI
IPC分类号： B23K35/26 , C22C13/00 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To increase the joining strength in a soldered electronic component, and to improve the operational reliability of electronic equipment in various using environments.
SOLUTION: A trace amount of one or more selected from Fe, Ni and Co as elements for strengthening the joining boundary of solder are added, so that low reliability fracture in the solder joint by falling impact can be prevented. The solder alloy has a composition comprising, by mass, 0.1 to 5% Cu, 0.1 to 10% In, and one or more kinds of elements selected from Fe, Ni and Co by 0.002 to 0.05% in total, and the balance Sn with inevitable impurities. Alternatively, the solder alloy has a composition comprising 0.1 to 1% Ag, 0.1 to 5% Cu, 0.1 to 10% In, and one or more kinds of elements selected from Fe, Ni and Co by 0.002 to 0.05% in total, and the balance Sn with inevitable impurities.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提高焊接电子部件的接合强度，提高各种使用环境下的电子设备的运行可靠性。
解决方案：添加微量的选自Fe，Ni和Co中的一种或多种作为用于强化焊料的接合界面的元素，从而可以防止焊接点的低可靠性断裂。该焊料合金具有以下组成：Cu，0.1〜10％In和选自Fe，Ni，Co中的一种以上的元素总计为0.002〜0.05％，余量为Sn，不可避免的杂质。或者，焊料合金具有包含0.1〜1％Ag，0.1〜5％Cu，0.1〜10％In，以及选自Fe，Ni和Co中的一种以上的元素，总计为0.002〜0.05％，以及余量Sn与不可避免的杂质。版权所有（C）2005，JPO＆NCIPI

26. 发明专利

JP2003335357A Container for solder ball 审中-公开
标题翻译：集束器为焊球
公开(公告)号：JP2003335357A
公开(公告)日：2003-11-25
申请号：JP2002141122
申请日：2002-05-16
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： KUBOI TAKESHI , SATO KOJI
IPC分类号： B65D85/58 , B65D25/10 , B65D25/14 , B65D51/18 , B65D51/26
摘要： PROBLEM TO BE SOLVED: To provide a container for solder balls, capable of sufficiently preventing the oxidation and electrification of solder balls, which are caused by rubbing of the solder balls against one another, or by rubbing of the solder balls against the container, in such a case where the solder balls are transported in the state of being contained in the container. SOLUTION: The container for solder balls is composed of a bottomed main body having an opening through which the solder balls are charged thereinto, an outside lid to be capped on the main body for closing the opening, and an inside lid provided inside the main body in a vertically movable manner. The inside lid includes a pressing part which presses the stored solder balls and an extending part which extends from the pressing part in the direction opposite to the stored solder balls and whose end abuts against the outside lid. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种用于焊球的容器，其能够充分地防止由于将焊球彼此摩擦而引起的焊球的氧化和带电，或者通过将焊球摩擦抵抗在这种情况下，焊料球被容纳在容器中的状态下被输送。解决方案：用于焊球的容器由具有开口的有底主体构成，焊球通过该开口装入其中，封盖在主体上用于封闭开口的外盖和设置在内侧的内盖主体以垂直方式移动。内盖包括按压存储的焊球的按压部和从按压部沿与所存储的焊球相反的方向延伸的延伸部，并且其端部抵靠外盖。版权所有（C）2004，JPO

27. 发明专利

JP2003080051A Method for manufacturing spherical particle 审中-公开
标题翻译：制造球形颗粒的方法
公开(公告)号：JP2003080051A
公开(公告)日：2003-03-18
申请号：JP2001278693
申请日：2001-09-13
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： UEDA TAKUSHI , ITO MOTOMICHI , SATO KOJI , KUBOI TAKESHI
IPC分类号： B29B9/10 , B01J2/02
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing spherical particles which can stably manufacture the spherical particles uniform in prescribed grain sizes.
SOLUTION: This method for manufacturing the spherical particles by extracting a melt through a fine hole from the inside of a vessel comprises leading out a particle diameter in accordance with the distance between the spherical particles to be extracted and manufacturing the spherical particles while monitoring the same.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供一种能够稳定地制造规定粒径均匀的球状粒子的球形粒子的制造方法。解决方案：通过从容器内部从细孔中提取熔体来制造球形颗粒的方法包括根据要提取的球形颗粒之间的距离导出颗粒直径并制造球形颗粒，同时监测它们。

28. 发明专利

JP2010232171A Aluminum porous material and its manufacturing method, and power storage device using the aluminum porous material as electrode current collector 有权
标题翻译：铝多孔材料及其制造方法以及使用铝多孔材料作为电极集电器的功率存储装置
公开(公告)号：JP2010232171A
公开(公告)日：2010-10-14
申请号：JP2010049413
申请日：2010-03-05
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： OKAMOTO ATSUSHI , ANDO SETSUO , SATO KOJI , YOKOYAMA SHINICHIRO , SHIMADA MASAAKI , ITAKURA KEIICHI
IPC分类号： H01M4/66 , C25D3/44 , C25D7/00 , H01G11/66 , H01G11/68 , H01G11/70 , H01G11/84 , H01M4/13 , H01M4/80
CPC分类号： Y02P70/54
摘要： PROBLEM TO BE SOLVED: To provide an aluminum porous material and its manufacturing method, and a power storage device using the aluminum porous material as an electrode current collector.
SOLUTION: The aluminum porous material is composed of a matrix in which the surface of a porous base material having a three-dimensional network structure formed by linking adjacent cavities is covered by aluminum. Moreover, this is composed of aluminum matrix having the three-dimensional network structure formed by adjacent cavities being mutually linked, having a part in which the inside of a matrix member is hollow at least at a portion thereof.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供铝多孔材料及其制造方法，以及使用铝多孔材料作为电极集电体的蓄电装置。解决方案：铝多孔材料由基体组成，其中具有通过连接相邻空腔形成的三维网状结构的多孔基材的表面被铝覆盖。此外，这是由具有由相邻的空腔相互连接形成的三维网状结构的铝基体构成，其中基体部件的内部至少在其一部分中空。版权所有（C）2011，JPO＆INPIT

29. 发明专利

JP2006231381A Molten metal supply apparatus 审中-公开
标题翻译：金属供应设备
公开(公告)号：JP2006231381A
公开(公告)日：2006-09-07
申请号：JP2005051270
申请日：2005-02-25
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： SATO KOJI , ITOGA KENJI , KUMAMOTO SHINGO , IKEDA TAKAFUMI , AKISHIGE MANABU , NISHI YUICHI
IPC分类号： B22D39/02 , B22D41/01
摘要： PROBLEM TO BE SOLVED: To provide a small-sized molten metal supply apparatus which replaces the atmosphere of an ingot and melt the ingot to produce molten metal and supplies the molten metal to a following process, and in which variation arising at charging a master alloy and fluctuation in pressure by increasing the capacity do not influence the quality of molten alloy.
SOLUTION: The molten metal supply apparatus is provided with an ingot additional charging part and a melting chamber connected to the lower part of the ingot additional charging part, the ingot additional charging part has a insertion chamber in which the ingot is inserted and held, and a replacing chamber positioned below the insertion chamber and connected to the melting chamber, the ingot is introduced into the melting chamber after replacing the atmosphere, with an inlet side shielding member arranged between the insertion chamber and the replacing chamber, and an outlet side shielding member arranged between the replacing chamber and the melting chamber and a feeding device for introducing the ingot from above into the melting chamber positioned below with a controlled feeding speed.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种小型熔融金属供给装置，其替代锭的气氛并熔化锭以产生熔融金属并将熔融金属供应到后续过程中，并且在充电中产生变化主合金和通过增加容量的压力波动不影响熔融合金的质量。解决方案：熔融金属供给装置设置有锭附加充电部和与锭附加充电部的下部连接的熔化室，铸锭附加充电部具有插入槽，插入该铸锭，以及位于插入室下方并连接到熔化室的置换室，在更换大气之后，将铸锭引入到熔化室中，其中入口侧屏蔽构件设置在插入室和更换室之间，并且出口设置在所述更换室和所述熔化室之间的侧面屏蔽构件以及用于将锭从上方引入到以受控进给速度定位在下方的熔化室中的进料装置。版权所有（C）2006，JPO＆NCIPI

30. 发明专利

JP2006205238A Metal ball for rolling body having excellent formability 审中-公开
标题翻译：金属球具有良好的可塑性
公开(公告)号：JP2006205238A
公开(公告)日：2006-08-10
申请号：JP2005022929
申请日：2005-01-31
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： SHOJI TATSUYA , SATO KOJI
IPC分类号： B22D25/02 , B22D23/00 , F16C33/32
摘要： PROBLEM TO BE SOLVED: To provide a metal ball for a rolling body having excellent formability which has a smooth surface and a high sphericity.
SOLUTION: The metallic ball for the rolling body is composed of an Fe based alloy containing, by mass, 1.5 to 5.0% C, and is spherically solidified. Desirably, the Fe based alloy has a liquidus temperature of ≤1,350°C and has a composition satisfying that the difference between the liquidus temperature and solidus temperature is ≤150°C. And, the metallic ball for the rolling body is preferably solidified in an inert gas. According to this invention, an unfinished ball for the rolling body capable of maintaining required mechanical properties without being subjected to the conventional forging stage, and further easy to be subjected to a final precise polishing operation can be provided.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题：提供具有光滑表面和高球形度的成型性优良的滚动体用金属球。解决方案：用于滚动体的金属球由含有质量为1.5-5.0％C的Fe基合金组成，并且球形固化。理想的是，Fe基合金的液相温度为1.3350℃，其组成满足液相线温度与固相线温度之间的差为≤150℃。并且，用于滚动体的金属球优选地在惰性气体中固化。根据本发明，可以提供一种用于滚动体的未完成球，其能够保持所需的机械性能而不经受常规锻造阶段，并且还可以进一步容易进行最终的精确抛光操作。版权所有（C）2006，JPO＆NCIPI

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