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1. 发明专利

JP2006102816A Solder ball and method for producing the same 审中-公开
标题翻译：焊球及其制造方法
公开(公告)号：JP2006102816A
公开(公告)日：2006-04-20
申请号：JP2005290686
申请日：2005-10-04
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： KUBOI TAKESHI , SATO KOJI
IPC分类号： B23K35/26 , B22D11/01 , B22D25/02 , B22F9/08 , C22C5/06 , C22C9/02 , C22C13/00 , H01L23/12 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide solder balls each having a smooth surface shape while having a high sphericity and dimensional accuracy required for solder balls, and to provide a method for producing the same.
SOLUTION: The solder balls comprise one or two kinds selected from Ag and Cu by 0.5 to 60 mass% in total, and the balance Sn with impurities and are obtained by being solidified in a gas atmosphere, and the solder balls have a solidified structure free from dendrite when being observed at a cross-section including the center of each ball. These solder balls comprise 2 to 6 mass% Ag and 0.1 to 2.0 mass% Cu, and the balance Sn with impurities. Then, in the method for producing solder balls comprising one or two kinds selected from Ag and Cu by 0.5 to 60 mass% in total, and the balance Sn with impurities, molten metal dropped from an orifice provided at the bottom of a crucible is rapidly solidified in a gas atmosphere so as to obtain solder balls having the solidified structure free from the dendrite when being observed at the cross-section including the center of each ball.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供具有平滑表面形状的焊球，同时具有焊球所需的高球形度和尺寸精度，并提供其制造方法。＆lt; P＆gt;解决方案：焊球包含从Ag和Cu中选出的总计0.5至60质量％的一种或两种，余量为Sn和杂质，并通过在气体气氛中固化获得，并且焊球具有当在包括每个球的中心的横截面上观察时，没有枝晶的固化结构。这些焊球含有2〜6质量％的Ag和0.1〜2.0质量％的Cu，余量为Sn。然后，在从Ag和Cu中选出的一种或两种以上的焊料球总计为0.5〜60质量％，余量为Sn的杂质的制造方法中，从设置在坩埚底部的孔口滴下的熔融金属迅速在气体气氛中固化，以便在包括每个球的中心的横截面处观察时，获得具有没有枝晶的固化结构的焊球。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2006076602A Solder ball container 有权
标题翻译：焊球容器
公开(公告)号：JP2006076602A
公开(公告)日：2006-03-23
申请号：JP2004261950
申请日：2004-09-09
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： TAKATSUKA HIROYUKI , SATO KOJI
IPC分类号： B65D51/26 , B65D25/06
摘要： PROBLEM TO BE SOLVED: To inhibit solder balls from rubbing against one another or against the inner wall of a container to blacken caused by vibration when they are transported and carried by using the container.
SOLUTION: The solder balls are enclosed in the container by sealing an opening of a bottomed cylindrical container body with an inner lid. The container body is provided with a sealing part on which the inner lid is pressed against the container inner wall to seal the opening, and two or more sealing parts 4a, 4b and 4c are formed from the opening toward the bottom of the container body so that the volume of the container can be changed step by step.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：当通过使用容器运输和携带时，阻止焊球彼此摩擦或抵靠容器的内壁由振动引起的变黑。
解决方案：通过用内盖密封有底圆柱形容器主体的开口将焊球封闭在容器中。容器主体设有密封部分，内盖被压靠在容器内壁上以密封开口，并且两个或多个密封部分4a，4b和4c从容器主体的开口向底部形成，因此可以逐步改变容器的容积。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2005252181A Solder ball excellent in weak-bonding prevention property and method of preventing weak bonding of solder ball 审中-公开
标题翻译：焊接防爆材料的防爆材料和防止焊球弱点的方法
公开(公告)号：JP2005252181A
公开(公告)日：2005-09-15
申请号：JP2004064296
申请日：2004-03-08
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： IWATA KENGO , SATO KOJI
IPC分类号： H05K3/34 , H01L21/60
CPC分类号： H01L2924/01012 , H01L2924/0102 , H01L2924/01056 , H01L2924/014
摘要： PROBLEM TO BE SOLVED: To provide a solder ball with which the problem of weak bonding of solder balls is solved, and a method of preventing weak bonding of solder balls.
SOLUTION: The solder ball is formed by solidification in a gas phase to form a spherical shape, and metal-soap molecules are adsorbed on the surface of the solder ball. The method of preventing weak bonding of the solder balls is preferably applied to solder balls having diameters of 300 μm or smaller. For the metal soap, magnesium stearate or barium stearate, for example, can be used. The solder balls solidified in a gas phase to form spherical shapes are immersed in a solution in which the metal soap is dispersed. After the solder balls are taken out from the solution, the solvent on the solder-ball surfaces is volatilized. Then, the solder balls are dried for one hour or longer in an atmosphere having relative humidity RH of 40% or lower, preferably RH of 20% or lower.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供解决焊球弱接合问题的焊球，以及防止焊球弱接合的方法。解决方案：焊球通过气相凝固形成球形，金属皂分子吸附在焊球的表面上。阻止焊球的弱接合的方法优选应用于直径为300μm以下的焊球。对于金属皂，例如可以使用硬脂酸镁或硬脂酸钡。将在气相中固化以形成球形的焊球浸入金属皂分散的溶液中。焊锡球从溶液中取出后，焊球表面的溶剂挥发。然后，在相对湿度RH为40％以下，优选RH为20％以下的气氛中，将焊球干燥1小时以上。版权所有（C）2005，JPO＆NCIPI

4. 发明专利

JP2005066699A Method for producing solder ball 有权
标题翻译：生产钢球的方法
公开(公告)号：JP2005066699A
公开(公告)日：2005-03-17
申请号：JP2004292482
申请日：2004-10-05
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： KUBOI TAKESHI , SATO KOJI
IPC分类号： B23K35/40 , B22F9/08 , B23K35/26 , C22C1/02 , C22C13/02
摘要： PROBLEM TO BE SOLVED: To provide a method for producing a solder ball having smooth surface shape while having both the high sphericity and dimensional precision required for the solder ball.
SOLUTION: In the method for producing the solder ball, the solder ball containing 0.5-60 mass% total of one or more elements for lowering the melting point of Sn and the balance substantially Sn, particularly, 2-6 mass% Ag and further, one or two elements of 0.1-2.0 mass% Cu and 0.1-10.0 mass% Bi and the balance substantially Sn, is obtained by allowing the molten metal dropped from an orifice arranged at the bottom part of a crucible, to be rapidly cooled and spherically solidified in a gas atmosphere having ≥0.11 MPa atmospheric pressure.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种具有光滑表面形状的焊球的方法，同时具有焊球所需的高球形度和尺寸精度。解决方案：在制造焊球的方法中，含有总共为0.5-60质量％的一种或多种用于降低Sn的熔点和余量基本上为Sn，特别是2-6质量％的Ag的焊球的焊球此外，通过使熔融金属从布置在坩埚底部的孔滴下来，可以快速地获得0.1-2.0质量％Cu和0.1-10.0质量％Bi中的一种或两种元素，并且其余量基本上为Sn 在大气压≥0.11MPa的气体气氛中冷却并球形。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2003334688A Solder alloy and solder ball 有权
标题翻译：焊接合金和焊球
公开(公告)号：JP2003334688A
公开(公告)日：2003-11-25
申请号：JP2002144566
申请日：2002-05-20
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： DATE MASAYOSHI , SHOJI TATSUYA , SATO KOJI
IPC分类号： B23K35/26 , C22C13/00
摘要： PROBLEM TO BE SOLVED: To provide a lead-free solder alloy which can solve the problem of an interface damage with respect to the connecting strength by correctly controlling the growing behavior of an intermetallic compound formed in a boundary between the solder alloy and the electrode of an IC package or a printed board in the solder alloy used to connect an electronic component and to provide a solder ball.
SOLUTION: The solder alloy contains Ag of 5.0 mass% or less, Cu of 1.0 mass% or less, an oxygen of 10 to 50 ppm and the residue of Sn substantially. The solder ball made of the solder alloy is provided.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种无铅焊料合金，其可以通过正确地控制形成在焊料合金和焊料合金之间的边界中的金属间化合物的生长行为来解决相对于连接强度的界面损伤的问题用于连接电子部件的焊料合金中的IC封装的电极或印刷电路板，并提供焊球。＆lt; P＆gt;解决方案：焊料合金含有5.0质量％以下的Ag，1.0质量％以下的Cu，10〜50ppm的氧，Sn的残留量。提供由焊料合金制成的焊球。版权所有（C）2004，JPO

6. 发明专利

JP2003312744A Packing method for solder ball and packing container for solder ball 审中-公开
标题翻译：用于焊球的包装方法和用于焊接球的包装容器
公开(公告)号：JP2003312744A
公开(公告)日：2003-11-06
申请号：JP2002125515
申请日：2002-04-26
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： KUBOI TAKESHI , SATO KOJI
IPC分类号： B65D81/20 , B65D81/24
摘要： PROBLEM TO BE SOLVED: To provide a packing method for a solder ball and a packing container at a low cost and easy in handling, capable of preventing bruises and oxidation on the surface of the solder ball from occurring after solder ball packing.
SOLUTION: A specified quantity of solder balls are charged in a flexible packing container and the packing container is deaerated and sealed by thermocompression bonding. The container has an opening which can be thermocompression bonded. A flexible sheet has 1.0×10
14 Ω or lower in surface resistivity, 200 ml/m
2 ×day×atm or below in oxygen permeability, 20 g/m
2 ×day or below in water vapor permeability.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了以低成本和易于处理的方式提供焊球和包装容器的包装方法，能够防止焊球表面上的擦伤和氧化在焊球包装之后发生。
解决方案：将指定数量的焊球装入柔性包装容器中，并将包装容器通过热压粘合进行脱气和密封。容器具有可以热压粘合的开口。柔性片材的表面电阻率为1.0×10 14 Ω，氧气渗透性为200ml / m×SP2×天×atm以下，20g / m·SP > 2 ×天或以下水蒸汽渗透性。版权所有（C）2004，JPO

7. 发明专利

JP2003041397A Dummy ball for barrel plating 有权
标题翻译：用于棒球场的DUMMY球
公开(公告)号：JP2003041397A
公开(公告)日：2003-02-13
申请号：JP2001229607
申请日：2001-07-30
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： DATE MASAYOSHI , SATO KOJI , KUBOI TAKESHI
IPC分类号： B22D21/00 , B22D25/02 , B22D25/08 , C22C13/00 , C25D17/10 , C25D17/12 , C25D17/16
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive dummy ball for barrel plating free from Pb, which solves a problem of deformation in the dummy ball made from a Sn-based alloy so as not to contaminate a plating solution in barrel plating.
SOLUTION: The dummy ball for barrel plating includes one or two sorts of Ag of 5 mass% or less or Cu of 2 mass% or less, of 0.1 mass% or more, and the balance substantially Sn. The dummy ball preferably includes Ni of 0.01 mass% or more but 0.5 mass% or less.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了提供一种廉价的用于不含Pb的滚镀的虚拟球，其解决了由Sn基合金制成的假球中的变形问题，以便不会在滚镀中污染电镀液。解决方案：用于滚镀的虚拟球包括5质量％以下的Ag或2质量％以下的Cu，0.1质量％以上的Ag，余量基本上为Sn的1种或2种。虚拟球优选包含0.01质量％以上且0.5质量％以下的Ni。

8. 发明专利

JP2015059239A Ｎｉ基超耐熱合金の分塊用中間素材及びその製造方法、Ｎｉ基超耐熱合金の製造方法有权
标题翻译：镍基耐热超合金的中间材料的制造方法，中间材料的制造方法以及生产镍基超耐热合金的方法
公开(公告)号：JP2015059239A
公开(公告)日：2015-03-30
申请号：JP2013193353
申请日：2013-09-18
申请人：国立大学法人東北大学 , Tohoku Univ , 日立金属株式会社 , Hitachi Metals Ltd
发明人： CHIBA MASAHIKO , UENO TOMONORI , SATO KOJI
IPC分类号： C22C19/05 , C22F1/10 , F01D5/28 , F01D25/00 , F02C7/00
摘要：【課題】特に、体積%でγ’量が35%以上のNi基超耐熱合金を溶製材として製造しても、熱間加工性を向上させて分塊に適した分塊用中間素材とその製造方法を提供する。【解決手段】再結晶化した等軸晶組織(鋳造組織は除く)を有するNi基超耐熱合金の分塊用中間素材である。また本発明は、鋳造後のNi基超耐熱合金塊に加工率15%以上の冷間加工を施した後、再結晶化温度以上の温度まで加熱させて、再結晶化した等軸晶組織とするNi基超耐熱合金の分塊用中間素材の製造方法であり、鋳造後のNi基超耐熱合金塊に1100℃以上の加熱温度で均質化熱処理を行った後、冷間加工するNi基超耐熱合金の分塊用中間素材の製造方法である。【選択図】図1
摘要翻译：要解决的问题：为了提供一种适于起霜的中间材料，其热加工性提高，即使γ'量（体积％）为35％以上的Ni系耐热超耐热合金为35％以上，作为锭料生产。解决方案：Ni基耐热超耐热合金的中间材料具有铸态结构以外的再结晶等轴晶体结构。制造Ni系耐热超耐热合金中间材料的方法包括将铸造后的Ni系耐热超耐热合金锭以15％以上的加工率进行冷加工，并加热至等于达到或高于再结晶温度以形成重结晶的等轴晶体结构。将铸造后的Ni系耐热超合金的锭子在1100℃以上的加热温度下进行均质化热处理，然后进行冷加工。

9. 发明专利

JP2012024779A Manufacturing method for anvil, and anvil 有权
标题翻译： ANVIL和ANVIL的制造方法
公开(公告)号：JP2012024779A
公开(公告)日：2012-02-09
申请号：JP2010162727
申请日：2010-07-20
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： SASAKI SHOHEI , SATO KOJI
IPC分类号： B21J13/06 , C22C19/05 , C22C38/00 , C22C38/52
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method for an anvil, which enables low cost and long life thereof, and the anvil obtained by the method.SOLUTION: The manufacturing method is for the anvil equipped with a base material composed of alloy tool steel and a striking surface composed of a precipitation-strengthened heat resistant alloy, wherein the striking surface is locally heated with the base material and the striking surface joined for precipitation-strengthening the precipitation-strengthened heat resistant alloy. The manufacturing method for the anvil which preferably further includes an intermediate layer composed of a solid solution-strengthened heat resistant alloy, between the base material composed of the alloy tool steel and the striking surface composed of the precipitation-strengthened heat resistant steel.
摘要翻译：要解决的问题：提供一种能够实现低成本和长寿命的砧座的制造方法以及通过该方法获得的砧座。解决方案：制造方法是用于配备有由合金工具钢构成的基材和由沉淀强化耐热合金组成的冲击面的砧座，其中冲击表面被基材局部加热和打击表面连接用于沉淀强化沉淀强化耐热合金。砧座的制造方法优选还包括由固溶强化耐热合金构成的中间层，在由合金工具钢构成的基材与由沉淀强化耐热钢构成的冲击面之间。版权所有（C）2012，JPO＆INPIT

10. 发明专利

JP2005334955A Solder alloy and solder ball 有权
标题翻译：焊接合金和焊球
公开(公告)号：JP2005334955A
公开(公告)日：2005-12-08
申请号：JP2004159208
申请日：2004-05-28
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： SHOJI TATSUYA , DATE MASAYOSHI , SATO KOJI
IPC分类号： B23K35/26 , C22C13/00 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a Pb-free solder alloy with which the strength of a joint boundary can be improved without damaging the fundamental mechanical properties and wettability of the conventional solder alloy, and to provide a solder ball.
SOLUTION: The solder alloy has a composition containing, by mass, 0.1 to
摘要翻译：要解决的问题：提供一种无铅焊料合金，其可以改善接头边界的强度而不损害常规焊料合金的基本机械性能和润湿性，并提供焊球。解决方案：焊料合金具有质量分数为0.1〜1.0％Ag，≤0.2％Ge，余量为不可避免的杂质。或者，焊料合金具有含有0.1〜1.0％Ag，0.1〜10％In，≤0.2％Ge，余量为不可避免的杂质的组成。焊料合金可以含有选自Fe，Ni，Co，Ru，Al，P和Ga中的一种或多种元素，总共≤0.1％。并且，提供具有上述组成成分的焊球。版权所有（C）2006，JPO＆NCIPI

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