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1. 发明专利

JP2006289474A Brazing filler metal sheet, its manufacturing method, and electronic component 审中-公开
标题翻译：烧结填充金属片，其制造方法和电子元件
公开(公告)号：JP2006289474A
公开(公告)日：2006-10-26
申请号：JP2005117010
申请日：2005-04-14
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： DATE MASAYOSHI , CHIWATA NOBUHIKO
IPC分类号： B23K35/14 , B22F3/02 , B23K35/30 , B23K35/40 , C22C5/06 , H01L21/52 , H05K3/34
CPC分类号： H01L24/29 , H01L2224/83101
摘要： PROBLEM TO BE SOLVED: To provide a Pb-free brazing filler metal sheet which solves the problem of degradation in bonding reliability caused by voids in a brazing filler metal and a compound phase formed between particles.
SOLUTION: The brazing filler metal sheet is composed of 70-90 mass% of Ag and the balance Sn, and has such a structure that a particle size of Ag is ≤300 μm and a particle size of Sn is ≤100 μm. A void ratio is ≤30%. Preferably, an aspect ratio of Ag particles is ≥1.2 on average.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决问题的方法：提供一种无铅钎焊料金属片，其解决了由钎料中的空隙引起的接合可靠性降低和颗粒间形成的化合物相的问题。解决方案：钎料金属片由70-90质量％的Ag和余量为Sn组成，具有Ag的粒径≤300μm，Sn的粒径≤100μm的结构。空隙率≤30％。优选地，Ag颗粒的纵横比平均为≥1.2。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2004122223A Electronic component and manufacturing method 审中-公开
公开(公告)号：JP2004122223A
公开(公告)日：2004-04-22
申请号：JP2002293787
申请日：2002-10-07
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： DATE MASAYOSHI , FUJIYOSHI MASARU
IPC分类号： B23K35/26 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To improve joining strength by inhibiting decrease in the thickness of terminals in electronic component parts equipped with terminals whose main component is Ag.
SOLUTION: A solder alloy is used which contains 3.0-5.0% Ag and 1.0% or less Cu in mass %, with the balance substantially composed of Sn, and which satisfies a relation between the Ag concentration C
Ag and Cu concentration C
Cu in the solder alloy as 2.0C
Ag + 1.2C
Cu ≥ 7.0. By soldering the terminals having Ag as the main component, the decrease in the thickness of terminals is reduced in electronic component parts. The solder alloy desirably contains, in mass %, 10% or less Bi, or 5.0% or less In. Further, it is preferable that the solder alloy contains one or more kinds elements having 1.0% or less in total mass % selectable from Al, Ni, Au, Sb, P and Zn.
COPYRIGHT: (C)2004,JPO

3. 发明专利

JP2014080355A Method for producing ceramic sintered body 有权
标题翻译：生产陶瓷烧结体的方法
公开(公告)号：JP2014080355A
公开(公告)日：2014-05-08
申请号：JP2013180949
申请日：2013-09-02
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： DATE MASAYOSHI , KUMAGAI TOMOMASA , FUKUSHIMA HIDEKO , YAMAMOTO TAKESHI
IPC分类号： C04B35/64 , C04B35/638
摘要： PROBLEM TO BE SOLVED: To provide a method for producing a ceramic sintered body, which can solve a problem that swelling, cracking or deformation occurs in a ceramic molded body or a degreased body in a degreasing step or firing step, and by which dimentional variation relative to a target external dimension is reduced.SOLUTION: Provided is a method for producing a ceramic sintered body comprising supporting a ceramic molded body formed by including a ceramic powder and a binder by a receiving surface provided on a bed in a degreaing step and/or a sintering step. The bed is formed by using a powder material which is not sintered under sintering conditions of the ceramic molding, and the receiving surface is formed into a shape corresponding to a part to be placed of the ceramic molding. It is preferable to use a crystalline silica powder as the powder material for forming the bed.
摘要翻译：要解决的问题：提供一种陶瓷烧结体的制造方法，其可以解决在脱脂工序或烧成工序中在陶瓷成形体或脱脂体中发生膨胀，开裂或变形的问题，相对于目标外部尺寸减小。解决方案：提供一种陶瓷烧结体的制造方法，其包括通过在脱酸步骤中设置在床上的接收表面来支撑通过包含陶瓷粉末和粘合剂而形成的陶瓷成型体和/ 或烧结步骤。该床通过使用在陶瓷模制件的烧结条件下未烧结的粉末材料形成，并且接收表面形成为与陶瓷模制件的待放置部分相对应的形状。优选使用结晶二氧化硅粉末作为形成床的粉末材料。

4. 发明专利

JP2009226481A Sn BASED SOLDER ALLOY, AND SOLDER BALL USING THE SAME 审中-公开
标题翻译：基于锡的焊接合金和使用相同的焊枪
公开(公告)号：JP2009226481A
公开(公告)日：2009-10-08
申请号：JP2009042073
申请日：2009-02-25
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： DATE MASAYOSHI , KAWADA TSUNEHIRO
IPC分类号： B23K35/26 , C22C13/00
摘要： PROBLEM TO BE SOLVED: To provide an Sb based solder alloy essentially consisting of Sn and solving both the problem of defects caused by the yellowing and the reduction of metallic luster upon the formation of a solder ball or the formation of a solder bump and the problem in the reduction of solderability caused by the addition of Ga and P elements, and to provide a solder ball.
SOLUTION: Disclosed is an Sn based solder alloy comprising, by mass, 0.5 to
摘要翻译：要解决的问题：提供一种基本上由Sn组成的Sb基焊料合金，并解决在形成焊球时由泛黄引起的缺陷和金属光泽减少的问题，或者形成焊料凸块以及由于添加Ga和P元素而引起的可焊性降低的问题，并提供焊球。解决方案：公开了一种Sn基焊料合金，其质量为0.5〜15ppm Ga，Sn系焊料合金的质量含量为≤50ppm.Sn系焊料合金适合用作球。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2009034692A Solder ball, and solder bump using the same 审中-公开
标题翻译：焊球和使用相同的焊工
公开(公告)号：JP2009034692A
公开(公告)日：2009-02-19
申请号：JP2007198938
申请日：2007-07-31
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： DATE MASAYOSHI , KAWADA TSUNEHIRO
IPC分类号： B23K35/26 , B22F9/08 , C22C13/00
摘要： PROBLEM TO BE SOLVED: To provide a solder ball which can solve the problem of defects in the deletion judgement, the height measurement, and the visual inspection of a solder bump defect due to the discoloration of the solder bump in soldering, and further to provide the solder bump using the same solder ball.
SOLUTION: The solder ball comprises 0.5 to 4.0 mass% of Ag, 0 to 1.0 mass% of Cu, 0.2 to 3 ppm of Cr, and the remainder composed of Sn and inevitable impurities. It is preferable that the density of Cr is higher in the surface than in the inside. Further, it is preferable that in the solder bump formed from the solder ball, the density of Cr in the surface is higher than that in the inside.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种焊球，其可以解决由于焊接中的焊料凸点的变色导致的焊料凸起缺陷的删除判断，高度测量和目视检查的缺陷的问题，以及进一步提供使用相同焊球的焊料凸块。
解决方案：焊球含有0.5〜4.0质量％的Ag，0〜1.0质量％的Cu，0.2〜3ppm的Cr，余量由Sn和不可避免的杂质构成。 Cr的密度优选比内侧高。此外，优选的是，在由焊锡球形成的焊料凸块中，表面中的Cr的密度高于内侧的密度。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2007043106A Lid material for airtight sealing and manufacturing method therefor, as well as package for electronic components 审中-公开
标题翻译：用于空气密封的制造材料及其制造方法，以及作为电子部件的包装
公开(公告)号：JP2007043106A
公开(公告)日：2007-02-15
申请号：JP2006171182
申请日：2006-06-21
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： DATE MASAYOSHI , YANO KENTARO , CHIWATA NOBUHIKO
IPC分类号： H01L23/02
摘要： PROBLEM TO BE SOLVED: To provide a lid material for airtight sealing that does not contain Pb, maintains a bonding state, even when soldering a package onto a circuit board, is advantageous in terms of cost, and eliminates the problem of degradation in airtightness due to crack generation. SOLUTION: One surface side of a foil material constituted of any one among Ag, Cu, or an alloy of a Ag-Cu system is provided with a metal layer that will be a lid material, and the other surface side of the foil material is a lid material for airtight sealing having an Sn layer, wherein preferably, the average thickness of the Ag or Cu foil material is 10 to 100 μm, and preferably, the average thickness of the alloy layer of the Fe-Ni system is 30 to 300 μm, and more preferably, an average thickness of the Sn layer is 10 to 30 μm. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供不含Pb的气密密封用盖材料，即使将包装焊接到电路板上也保持接合状态在成本方面是有利的，并且消除了劣化的问题由于裂纹的产生在气密性。解决方案：由Ag-Cu系或Ag-Cu系合金中的任一种构成的箔材的一个表面侧设置有作为盖材料的金属层，而另一面箔材料是用于气密密封的盖材料，其具有Sn层，其中优选地，Ag或Cu箔材料的平均厚度为10〜100μm，优选Fe-Ni系合金层的平均厚度为 30〜300μm，更优选Sn层的平均厚度为10〜30μm。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2003334688A Solder alloy and solder ball 有权
标题翻译：焊接合金和焊球
公开(公告)号：JP2003334688A
公开(公告)日：2003-11-25
申请号：JP2002144566
申请日：2002-05-20
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： DATE MASAYOSHI , SHOJI TATSUYA , SATO KOJI
IPC分类号： B23K35/26 , C22C13/00
摘要： PROBLEM TO BE SOLVED: To provide a lead-free solder alloy which can solve the problem of an interface damage with respect to the connecting strength by correctly controlling the growing behavior of an intermetallic compound formed in a boundary between the solder alloy and the electrode of an IC package or a printed board in the solder alloy used to connect an electronic component and to provide a solder ball.
SOLUTION: The solder alloy contains Ag of 5.0 mass% or less, Cu of 1.0 mass% or less, an oxygen of 10 to 50 ppm and the residue of Sn substantially. The solder ball made of the solder alloy is provided.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种无铅焊料合金，其可以通过正确地控制形成在焊料合金和焊料合金之间的边界中的金属间化合物的生长行为来解决相对于连接强度的界面损伤的问题用于连接电子部件的焊料合金中的IC封装的电极或印刷电路板，并提供焊球。＆lt; P＆gt;解决方案：焊料合金含有5.0质量％以下的Ag，1.0质量％以下的Cu，10〜50ppm的氧，Sn的残留量。提供由焊料合金制成的焊球。版权所有（C）2004，JPO

8. 发明专利

JP2003041397A Dummy ball for barrel plating 有权
标题翻译：用于棒球场的DUMMY球
公开(公告)号：JP2003041397A
公开(公告)日：2003-02-13
申请号：JP2001229607
申请日：2001-07-30
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： DATE MASAYOSHI , SATO KOJI , KUBOI TAKESHI
IPC分类号： B22D21/00 , B22D25/02 , B22D25/08 , C22C13/00 , C25D17/10 , C25D17/12 , C25D17/16
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive dummy ball for barrel plating free from Pb, which solves a problem of deformation in the dummy ball made from a Sn-based alloy so as not to contaminate a plating solution in barrel plating.
SOLUTION: The dummy ball for barrel plating includes one or two sorts of Ag of 5 mass% or less or Cu of 2 mass% or less, of 0.1 mass% or more, and the balance substantially Sn. The dummy ball preferably includes Ni of 0.01 mass% or more but 0.5 mass% or less.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了提供一种廉价的用于不含Pb的滚镀的虚拟球，其解决了由Sn基合金制成的假球中的变形问题，以便不会在滚镀中污染电镀液。解决方案：用于滚镀的虚拟球包括5质量％以下的Ag或2质量％以下的Cu，0.1质量％以上的Ag，余量基本上为Sn的1种或2种。虚拟球优选包含0.01质量％以上且0.5质量％以下的Ni。

9. 发明专利

JP2006272449A Brazing filler metal sheet 有权
标题翻译：烧结填充金属片
公开(公告)号：JP2006272449A
公开(公告)日：2006-10-12
申请号：JP2005099750
申请日：2005-03-30
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： DATE MASAYOSHI , CHIWATA NOBUHIKO , YANO KENTARO
IPC分类号： B23K35/14 , H01L21/52
CPC分类号： H01L24/29 , H01L2924/01029 , H01L2924/01327 , H01L2924/3512 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a brazing filler metal sheet which solves problems of degraded strength and lowered drop/impact resistance arising from formation of air gaps, and which contains no Pb and used for joining a semiconductor element for a power device system with large heat generation to a wiring board.
SOLUTION: The brazing filler metal sheet comprises an Sn layer on the surface of an Ag or a Cu foil. The average thickness of the Ag or Cu foil is, desirably, 20-200 μm and, more desirably, the average thickness of the Sn layer is 10-30 μm.
COPYRIGHT: (C)2007,JPO&INPIT

10. 发明专利

JP2005334955A Solder alloy and solder ball 有权
标题翻译：焊接合金和焊球
公开(公告)号：JP2005334955A
公开(公告)日：2005-12-08
申请号：JP2004159208
申请日：2004-05-28
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： SHOJI TATSUYA , DATE MASAYOSHI , SATO KOJI
IPC分类号： B23K35/26 , C22C13/00 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a Pb-free solder alloy with which the strength of a joint boundary can be improved without damaging the fundamental mechanical properties and wettability of the conventional solder alloy, and to provide a solder ball.
SOLUTION: The solder alloy has a composition containing, by mass, 0.1 to
摘要翻译：要解决的问题：提供一种无铅焊料合金，其可以改善接头边界的强度而不损害常规焊料合金的基本机械性能和润湿性，并提供焊球。解决方案：焊料合金具有质量分数为0.1〜1.0％Ag，≤0.2％Ge，余量为不可避免的杂质。或者，焊料合金具有含有0.1〜1.0％Ag，0.1〜10％In，≤0.2％Ge，余量为不可避免的杂质的组成。焊料合金可以含有选自Fe，Ni，Co，Ru，Al，P和Ga中的一种或多种元素，总共≤0.1％。并且，提供具有上述组成成分的焊球。版权所有（C）2006，JPO＆NCIPI

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