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    • 15. 发明专利
    • Semiconductor device
    • 半导体器件
    • JP2010182973A
    • 2010-08-19
    • JP2009026673
    • 2009-02-06
    • Sony Corpソニー株式会社
    • MASUI TAKESHIARAKIDA TAKAHIROKIKUCHI KAYOKONARUSE AKIKAZUOKI TOMOYUKISHIROKISHI NAOTERU
    • H01S5/187H01L21/312
    • H01S5/02276B82Y20/00H01S5/0425H01S5/06226H01S5/18311H01S5/1835H01S5/34313H01S2301/176
    • PROBLEM TO BE SOLVED: To provide a semiconductor element capable of improving the adhesive properties between a low dielectric-constant material and a semiconductor material.
      SOLUTION: A columnar mesa section 17 is provided on a substrate 10, where the columnar mesa section 17 includes a lower DBR layer 11, a lower spacer layer 12, an active layer 13, an upper spacer layer 14, an upper DBR layer 15, and a contact layer 16, in this order starting from the side of the substrate 10. An annular upper electrode 21 is provided on an upper surface of the mesa section 17, and an electrode pad 23, electrically connected to the upper electrode 21, is provided around the mesa section. A pedestal section 26 is provided directly below the electrode pad 23. The pedestal section 26 includes a ruggedness section 26A made of a semiconductor oxide; and an embedded section 26B made of a low dielectric-constant material. The ruggedness section 26A has a ruggedness structure, and the embedded section 26B is formed so that it embeds the ruggednesses of the ruggedness structure.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提供能够改善低介电常数材料和半导体材料之间的粘合性能的半导体元件。 解决方案:柱状台面部分17设置在基板10上,其中柱状台面部分17包括下DBR层11,下间隔层12,有源层13,上间隔层14,上DBR 层15和接触层16,从基板10的侧面开始。环形上电极21设置在台面部分17的上表面上,电极焊盘23电连接到上电极 21设置在台面部分周围。 基座部分26直接设置在电极焊盘23的下面。基座部分26包括由半导体氧化物制成的粗糙部分26A; 以及由低介电常数材料制成的嵌入部分26B。 坚固性部分26A具有坚固结构,并且嵌入部分26B形成为使其嵌入坚固结构的坚固性。 版权所有(C)2010,JPO&INPIT