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11. 发明专利

JP2005281803A Plating internal stress measurement program and plating internal stress measurement system 审中-公开
标题翻译：内部应力测量计划和内部应力测量系统
公开(公告)号：JP2005281803A
公开(公告)日：2005-10-13
申请号：JP2004099632
申请日：2004-03-30
申请人： Yamamoto Mekki Shikenki:Kk , 株式会社山本鍍金試験器
发明人： YAMAMOTO WATARU
IPC分类号： G01L1/00 , C25D19/00 , C25D21/12 , G01L5/00 , G01N3/00 , G01N3/08 , G01N27/00 , G01N27/416
CPC分类号： C25D21/12 , G01L5/0047 , G01N3/08 , G01N2203/0075
摘要： PROBLEM TO BE SOLVED: To provide a plating internal stress measurement program and plating internal stress measurement system capable of easily and exactly measuring the internal stress of a plating film in real time. SOLUTION: By installing the plating internal stress measurement system capable of measuring the strain of a cathode plate due to the plating film by a strain gage to a computer, the plating internal stress measurement program is configured to function the computer as a plating condition inputting means S 101 for inputting plating conditions, a formula data storing means for previously storing film thickness formula data and stress formula data, a film thickness calculating means S 108 for calculating the film thickness, a stress calculating means S 109 for calculating the stress, a calculation result storing means S 111 for storing the calculation results, and an outputting means S 110 for outputting the calculation results in real time. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种电镀内应力测量程序和电镀内应力测量系统，其能够实时地容易且精确地测量镀膜的内部应力。
解决方案：通过安装能够通过应变计将电镀膜测量阴极板的应变的电镀内部应力测量系统到计算机，电镀内部应力测量程序被配置为使计算机作为电镀用于输入电镀条件的条件输入装置S101，用于预先存储膜厚公式数据和应力公式数据的公式数据存储装置，用于计算膜厚度的膜厚度计算装置S108，用于计算应力的应力计算装置S 109 ，用于存储计算结果的计算结果存储装置S111和用于实时输出计算结果的输出装置S 110。版权所有（C）2006，JPO＆NCIPI

12. 发明专利

JP2004360032A Cistern 有权
公开(公告)号：JP2004360032A
公开(公告)日：2004-12-24
申请号：JP2003161657
申请日：2003-06-06
申请人： Yamamoto Mekki Shikenki:Kk , 株式会社山本鍍金試験器
发明人： YAMAMOTO WATARU
IPC分类号： C25D17/00 , C23C18/16 , C25D17/02 , C25D17/16 , C25D21/06 , C25D21/10
CPC分类号： C23C18/1619 , C23C18/1669 , C25D17/02 , C25D21/10
摘要： PROBLEM TO BE SOLVED: To provide a cistern adapted so that the liquid stored therein may not form a vortex when the liquid is stirred to uniformize its concentration or temperature distribution.
SOLUTION: The cistern 1 is partitioned with a partition 11 of a specified height into a liquid storage tank 12 for storing a liquid L and a stirring tank 13 for stirring the liquid L. During the operation of the cistern 1, a stirrer 15 held in the stirrer holder 16 of the tank 13 is rotated to stir the liquid L stored in the tank 13, while the liquid L flowing from the tank 13 into the holder 16 is delivered to a liquid feed passage 17 by rotating the stirrer 15. The liquid L delivered to the passage 17 flows into the tank 12 through a liquid feed port 14.
COPYRIGHT: (C)2005,JPO&NCIPI

13. 发明专利

JP2013185241A Plating apparatus and method for producing plated object 有权
标题翻译：制造设备的制造装置和方法
公开(公告)号：JP2013185241A
公开(公告)日：2013-09-19
申请号：JP2012053761
申请日：2012-03-09
申请人： Yamamoto Mekki Shikenki:Kk , 株式会社山本鍍金試験器 , Fujimi Inc , 株式会社フジミインコーポレーテッド
发明人： YAMAMOTO WATARU , AKIYAMA KATSUNORI , KOIWA HITOKO , ITO JUN
IPC分类号： C25D15/02
摘要： PROBLEM TO BE SOLVED: To provide a plating apparatus and a method for producing a plated object, wherein an amount of a granular material adhered is suitably ensured, also variation in distribution of the granular material adhered to an object to be plated becomes small, and further the amount of the granular material adhered to the object to be plated is easily controlled.SOLUTION: A production apparatus 100 of a wire saw 1 allows abrasive grains 4 to adhere to the outer peripheral surface of the wire 2 by performing electroplating. The production apparatus 100 includes an interior plating bath 32 containing a plating liquid 32b and a precipitation layer 32c obtained when the abrasive grains 4 precipitate in the plating liquid 32b. While the wire 2 is penetrated into the precipitation layer 32c from the bottom 32a or a side part 32f of the interior plating bath 32, the abrasive grains 4 adhere to the wire 2 in a part X which intersects with the surface 32c1 of the precipitation layer 32c by moving the wire 2 in the direction intersecting with the surface 32c1 of the precipitation layer 32c.
摘要翻译：要解决的问题：为了提供电镀装置和电镀对象的制造方法，其中适当地确保了附着的颗粒材料的量，附着在被镀物体上的颗粒状物质的分布变小，另外，容易控制附着于被镀物体的粒状材料的量。线锯1的制造装置100通过进行电镀使磨粒4附着在线2的外周面上。制造装置100具有包含电镀液32b的内部镀浴32和当磨粒4在电镀液32b中析出时得到的沉淀层32c。当线材2从内部镀浴32的底部32a或侧面部分32f穿入沉淀层32c时，磨料颗粒4在与沉淀层的表面32c1相交的部分X中粘附到线材2上 32c，通过在与沉淀层32c的表面32c1相交的方向上移动线材2。

14. 发明专利

JP2009287093A Cathode cartridge for electroplating 有权
标题翻译：电镀用阴极盒
公开(公告)号：JP2009287093A
公开(公告)日：2009-12-10
申请号：JP2008141847
申请日：2008-05-30
申请人： Yamamoto Mekki Shikenki:Kk , 株式会社山本鍍金試験器
发明人： YAMAMOTO WATARU , AKIYAMA KATSUNORI , HARADA FUMIO
IPC分类号： C25D17/08 , C25D7/12 , C25D17/10 , H01L21/288
摘要： PROBLEM TO BE SOLVED: To provide a cathode cartridge for electroplating, which does not damage a silicon wafer even if electrical insulators exert a large sandwiching force on the silicon wafer.
SOLUTION: The cathode cartridge 1 for electroplating, which is used for sandwiching the silicon wafer W between a pair of the electrical insulators 2 and 3 and immersing the workpiece into a plating solution to form a plated film on a part exposed from an opening 4 of the electrical insulators on the silicon wafer W, is configured by forming a ring-shaped recess 5 on a mating face of the electrical insulator 3 so as to surround the opening 4 of the electrical insulator, accommodating and arranging a ring member 6 in the recess 5 in a state of making a sealing member 7 closely adjacent to the inner and outer circumferences of the ring member 6, and implanting a plurality of pin members 10 on the ring member 6 at an equal space in a circumferential direction. The pin member 10 includes: a housing which is inserted into bores 34 and 35 of the ring member 6; the body of the pin which is stored in the housing so as to be freely movable therein and projects its tip from the housing; and a spring which has been stored in the housing and energizes the body of the pin.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：即使电绝缘体在硅晶片上施加大的夹持力，也可以提供不会损坏硅晶片的电镀阴极筒。解决方案：用于电镀的阴极筒1，其用于将硅晶片W夹在一对电绝缘体2和3之间，并将工件浸入电镀溶液中，以在暴露于通过在电绝缘体3的配合面上形成环状的凹部5，以包围电绝缘体的开口部4，容纳并配置环状部件6，形成硅晶片W上的电绝缘体的开口部4 在形成密封构件7的状态下的凹部5处于与环构件6的内周和外周紧密相邻的状态，并且在周向上以相等的空间将多个销构件10植入环构件6。销构件10包括：插入环构件6的孔34和35中的壳体; 所述销的主体被存储在所述壳体中以便在其中自由移动并将其尖端从所述壳体突出; 以及已经存储在壳体中并且激励销的主体的弹簧。版权所有（C）2010，JPO＆INPIT

15. 发明专利

JP2008013806A Plating device 审中-公开
标题翻译：电镀设备
公开(公告)号：JP2008013806A
公开(公告)日：2008-01-24
申请号：JP2006185533
申请日：2006-07-05
申请人： Yamamoto Mekki Shikenki:Kk , 株式会社山本鍍金試験器
发明人： YAMAMOTO WATARU , HAMAZAKI HISAMI , HOSHINO YOSHIAKI
IPC分类号： C25D13/22 , C25D17/16
摘要： PROBLEM TO BE SOLVED: To provide a plating device where the variation of electric current flowing through a workpiece at the inside of a drum therein and the state of a plating liquid at the inside of the drum are reproduced, and testing can be performed regarding the influence of them on the formation of a plating film. SOLUTION: The plating device 1 comprises: a plating tank 10 storing a plating liquid, and divided into a first storage part and a second storage part by a blocking plate 13 provided with a space 13S formed by sliding plates 13a, 13a; a drum 20 arranged at the first storage part in a vertical state, having an opening part 26 at the side wall part 21, and rotating so as to be abutted against the sliding plates 13a, 13a in such a manner that the side wall part 21 clogs the space 13S; the object 30 to be plated arranged at the inside of the drum 20 and rotating; a driving mechanism 40 allowing the drum 20 and the object 30 to be plated to have a rotating speed difference each other, and rotatively driving them; and an anode 50 arranged at the second storage part. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种电镀装置，其中再现流过滚筒内部的工件的电流的变化以及滚筒内部的电镀液体的状态，并且可以测试关于它们对镀膜形成的影响。电镀装置1包括：电镀槽10，其容纳电镀液，并且由设置有由滑板13a，13a形成的空间13S的阻挡板13分割成第一存储部和第二存储部; 以纵向状态布置在第一存储部分的滚筒20，在侧壁部分21处具有开口部分26，并且以与侧板部分21的侧壁部分21相接触的方式旋转堵塞空间13S; 被镀物体30布置在滚筒20的内部并旋转; 驱动机构40，其允许滚筒20和物体30被电镀以具有彼此的旋转速度差异，并且可旋转地驱动它们; 以及布置在第二存储部分处的阳极50。版权所有（C）2008，JPO＆INPIT

16. 发明专利

JP2007107104A Cistern 有权
标题翻译：水塔
公开(公告)号：JP2007107104A
公开(公告)日：2007-04-26
申请号：JP2007022550
申请日：2007-02-01
申请人： Yamamoto Mekki Shikenki:Kk , 株式会社山本鍍金試験器
发明人： YAMAMOTO WATARU
IPC分类号： C25D17/00 , C25D21/10
摘要： PROBLEM TO BE SOLVED: To provide a cistern adapted so that the liquid stored therein may not form a vortex when the liquid concentration or temperature distribution is uniformalized. SOLUTION: The cistern 1 is partitioned with a partition 11 of a specified height into a liquid storage tank 12 for storing a liquid L and a stirring tank 13 for stirring the liquid L. During the operation of the cistern 1, a stirrer 15 held in the stirrer holder 16 of the tank 13 is rotated to stir the liquid L stored in the tank 13, while the liquid L flowing from the tank 13 into the holder 16 is delivered to a liquid feed passage 17 by rotating the stirrer 15. The liquid L delivered to the passage 17 flows into the tank 12 through a liquid feed port 14. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种适于使得当液体浓度或温度分布均匀化时储存在其中的液体不会形成涡流的水箱。解决方案：将水箱1用特定高度的隔板11分隔成用于储存液体L的储液箱12和用于搅拌液体L的搅拌槽13.在水箱1的操作过程中，搅拌器旋转容器13的搅拌器支架16的旋转状态15搅拌储存在槽13中的液体L，同时通过旋转搅拌器15将从罐13流入保持器16的液体L输送到液体供给通道17 输送到通道17的液体L通过液体供给口14流入槽12中。（C）2007，JPO＆INPIT

17. 发明专利

JP2006299367A Electroplating tester 审中-公开
标题翻译：电镀测试仪
公开(公告)号：JP2006299367A
公开(公告)日：2006-11-02
申请号：JP2005125538
申请日：2005-04-22
申请人： Yamamoto Mekki Shikenki:Kk , 株式会社山本鍍金試験器
发明人： YAMAMOTO WATARU , AKIYAMA KATSUNORI , KATSUMOTO TOKIKO
IPC分类号： C25D21/12 , C25D17/08 , C25D17/10 , C25D17/12
CPC分类号： C25D17/008 , C25D7/123 , C25D17/001
摘要： PROBLEM TO BE SOLVED: To form a plating film on the whole surface of the face to be plated in such a manner that its film thickness is made uniform, to improve the quality of the plating film, and further to attain the miniaturization and simplification of the device.
SOLUTION: At the inside of a water tank 10, a cathode 30 and an anode 20 are arranged parallelly and horizontally in such a manner that the cathode 30 comes to the lower side and the anode 20 comes to the upper side. Further, a side plate 10B of the water tank 10 is provided with an opening 17 for inserting the anode 20 and the cathode 30 into the water tank 10, and further provided with a closing plate 40 for closing the opening 17. Also, the side plates 10b, and 10C of the water tank are provided with groove parts 18A, 18B for holding the anode 20 to a horizontal state. Further, the cathode 30 is fitted in a cantilevering support state to the closing plate 40.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了使其膜厚均匀的方式在被镀面的整个表面上形成镀膜，以提高镀膜的质量，并且进一步实现小型化并简化设备。解决方案：在水箱10的内部，阴极30和阳极20以使得阴极30进入下侧并且阳极20到达上侧的方式平行和水平地布置。此外，水箱10的侧板10B设置有用于将阳极20和阴极30插入水箱10中的开口17，并且还设置有用于封闭开口17的封闭板40.另外，侧水箱的板10b和10C设置有用于将阳极20保持在水平状态的槽部18A，18B。此外，阴极30以悬臂支撑状态装配到封闭板40上。（C）2007，JPO＆INPIT

18. 发明专利

JP2005221269A Electrode cartridge and plating internal stress measuring system 有权
标题翻译：电极盒和镀层内应力测量系统
公开(公告)号：JP2005221269A
公开(公告)日：2005-08-18
申请号：JP2004027300
申请日：2004-02-03
申请人： Yamamoto Mekki Shikenki:Kk , 株式会社山本鍍金試験器
发明人： YAMAMOTO WATARU , AKIYAMA KATSUNORI , HARADA FUMIO , TSURU YUTAKA
IPC分类号： G01L1/00 , C25D21/12 , G01L1/22
CPC分类号： C25D21/12
摘要： PROBLEM TO BE SOLVED: To provide an electrode cartridge and a plating internal stress measuring system capable of accurately and easily measuring internal stresses of plated films through the use of a strain gauge.
SOLUTION: The electrode cartridge 10 is constituted of: a negative plate supporting part 11 for supporting a negative plate C in a plating solution to which the strain gauge is mounted at the back surface of a part CP to be plated; a positive plate supporting part 12 for supporting a positive plate A in the plating solution opposed to the negative plate C at a prescribed interval from the negative plate C; a shielding plate 13 arranged between the negative plate C and the positive plate A; and a positive plate surrounding part 14 for surrounding the periphery and lower end of the positive plate A in the plating solution. In the shielding plate 13, a through hole 13a of a prescribed shape is formed at a location oppose to the part to be plated of the negative plate. An opening part 14a of a prescribed shape is formed at a location opposed to the part to be plated of the negative plate in the positive plate surrounding part 14.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够通过使用应变仪来精确且容易地测量电镀膜的内应力的电极盒和电镀内应力测量系统。电极盒10由负极板支撑部11构成，负极板支撑部11用于将电镀液中的负极板C支撑在应变计安装在被镀部分CP的背面的电镀液中; 用于从负极板C以规定的间隔将正极板A支撑在与负极板C相对的镀液中的正极板支撑部分12; 布置在负极板C和正极板A之间的屏蔽板13; 以及围绕部分14的正极板，用于围绕电镀液中的正极板A的周边和下端。在屏蔽板13中，在与负极板的被镀部分相对的位置处形成规定形状的通孔13a。规定形状的开口部分14a形成在与围绕部分14的正极板中的负极板的被镀部分相对的位置。（C）2005年，JPO＆NCIPI

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