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    • 13. 发明专利
    • ION BEAM SURFACE ANALYSIS
    • JPH06281601A
    • 1994-10-07
    • JP9235293
    • 1993-03-26
    • ULVAC CORP
    • HIROSE MASATAKAYOKOYAMA ARATAZUBINIEFU RAJIMUSUKIIAGAWA YOSHIAKISAKURADA YUZO
    • G01N23/225
    • PURPOSE:To measure trace impurities contained in an extremely shallow part of a sample by setting the energy region of an ion beam at an intermediate region and detecting scattered particles with a semiconductor detector. CONSTITUTION:The output of a semiconductor detector 33 is connected to a high-voltage cable 34 and a current introducing terminal 35 fixed to the wall section of an analysis chamber 13 and further connected to a preamplifier through a high-voltage signal cable 36. The detector 33 is fitted to a rotatable arm 39 and, as the arm 39 is rotated in accordance with a prefixed program, the detector 33 measures energy spectra at every prescribed angle. When the current amount of an ion beam 31 is maintained at a fixed level by monitoring the beam 31 with a charge integrator during the measurement, the intensity distribution of scattered particles around the center of a sample 16 and the two-dimensional information about the energy spectra at each point can be measured in a short time. When the energy of the beam 31 is lowered to a 200keV area, the detector 33 which receives particles scattered by the sample can detect trace impurities contained in an extremely shallow part of the sample 16 near the surface in a short time even when the content is very small.
    • 15. 发明专利
    • ION IMPLANTATING DEVICE
    • JPH046739A
    • 1992-01-10
    • JP10645390
    • 1990-04-24
    • ULVAC CORP
    • TSUKAGOSHI OSAMUSAKURADA YUZOKATAGAWA TAKESHI
    • H01J37/317H01L21/265
    • PURPOSE:To perform ion implantation via the scanning with parallel scan beams fed to a large-area ion radiation face at the same incident angle by providing two multi-pole electrostatic deflectors with the preset structure mode. CONSTITUTION:Ions generated by an ion source 1 are removed with neutral particles via a two-pole electrostatic deflector 5 through a mass separator 2 and implanted to a substrate 8 through multi-pole electrostatic deflectors 6, 7. The first multi-pole electrostatic deflector 6 of two multi-pole electrostatic deflectors has four or more poles. The other second multi-pole electrostatic deflector 7 is arrange around the same optical axis behind the first electrostatic deflector 6, it has poles twice the number of poles of the first electrostatic deflector 6, and it deflects the ion beam deflected by the first electrostatic deflector 6 in the invariably constant direction against the surface of the substrate 8. The uniform range of the electric field in the cross section of the deflector is increased, and parallel scanning can be performed on the large substrated 8.
    • 17. 发明专利
    • HIGH CURRENT ION IMPLANTING APPARATUS
    • JPS62195842A
    • 1987-08-28
    • JP3749286
    • 1986-02-24
    • ULVAC CORP
    • SAKURADA YUZO
    • H01L21/265H01J37/317
    • PURPOSE:To make it possible to observe the form variation of ion beams, by furnishing a movable probe in the passage of ion beams to a wafer, and arranging a display unit to display the beam current flowing to the probe. CONSTITUTION:In the ion beam passage 17 between an analyzer magnet 6 and a wafer 7, a probe 9 made of tungsten is furnished to move freely, and a display unit 10 is furnished to display the moving position of the probe 9 and the beam current flowing to the probe 9 at the position. If any variation is produced, the operational condition of the ion implanting apparatus is adjusted to return to the original condition. If the ion beam current is converted to the form shown as the curve C while the ion implanting is carried out in the ion beam section form as the curve A, the position of ion beam pickup electrodes 3a and 3b of the ion implanting apparatus are adjusted to restore to the curve A, and the uneven ion distribution on the wafer 7 can be prevented. In such a way, the variation of the section form and the direction can be observed.