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    • 2. 发明专利
    • ION INPLANTER AND ION IMPLANTATION
    • JPH11345586A
    • 1999-12-14
    • JP13778198
    • 1998-05-01
    • ULVAC CORP
    • SAKURADA YUZO
    • H01J37/317H01L21/265
    • PROBLEM TO BE SOLVED: To uniformly implant low-energy impurity ions into a semiconductor wafer at a large beam current and to control the condition of this implantation using one semiconductor chip in the wafer as the unit of implantation. SOLUTION: In this ion implantation, boron ions generated from an ion source 1 at an accelerating voltage of 1 kV are given an energy of 20 keV by an extraction electrode 2 having an extraction voltage of -19 kV, are transported through a beam line part 10B without diverging, decelerated by a decelerating electrode 6, and further decelerated to ground potential at a ground electrode to obtain an ion beam L with an energy of 1 keV. Next, the ion beam L is passed via a deflector 9 through a mask 12 placed nearby and is made to impinge on a chip in a wafer W moved to an incident position. In short, a platen 15 holding the wafer W is mechanically scanned in X and Y directions by a mechanical drive mechanism.
    • 4. 发明专利
    • SURFACE ANALYZING AND ION IMPLANTING DEVICE
    • JPH06281602A
    • 1994-10-07
    • JP9235193
    • 1993-03-26
    • ULVAC CORP
    • HIROSE MASATAKAYOKOYAMA ARATAZUBINIEFU RAJIMUSUKIIAGAWA YOSHIAKISAKURADA YUZO
    • G01N23/225H05H7/08
    • PURPOSE:To obtain a surface analyzing and ion implanting device which can perform both surface analysis and ion implantation with a compact constitution without taking out an ion-implanted sample into the air. CONSTITUTION:In a sample chamber 50, a goniometer 21 is provided and a sample which is irradiated with an ion beam arriving at the sample through collimated apertures 17a and 17b is held in a state where the sample is counterposed to the meter 21. In addition, a sample holder 112 is also provided in the chamber 50 so that the holder 12 can move between the ion implanting position and sample receiving and delivering position and can receive the sample attached to the front end section of a sample carrying rod 41 at the sample receiving and delivering position. The holder 112 can also transfer the sample from the sample receiving and delivering position and transfer the ion-implanted sample to a sample holding section by moving the rod 41 forward and backward after stopping at a position near the meter 21. Moreover, the holder 112 can take out the sample from a preparatory chamber 40 after surface analysis by receiving the sample with its front end section.
    • 8. 发明专利
    • ION IMPLANTER
    • JPH01232652A
    • 1989-09-18
    • JP5641588
    • 1988-03-11
    • ULVAC CORP
    • TSUKAGOSHI OSAMUSAKURADA YUZOKASHIMOTO KAZUHIRO
    • H01J37/317H01J37/147
    • PURPOSE:To have uniform ion implantation by furnishing a deflection system, in which No.1 multi-polar electrostatic deflector and No.2 multi-polar electrostatic deflector are installed in specified arrangement, and a scanning control means for scanning in a regularly formed polygonal region having a certain number of edge members. CONSTITUTION:Multi-polar deflection voltage is impressed on electrodes of No, 1 multi-polar electrostatic deflector 6, while a deflection voltage in the same phase and similar waveform as to the waveform of this mentioned multi-polar deflection voltage is impressed on the mating electrodes of No.2 multi-polar electrostatic deflector 7. This voltage waveform includes an ion beam and a target 6 to scan a region in regular polygon having the same number of edge members or its multiple as the No.1, No.2 multi-polar electrostatic deflectors 6, 7. The same deflection voltage is impressed on the electrodes of No.1 deflector 6 and the mating electrodes of No. 2 deflector 7, and its voltage waveform is decided in the same manner as mentioned above.