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11. 发明专利

JPH11277411A Grinding device for substrate 失效
标题翻译：基板研磨装置
公开(公告)号：JPH11277411A
公开(公告)日：1999-10-12
申请号：JP9688398
申请日：1998-03-25
申请人： Ebara Corp , 株式会社荏原製作所
发明人： HIROKAWA KAZUTO , HIYAMA HIROKUNI , WADA TAKETAKA , MATSUO NAONORI
IPC分类号： B24B37/00
摘要： PROBLEM TO BE SOLVED: To provide a grinding device for substrates capable of continuously supplying a very small amount of water or solution instead of droplets of water to the grinding surface of a grinding wheel.
SOLUTION: In a grinding device for substrates, which grinds the surface to be ground of the substrate 4 flat and mirror-finished by sliding the grinding wheel 15 on the substrate 4, a nozzle 10 for supplying water or solution to the grinding surface of the grinding wheel 15 or the surface to be ground of the substrate, is provided. The tip position of the nozzle 10 is arranged close to the grinding surface of the grinding wheel to a degree that no liquid-drops cannot be formed between the tip of the nozzle 10 and the grinding surface of the grinding wheel 15 or the surface to be ground of the substrate 4.
COPYRIGHT: (C)1999,JPO
摘要翻译：要解决的问题：提供一种用于能够连续地将少量水或溶液代替水滴供给到研磨轮的研磨表面的基板的研磨装置。解决方案：在用于研磨基板4的被研磨表面的研磨装置中，通过将砂轮15滑动到基板4上而平坦地进行镜面抛光，用于将水或溶液供给到研磨表面的喷嘴10 提供了砂轮15或待研磨的基体的表面。喷嘴10的尖端位置配置在砂轮的研磨面附近，不能在喷嘴10的前端与砂轮15的研磨面或表面之间不形成液滴基板4的地面。

12. 发明专利

JP2015044245A 研磨方法および研磨装置有权
标题翻译：抛光方法和抛光装置
公开(公告)号：JP2015044245A
公开(公告)日：2015-03-12
申请号：JP2013175471
申请日：2013-08-27
申请人：株式会社荏原製作所 , Ebara Corp
发明人： MARUYAMA TORU , MATSUO NAONORI , MOTOJIMA YASUYUKI
IPC分类号： B24B37/015 , B24B37/34 , H01L21/304
CPC分类号： B24B37/015 , B24B49/14 , G01J5/025 , G01J2005/0085
摘要：【課題】研磨パッドの表面温度を調整することにより研磨レートを向上させることができるとともに研磨される基板の研磨プロファイルも制御することができる研磨方法および研磨装置を提供する。【解決手段】研磨テーブル上の研磨パッドに基板を押圧して基板を研磨する研磨方法において、研磨パッド3の表面温度を調整する研磨パッド3の表面温度調整工程と、調整された表面温度にある研磨パッド3に基板を押圧して基板を研磨する研磨工程とを備え、研磨パッド3の表面温度調整工程は、研磨工程中、研磨パッド3の表面の半径方向における温度プロファイルの温度変化率が研磨パッド半径方向において一定となるように、基板が接触する研磨パッド3の領域の一部分における表面温度を調整する。【選択図】図1
摘要翻译：要解决的问题：提供一种可以通过调整抛光垫的表面温度来提高抛光速度的抛光方法和抛光装置，并且可以控制待抛光的基板的抛光轮廓。解决方案：抛光抛光方法通过将基板压在抛光台上的抛光垫上的基板包括：调整抛光垫3的表面温度的抛光垫3的表面温度调节过程; 以及通过在调整的表面温度下将基板压在抛光垫3上来研磨基板的抛光工艺。在抛光垫3的表面温度调节过程中，调整与基板接触的抛光垫3的一部分区域的表面温度，使得在径向上的温度分布的温度变化率在抛光过程中抛光垫3的表面的方向在抛光垫径向方向上变得恒定。

13. 发明专利

JP2014172156A Property measuring device for polishing liquid 有权
标题翻译：用于抛光液体的物性测量装置
公开(公告)号：JP2014172156A
公开(公告)日：2014-09-22
申请号：JP2013049687
申请日：2013-03-12
申请人： Ebara Corp , 株式会社荏原製作所 , Kyushu Institute Of Technology , 国立大学法人九州工業大学
发明人： MATSUO NAONORI , MOCHIZUKI NOBUHIRO , SUZUKI YOSHITOMO , FUKAGAWA HIRONOBU , KIMURA KEIICHI , KHAJORNRUNGRUANG PANART
IPC分类号： B24B37/00 , B24B37/34 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a property measuring device for a polishing liquid capable of stably and directly measuring the property of the polishing liquid existing on an abrasive pad.SOLUTION: A property measuring device for a polishing liquid includes: a polishing liquid storage mechanism 6 for storing a polishing liquid by damming the polishing liquid on an abrasive pad 2; and a sensor 7 for measuring the property of the polishing liquid stored in the polishing liquid storage mechanism 6. The sensor 7 is capable of directly measuring pH or ORP (oxidation reduction potential) of the polishing liquid so as to be used for controlling polishing conditions, such as a condition of supplying the polishing liquid.
摘要翻译：要解决的问题：提供一种能够稳定且直接地测量存在于研磨垫上的抛光液的性质的抛光液性质测量装置。解决方案：一种用于抛光液的性质测量装置，包括：抛光液储存机构 6，用于通过将抛光液体阻挡在研磨垫2上来存储抛光液; 以及用于测量存储在抛光液体存储机构6中的抛光液的性质的传感器7.传感器7能够直接测量抛光液的pH或ORP（氧化还原电位），以用于控制抛光条件，例如提供抛光液的条件。

14. 发明专利

JP2013022664A Polishing apparatus and polishing method 有权
标题翻译：抛光装置和抛光方法
公开(公告)号：JP2013022664A
公开(公告)日：2013-02-04
申请号：JP2011158080
申请日：2011-07-19
申请人： Ebara Corp , 株式会社荏原製作所
发明人： MARUYAMA TORU , MOTOJIMA YASUYUKI , MATSUO NAONORI
IPC分类号： B24B37/015 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a polishing apparatus and polishing method in which a temperature of a surface (polishing surface) of a polishing pad is controlled by blowing gas to the polishing pad during polishing of a substrate such as a semiconductor wafer or the like so that step difference characteristics can be improved by preventing dishing, erosion, and the like, and a polishing rate can be improved.SOLUTION: The polishing apparatus includes at least one gas ejection nozzle 22 ejecting the gas to the polishing pad 2, and a gas supply part 20 holding the at least one gas ejection nozzle 22 and supplying the gas to the gas ejection nozzle 22. When concentric circles C1 and C2 which pass points P1 and P2 disposed right below the at least one gas ejection nozzle 22, and center around the rotation center of the polishing pad 2 are drawn, and the tangent direction at the points P1 and P2 right below the concentric circles C1 and C2 is defined as the rotational tangent direction of the polishing pad 2, the gas ejection direction of the at least one gas ejection nozzle 22 is tilted toward the rotation center side of the polishing pad 2 with respect to the rotation tangent direction.
摘要翻译：要解决的问题：提供一种抛光装置和抛光方法，其中通过在诸如半导体晶片的基板的研磨期间将抛光垫吹送到抛光垫来控制抛光垫的表面（抛光表面）的温度可以通过防止凹陷，侵蚀等改善阶梯差特性，并且可以提高抛光速率。解决方案：抛光装置包括将气体喷射到抛光垫2的至少一个气体喷射喷嘴22和保持至少一个气体喷射喷嘴22并将气体供应到气体喷射喷嘴22的气体供应部分20 当通过设置在至少一个气体喷射嘴22正下方并且围绕抛光垫2的旋转中心的中心的点P1和P2的同心圆C1和C2被拉出，并且点P1和P2的切线方向正对在同心圆C1和C2的下方被定义为抛光垫2的旋转切线方向，至少一个气体喷射嘴22的气体喷射方向相对于旋转方向朝抛光垫2的旋转中心侧倾斜切线方向版权所有（C）2013，JPO＆INPIT

15. 发明专利

JP2012139739A Polishing device, and polishing method 有权
标题翻译：抛光装置和抛光方法
公开(公告)号：JP2012139739A
公开(公告)日：2012-07-26
申请号：JP2010291822
申请日：2010-12-28
申请人： Ebara Corp , 株式会社荏原製作所
发明人： MATSUO NAONORI , ISHII YU , ONO KATSUTOSHI
IPC分类号： B24B37/015 , B24B37/00 , B24B37/005 , B24B49/10 , B24B49/12 , B24B49/14 , B24B49/16 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To control a temperature of a polishing pad by spraying a gas to a surface of the polishing pad, suppress deterioration of a polishing rate due to an insufficient polishing liquid feed rate to a polishing interface between a substrate and the polishing pad, and maintain the polishing rate appropriately.SOLUTION: A polishing method includes the steps of controlling the temperature of the polishing pad by spraying the gas to the polishing pad, and polishing the substrate by bringing the substrate into sliding contact with the surface of the polishing pad to which the polishing liquid is fed. A gas flow rate sprayed to the polishing pad at polishing of the substrate and a polishing liquid flow rate fed to the polishing pad are mutually interlocked. For instance, the polishing liquid flow rate fed to the polishing pad at the polishing of the substrate is adjusted based on data showing correlations between the gas flow rate sprayed to the polishing pad at the polishing of the substrate and the required polishing liquid flow rate fed to the polishing pad.
摘要翻译：要解决的问题：为了通过向抛光垫的表面喷射气体来控制抛光垫的温度，抑制由于研磨液进料速率不足而引起的研磨速度的劣化，所述抛光速率与基板和抛光垫，并适当地保持抛光速率。解决方案：抛光方法包括以下步骤：通过将气体喷射到抛光垫来控制抛光垫的温度，并且通过使衬底与抛光垫的表面滑动接触来抛光衬底液体进料。在抛光衬底时喷射到抛光垫的气体流速和馈送到抛光垫的抛光液体流量相互互锁。例如，基于在衬底的研磨时喷射到抛光垫的气体流量与所要求的抛光液体流量之间的相关性的数据，调整在基板研磨时供给到抛光垫的抛光液体流量到抛光垫。版权所有（C）2012，JPO＆INPIT

16. 发明专利

JP2010247258A Polishing apparatus and polishing method 有权
标题翻译：抛光装置和抛光方法
公开(公告)号：JP2010247258A
公开(公告)日：2010-11-04
申请号：JP2009097692
申请日：2009-04-14
申请人： Ebara Corp , 株式会社荏原製作所
发明人： ISHII YU , SHIOKAWA YOICHI , MATSUO NAONORI
IPC分类号： B24B37/00 , B24B49/02 , B24B49/10 , B24B49/12 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To allow more precise control of a polishing profile to be performed without carrying out many polishing tests in advance. SOLUTION: A polishing apparatus includes: a polishing table 22 having a polishing surface 52a; a top ring 24 for holding a polishing object W and pressing it against the polishing surface 52a; a polishing liquid supply nozzle 26 for supplying a polishing liquid to the polishing surface 52a; a movement mechanism 70 for moving a polishing liquid supply position 26a of the polishing liquid supply nozzle 26 approximately along a radial direction of the polishing surface 52a; a controller 66 for controlling the movement mechanism 70; and a simulator 72 for predicting the relationship between the polishing liquid supply position 26a of the polishing liquid supply nozzle 26 and the polishing profile, performing a simulation and outputting data to the controller. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：允许更精确地控制要执行的抛光轮廓，而不进行许多抛光测试。解决方案：抛光装置包括：抛光台22，具有抛光表面52a; 用于保持抛光对象W并将其按压在抛光表面52a上的顶环24; 用于将抛光液供给到研磨面52a的研磨液供给喷嘴26; 移动机构70，其用于使抛光液供给喷嘴26的研磨液供给位置26a大致沿研磨面52a的径向移动; 用于控制移动机构70的控制器66; 以及用于预测抛光液供给喷嘴26的抛光液供给位置26a与抛光轮廓之间的关系的模拟器72，执行模拟并向控制器输出数据。版权所有（C）2011，JPO＆INPIT

17. 发明专利

JP2014161944A Profile adjustment method of polishing member used in polishing device, and polishing device 有权
标题翻译：抛光装置中使用的抛光构件的轮廓调整方法及抛光装置
公开(公告)号：JP2014161944A
公开(公告)日：2014-09-08
申请号：JP2013034419
申请日：2013-02-25
申请人： Ebara Corp , 株式会社荏原製作所
发明人： SHIMANO TAKAHIRO , TANIGAWA MUTSUMI , MATSUO NAONORI , YAMAGUCHI KUNIAKI , WATANABE KAZUHIDE
IPC分类号： B24B37/00 , B24B53/12 , H01L21/304
CPC分类号： B24B53/017 , B24B37/005
摘要： PROBLEM TO BE SOLVED: To provide a profile adjustment method of a polishing member capable of achieving a target profile of a polishing member.SOLUTION: A profile adjustment method includes: measuring a surface height of a polishing member 10 in each of a plurality of oscillation sections Z1 to Z5 preset on the polishing member 10 along an oscillation direction of a dresser 5; calculating a difference between a present profile obtained from a measured value of the surface height and a target profile of the polishing member 10; and correcting a travel speed of the dresser 5 in each of the plurality of oscillation sections Z1 to Z5 so as to eliminate the difference.
摘要翻译：要解决的问题：提供能够实现抛光构件的目标轮廓的抛光构件的轮廓调整方法。解决方案：轮廓调整方法包括：在多个振动中的每一个中测量抛光构件10的表面高度沿着修整器5的摆动方向预先设置在研磨部件10上的部分Z1〜Z5; 计算从表面高度的测量值和抛光构件10的目标轮廓获得的当前轮廓之间的差; 并且校正多个振动部Z1〜Z5的每一个中的修整器5的移动速度，以消除差异。

18. 发明专利

JP2014124730A Substrate polishing device, heat transmission member, and temperature control method for surface of polishing pad 审中-公开
标题翻译：基板抛光装置，传热构件和抛光垫表面温度控制方法
公开(公告)号：JP2014124730A
公开(公告)日：2014-07-07
申请号：JP2012284230
申请日：2012-12-27
申请人： Ebara Corp , 株式会社荏原製作所
发明人： MATSUO NAONORI , MOTOJIMA YASUYUKI
IPC分类号： B24B37/015 , B24B37/34 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To achieve at least one of reduction of cost, reduction of energy consumption, enhancement of responsiveness and reduction of heat loss, as regards temperature control for a polishing pad in a substrate polishing device.SOLUTION: A substrate polishing device comprises: a polishing table which is rotatable and is used for sticking a polishing pad to it; a gas supply part for supplying reactant gas; a heat transmission part having a body in which a gas passage for circulating the reactant gas is formed in its inside in a state that the polishing pad is stuck to the polishing table and which is disposed on a surface of the polishing pad while coming in contact with the polishing pad or while approximating to the polishing pad, and having a catalyst which is disposed in the gas passage and promotes exothermic reaction of the reactant gas, and transmits heat generated by exothermic reaction to the polishing pad; a temperature detection part for detecting a temperature of the surface of the polishing pad; and a gas supply amount control part which controls the amount of the reactant gas supplied from the gas supply part to the heat transmission part on the basis of the temperature detection result.
摘要翻译：要解决的问题：关于基板研磨装置中的抛光垫的温度控制，为了实现成本的降低，能量消耗的降低，响应性的提高和热损失的降低中的至少一个。解决方案：基板研磨装置包括：抛光台，其可旋转并用于将抛光垫粘贴到其上; 供给反应气体的气体供给部; 具有主体的传热部分，其中用于使反应气体循环的气体通道在其内部形成在抛光垫粘附到抛光台并且在接触的同时设置在抛光垫的表面上的状态与抛光垫接近，同时近似于抛光垫，并且具有设置在气体通道中并促进反应气体的放热反应的催化剂，并将通过放热反应产生的热量传递到抛光垫; 用于检测抛光垫表面的温度的温度检测部件; 以及气体供给量控制部，其基于温度检测结果，控制从气体供给部供给到传热部的反应气体的量。

19. 发明专利

JP2005131732A Grinding device 审中-公开
标题翻译：研磨装置
公开(公告)号：JP2005131732A
公开(公告)日：2005-05-26
申请号：JP2003370100
申请日：2003-10-30
申请人： Ebara Corp , Nikon Corp , 株式会社ニコン , 株式会社荏原製作所
发明人： MATSUO NAONORI , ISHIKAWA AKIRA
IPC分类号： B24B49/10 , B24B37/07 , B24B49/12 , B24B49/16 , H01L21/304 , B24B37/04
CPC分类号： B24B37/013 , B24B49/12
摘要： PROBLEM TO BE SOLVED: To provide a grinding device by which a film formed to a substrate during grinding can be prevented from being peeled off and in which it is not necessary to select process conditions linked to the increase of a process time during grinding. SOLUTION: The grinding device, which is provided with a grinding table 1 having a grinding face and a substrate holder 5 for holding the substrate 4, grinds the substrate 4 by bringing the substrate 4 into sliding contact with the grinding face. A monitoring controller 30 is provided to the grinding device. The monitoring controller 30 is composed of a monitoring part 31 for monitoring a grinding state of a face to be ground of the substrate 4 and a control part 32 for changing grinding conditions on the basis of the grinding state of the face to be ground detected by the monitoring part 31. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种研磨装置，通过该研磨装置可以防止在研磨期间形成于基底上的膜被剥离，并且其中不需要选择与加工时间的增加相关的工艺条件磨削加工。解决方案：设置有具有研磨面的研磨台1和用于保持基板4的基板保持件5的研磨装置通过使基板4与研磨面滑动接触来研磨基板4。监测控制器30设置在研磨装置上。监视控制器30由用于监测基板4的被研磨面的研磨状态的监视部31和基于待研磨面的研磨状态来改变研磨条件的控制部32构成，监察部分31.版权所有（C）2005，JPO＆NCIPI

20. 发明专利

JPH11277445A Grinding wheel for polishing substrate and polishing device 失效
标题翻译：用于抛光底板和抛光装置的磨轮
公开(公告)号：JPH11277445A
公开(公告)日：1999-10-12
申请号：JP9832698
申请日：1998-03-25
申请人： Ebara Corp , 株式会社荏原製作所
发明人： WADA TAKETAKA , HIYAMA HIROKUNI , HIROKAWA KAZUTO , MATSUO NAONORI
IPC分类号： B24D7/00 , B24D3/00 , B24D7/06
摘要： PROBLEM TO BE SOLVED: To provide a grinding wheel for polishing a substrate, which has a grinding surface with no warp, and which is composed of several segmented grindstone pieces bonded to a base and having surfaces flush with one another, and also to provide a polishing device using the grinding wheel for polishing a substrate. SOLUTION: A grindstone panel 11' is bonded to a base 12 having a flat grindstone bonding surface with the use of an adhesive 13, and a plurality of cut grooves 14 are formed in the upper surface of the grindstone panel 11', reaching the grindstone bonding surface of the base 12, and accordingly, the grindstone panel 11' is divided into a plurality of segmented grindstone pieces 11. Gaps corresponding to the cut grooves 14 are defined between the grindstone pieces 11. Alternatively, the segmented grindstone pieces 11 are bonded by the adhesive 13 onto the flat grindstone bonding surface of the base 12, and predetermined gaps are defined between the grindstone pieces 11.
摘要翻译：要解决的问题：提供一种用于研磨具有无翘曲的研磨表面的基板的砂轮，并且由与基部结合并具有彼此平齐的表面的多个分段磨石片组成，并且还提供抛光装置使用砂轮抛光基板。解决方案：使用粘合剂13将研磨石板11'与平面磨石接合面的基座12接合，在磨石板11'的上表面形成多个切槽14，到达砂轮基体12的接合面，因此，磨石面板11'被分割为多个分段的磨石件11.与切削槽14对应的间隙限定在磨石片11之间。或者，分割的磨石片11被接合通过粘合剂13到基体12的平坦的磨石接合面上，在磨石片11之间形成规定的间隙。

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