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11. 发明专利

JP2006310212A Bulb type led light source 有权
标题翻译： BULB型LED光源
公开(公告)号：JP2006310212A
公开(公告)日：2006-11-09
申请号：JP2005133912
申请日：2005-05-02
申请人： Citizen Electronics Co Ltd , シチズン電子株式会社
发明人： KANAMORI MASAYOSHI , IMAI SADATO
IPC分类号： F21K99/00 , F21S8/10 , F21V19/00 , F21Y101/02
CPC分类号： F21K9/60 , F21Y2107/00 , F21Y2115/10
摘要： PROBLEM TO BE SOLVED: To provide a bright light source while keeping miniaturization by forming LED elements by arranging them on both surfaces of blades in addition to side surfaces of a polygonal column.
SOLUTION: A support member 11 of this LED light source 10 is formed of a metal material having high thermal conductivity, and formed into a triangular-prism shape having blades 11a projecting outward from respective longitudinal ridge lines. LED light source units 1 used as units constituting the LED light source 10 are jointed to three side surfaces and both the surfaces of the blades of the support member 11. Wiring patterns each having terminal electrodes at ends are arranged on a printed circuit board jointed on a rectangular solid-shaped base formed of a metal material having high thermal conductivity. A translucent sealing resin covers a surface of the wiring patterns excluding the plurality of LED elements mounted at equal intervals in the longitudinal direction on bases in elongated through-holes of the printed circuit board and the terminal electrodes. The LED units 1 are fixed to both the surfaces of the respective blades 11a in addition to the respective side surfaces of the triangular prism of the support member 11.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：除了多边形柱的侧表面之外，通过将其设置在叶片的两个表面上，通过形成LED元件来保持小型化，从而提供亮光源。解决方案：该LED光源10的支撑构件11由具有高导热性的金属材料形成，并且形成为具有从各纵向脊线向外突出的叶片11a的三角棱柱形状。用作构成LED光源10的单元的LED光源单元1被连接到支撑构件11的叶片的三个侧表面和两个表面。端部处具有端子电极的布线图案布置在连接在由具有高导热性的金属材料形成的矩形固体基底。透光性密封树脂覆盖布线图案的表面，除了在印刷电路板和端子电极的细长通孔的基部上沿纵向等间隔安装的多个LED元件。除了支撑构件11的三角形棱镜的相应侧表面之外，LED单元1还固定到各个叶片11a的两个表面。（C）2007，JPO＆INPIT

12. 发明专利

JP2014222705A ＬＥＤ発光装置审中-公开
标题翻译： LED发光装置
公开(公告)号：JP2014222705A
公开(公告)日：2014-11-27
申请号：JP2013101453
申请日：2013-05-13
申请人：シチズン電子株式会社 , Citizen Electronics Co Ltd , シチズンホールディングス株式会社 , Citizen Holdings Co Ltd
发明人： IMAI SADATO
IPC分类号： H01L33/48 , H01L33/50
CPC分类号： H01L2224/16245
摘要：【課題】 LED素子から発光される光を有効活用することにより光取出し効率に優れたLED発光装置を提供する。【解決手段】基板部にLED素子を実装し、蛍光粒子を含有した透光性樹脂によりLED素子の上面を封止し、透光性樹脂の上面に出射光の光学特性を制御するための光学膜層を設け、光学膜層は紫外域の波長光を反射させ可視光は透過させる特性を持たせた誘電体多層膜で構成した。これにより、紫外域の波長光の内で蛍光粒子に遭遇しないで空気中に放射されていた無効放射光を誘電体多層膜により封止部内へ反射させて再び蛍光粒子に遭遇する機会を増やすことにより光取出し効率を向上させることができる。【選択図】図1
摘要翻译：要解决的问题：提供一种通过有效利用从LED元件发出的光而具有优异的光提取效率的LED发光装置。解决方案：一种LED发光装置，包括：安装在基板部件上的LED元件; 含有用于封装LED元件的顶面的荧光粒子的半透明树脂; 以及设置在半透明树脂的顶面上的光学膜层，用于控制发射光的光学特性，其中光学膜层由具有反射紫外区域波长的光的特性的电介质多层膜构成并通过可见光。因此，在不发生荧光粒子的情况下，发射到大气中的紫外线区域的波长无效的发射光被电介质多层膜反射到封装部分的内部，以增加再次遇到荧光粒子的机会从而提高光提取效率。

13. 发明专利

JP2013120913A Light-emitting module and light-emitting module connected body 有权
标题翻译：发光模块和发光模块连接体
公开(公告)号：JP2013120913A
公开(公告)日：2013-06-17
申请号：JP2011269516
申请日：2011-12-09
申请人： Citizen Electronics Co Ltd , シチズン電子株式会社 , Citizen Holdings Co Ltd , シチズンホールディングス株式会社
发明人： IMAI SADATO , MIYASHITA JUNJI
IPC分类号： H01L33/00 , F21S2/00 , F21V19/00 , F21Y101/02
摘要： PROBLEM TO BE SOLVED: To provide a light-emitting module which can be easily formed into a polyhedral light-emitting module on which a plurality of luminous bodies are arranged on an outer peripheral surface by connection of a plurality of luminous body mounting blocks in which luminous bodies are mounted on individual substrates; and which can flexibly increase an amount of luminescence and flexibly expand a luminous region.SOLUTION: A luminous body mounting block 20 includes a substrate 12 and a luminous body 13 mounted on at least one surface of the substrate 12. A light-emitting module 11 multidirectionally emitting light by combination of a plurality of luminous body mounting blocks 20 in such a manner that luminous body mounting surfaces 17 of the substrates 12 on each of which the luminous body 13 is mounted are arranged on the outside.
摘要翻译：要解决的问题：提供一种发光模块，其可以容易地形成为多个发光体，多个发光体通过多个发光体安装连接而在外周面上排列有多个发光体发光体安装在各个基板上的块体; 并且可以灵活地增加发光量并且柔性地扩大发光区域。解决方案：发光体安装块20包括安装在基板12的至少一个表面上的基板12和发光体13.发光模块11通过多个发光体安装块的组合多向发光以这样的方式，将安装有发光体13的基板12的发光体安装面17配置在外侧。版权所有（C）2013，JPO＆INPIT

14. 发明专利

JP2009059980A Led light emitting device 审中-公开
标题翻译： LED发光装置
公开(公告)号：JP2009059980A
公开(公告)日：2009-03-19
申请号：JP2007227320
申请日：2007-09-03
申请人： Citizen Electronics Co Ltd , シチズン電子株式会社
发明人： KADOTANI NORIKAZU , IMAI SADATO , FUKAZAWA KOICHI
IPC分类号： H01L33/62 , H01L33/32 , H01L33/56
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive LED light emitting device which can be lighted at a constant level of luminance and can be made compact and thin. SOLUTION: The LED light emitting device includes a first LED functioning as a light emitting element, a second LED functioning as a light receiving element for detecting the quantity of the light emitted by the first LED, and an adjusting means of adjusting the light emission state of the first LED according to a detected value of the second LED, the first LED and second LED being disposed adjacently in a light-transmittable state. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种廉价的LED发光装置，其能够以恒定的亮度照明并且可以被制造得紧凑和薄。解决方案：LED发光器件包括用作发光元件的第一LED，用作用于检测由第一LED发射的光量的光接收元件的第二LED，以及调节装置根据第二LED的检测值，第一LED的发光状态，第一LED和第二LED相邻地设置在可透光状态。版权所有（C）2009，JPO＆INPIT

15. 发明专利

JP2008288231A Light-emitting device 有权
标题翻译：发光装置
公开(公告)号：JP2008288231A
公开(公告)日：2008-11-27
申请号：JP2007128779
申请日：2007-05-15
申请人： Citizen Electronics Co Ltd , シチズン電子株式会社
发明人： BETSUDA SOHIKO , IMAI SADATO , FUKAZAWA KOICHI
IPC分类号： H01L33/56 , H01L33/62
CPC分类号： H03K17/12 , H01L2224/32225 , H01L2224/48091 , H01L2224/49113 , H01L2224/73265 , H03K17/74 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a highly reliable light-emitting device having favorable balance in current by configuring a light-emitting diode package in such a way that various kinds of light-emitting diode chips are connected in parallel while suppressing variations in VF characteristics of the diode chips which have not been covered by a prior art. SOLUTION: The light-emitting diode package is configured so that the light-emitting diode chips are connected in parallel while using two characteristic conditions crossing through three points A, B and C as a selection reference in forward voltage-forward current characteristics. The current at the point B is set at 1/2 of a rated current, and thus, the current of each light-emitting diode chip in the light-emitting diode package satisfies the current value of ≥50% of the rated current. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种高可靠性的发光装置，其通过配置发光二极管封装使电流平衡良好，使得各种发光二极管芯片并联连接，同时抑制变化在现有技术未被覆盖的二极管芯片的VF特性中。
解决方案：发光二极管封装被配置为使得发光二极管芯片并联连接，同时使用穿过三个点A，B和C的两个特征条件作为正向电压 - 正向电流特性中的选择参考。点B处的电流设定为额定电流的1/2，因此，发光二极管封装中的各发光二极管芯片的电流满足电流值≥50％的电流值。版权所有（C）2009，JPO＆INPIT

16. 发明专利

JP2008218833A External connection terminal of metal core substrate 有权
标题翻译：金属核基板的外部连接端子
公开(公告)号：JP2008218833A
公开(公告)日：2008-09-18
申请号：JP2007056247
申请日：2007-03-06
申请人： Citizen Electronics Co Ltd , シチズン電子株式会社
发明人： IMAI SADATO , KIKUCHI SATORU , FUKAZAWA KOICHI
IPC分类号： H05K1/11 , H01R12/71
CPC分类号： F21V29/70 , F21K9/20 , F21V29/20 , F21Y2103/10 , F21Y2115/10 , H01L2924/0002 , H01R4/023 , H05K1/0203 , H05K1/056 , H05K1/114 , H05K1/141 , H05K1/181 , H05K3/3421 , H05K7/205 , H05K2201/10106 , H05K2201/10287 , H05K2201/10409 , Y02P70/611 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive external connection terminal of a metal core substrate which can be made small and thin at low cost by eliminating the need to mount a connector on the metal core substrate. SOLUTION: Disclosed is the external connection terminal 15 of the metal core substrate 10 which is disposed at a terminal portion of the metal core substrate 10 for mounting an electronic component 17 on at least one surface of top and rear surfaces of a plate type metal substrate 11, and makes an electric connection with the outside. The external connection terminal 15 is composed of a member which has smaller heat conductivity than the metal substrate, and has, on its surface, an electrode pattern portion 16a for soldering and fixing a lead wire to be connected to the outside. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种廉价的金属芯基板的外部连接端子，可以通过消除在金属芯基板上安装连接器的需要，可以以低成本制造得小而薄。解决方案：公开了金属芯基板10的外部连接端子15，其设置在金属芯基板10的端子部分处，用于将电子部件17安装在板的顶表面和后表面的至少一个表面上型金属基板11，与外部电连接。外部连接端子15由与金属基板相比热传导性较差的部件构成，表面上具有用于焊接固定与外部连接的引线的电极图形部分16a。版权所有（C）2008，JPO＆INPIT

17. 发明专利

JP2006295084A Package structure of light emitting diode 审中-公开
标题翻译：发光二极管的封装结构
公开(公告)号：JP2006295084A
公开(公告)日：2006-10-26
申请号：JP2005117615
申请日：2005-04-14
申请人： Citizen Electronics Co Ltd , シチズン電子株式会社
发明人： IMAI SADATO , KANAMORI MASAYOSHI
IPC分类号： H01L33/56 , H01L33/62
CPC分类号： H01L2224/48091 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To solve a matter that all chips in a package becomes rejectable due to malfunction of one LED chip.
SOLUTION: A unit LED array 4 is formed by mounting a plurality of LED chips 2 in array on a printed board 1, and one LED package 6 is constituted by fixing a plurality of unit LED arrays 4 in parallel on a base substrate 5. A means for securing the unit LED array onto the base substrate is bonded by adhesive or fixed removably by means of a screw. Even if malfunction occurs at one position during lighting, only the unit LED array is required to be replaced and thereby the yield is enhanced sharply through reduction in defective mounting. Package of different wattage can be altered depending on the quantity of received order, and the number of unit LED arrays being fixed can be altered.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了解决由于一个LED芯片的故障而导致的封装中的所有芯片都被拒绝的问题。解决方案：通过将阵列上的多个LED芯片2安装在印刷电路板1上形成单元LED阵列4，并且通过将多个单元LED阵列4并联固定在基板上而构成一个LED封装6 用于将单元LED阵列固定到基底基板上的装置通过粘合剂粘合或通过螺钉可拆卸地固定。即使在照明期间在一个位置发生故障，仅需要更换单元LED阵列，从而通过减少安装不良而使产量急剧增加。可以根据接收到的订单数量改变不同功率的包装，并且可以改变固定的单元LED阵列的数量。版权所有（C）2007，JPO＆INPIT

18. 发明专利

JP2006295083A Light emitting unit 有权
标题翻译：发光单元
公开(公告)号：JP2006295083A
公开(公告)日：2006-10-26
申请号：JP2005117614
申请日：2005-04-14
申请人： Citizen Electronics Co Ltd , シチズン電子株式会社
发明人： IMAI SADATO , KANAMORI MASAYOSHI
IPC分类号： H01L33/56 , H01L33/62
CPC分类号： H01R33/94 , F21K9/232 , F21S43/15 , F21S43/19 , F21V19/001 , F21W2107/10 , F21Y2107/30 , F21Y2107/40 , F21Y2115/10 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a light emitting unit in which reliability and long term stability are enhanced while reducing replacement cost.
SOLUTION: The light emitting unit comprises a prism supporting member, a plurality of light emitting diodes arranged on the side face of the prism supporting member, a terminal portion provided at one end of the prism supporting member, and an interconnection member being fitted to the terminal portion. The terminal portion is provided, on each side face thereof, with an anode terminal electrode and a cathode terminal electrode connected with the anode electrode and the cathode electrode of the light emitting diode. The interconnection member has a wiring electrode pattern for commonly connecting the anode terminal electrode and the cathode terminal electrode provided on each side face of the terminal portion as anode output terminal and cathode output terminal of two terminal.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种在降低重置成本的同时提高可靠性和长期稳定性的发光单元。解决方案：发光单元包括棱镜支撑构件，布置在棱镜支撑构件的侧面上的多个发光二极管，设置在棱镜支撑构件的一端的端子部分，以及互连构件，安装到端子部分。端子部分在其每个侧面上设置有与发光二极管的阳极电极和阴极连接的阳极端子电极和阴极端子电极。互连构件具有用于将阳极端子电极和设置在端子部分的每个侧面上的阴极端子电极作为阳极输出端子和两端子的阴极输出端子共同连接的布线电极图案。版权所有（C）2007，JPO＆INPIT

19. 发明专利

JP2013098060A Led lamp 有权
标题翻译：点灯
公开(公告)号：JP2013098060A
公开(公告)日：2013-05-20
申请号：JP2011240738
申请日：2011-11-02
申请人： Citizen Electronics Co Ltd , シチズン電子株式会社 , Citizen Holdings Co Ltd , シチズンホールディングス株式会社
发明人： IMAI SADATO
IPC分类号： F21S2/00 , F21V23/00 , F21Y101/02 , H01L33/64
CPC分类号： F21K9/232 , F21Y2107/30 , F21Y2115/10
摘要： PROBLEM TO BE SOLVED: To provide an LED lamp capable of being excellent on heat radiation characteristics in a simple structure and having high illumination efficiency.SOLUTION: In the LED lamp having a body section, a transparent cover mounted on an upper surface of the body section, and a base mounted on a lower surface of the body section, a support is formed by integrating at least two elongated metal members having uneven shapes mutually corresponding to each other while an insulating member having a meandered shape corresponding to the uneven shapes is sandwiched between two metal members. An upper part of the support is set up to be an element mounting section for mounting LEDs, and a lower part of the support is set up to be a support section mounted on a power source section. Two electrodes of each LED are mounted by electrically connecting with projected sections of two metal members on the element mounting section of the support, and the support section of the support is connected with and fixed to the power source section built in the body section.
摘要翻译：要解决的问题：提供一种在简单结构中具有优异的散热特性并且具有高照明效率的LED灯。解决方案：在具有主体部分的LED灯中，安装在主体部分的上表面上的透明盖和安装在主体部分的下表面上的基座，通过将至少两个细长的具有相互对应的不均匀形状的金属构件，而具有对应于不平坦形状的蜿蜒形状的绝缘构件被夹在两个金属构件之间。支撑件的上部设置为用于安装LED的元件安装部分，并且支撑件的下部设置为安装在电源部分上的支撑部分。每个LED的两个电极通过与支撑件的元件安装部分上的两个金属构件的突出部分电连接而安装，并且支撑件的支撑部分连接并固定到内部在主体部分中的电源部分。版权所有（C）2013，JPO＆INPIT

20. 发明专利

JP2013021042A Semiconductor light-emitting device and manufacturing method of the same 有权
标题翻译：半导体发光器件及其制造方法
公开(公告)号：JP2013021042A
公开(公告)日：2013-01-31
申请号：JP2011151452
申请日：2011-07-08
申请人： Citizen Electronics Co Ltd , シチズン電子株式会社 , Citizen Holdings Co Ltd , シチズンホールディングス株式会社
发明人： IMAI SADATO
IPC分类号： H01L33/54 , H01L33/50
CPC分类号： H01L2224/48137
摘要： PROBLEM TO BE SOLVED: To provide an LED light-emitting device irradiating pseudo white light by using a fluorescent resin in which blue LED and YAG fluorescent particles are mixed, which is excellent in heat dissipation characteristics for obtaining bright radiation light and which resolves a yellow ring specific to an LED light-emitting device using the fluorescent resin for improving luminescent chromaticity.SOLUTION: A semiconductor light-emitting device comprises: a circuit board having an opening; a metal base laminated on an undersurface of the circuit board; a plurality of semiconductor light-emitting elements mounted at predetermined intervals on the metal base in the opening of the circuit board; a frame member having openings corresponding to the plurality of semiconductor light-emitting elements mounted on the metal base in the opening of the circuit board, the openings of the frame member being filled with a fluorescent resin.
摘要翻译：解决的问题：为了提供一种通过使用其中混合有蓝色LED和YAG荧光颗粒的荧光树脂来照射假白光的LED发光装置，其具有优异的用于获得明亮的辐射光的散热特性，并且其中解决了使用荧光树脂改善发光色度的LED发光装置特有的黄色环。解决方案：半导体发光器件包括：具有开口的电路板; 金属基底层压在电路板的下表面上; 多个半导体发光元件，以规定的间隔安装在电路基板的开口部的金属基底上; 框架构件具有对应于安装在电路板的开口中的金属基底上的多个半导体发光元件的开口，框架构件的开口填充有荧光树脂。版权所有（C）2013，JPO＆INPIT

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