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1. 发明专利

JP2014192407A Semiconductor light-emitting device 有权
标题翻译：半导体发光器件
公开(公告)号：JP2014192407A
公开(公告)日：2014-10-06
申请号：JP2013067846
申请日：2013-03-28
申请人： Citizen Electronics Co Ltd , シチズン電子株式会社 , Citizen Holdings Co Ltd , シチズンホールディングス株式会社
发明人： IMAI SADATO , IINO TAKASHI
IPC分类号： H01L33/50 , H01L33/48
CPC分类号： H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2924/181 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To resolve a yellow ring specific to an LED light-emitting device using a fluorescent resin which has conditions expected for the LED light-emitting device using the fluorescent resin such as good light-emitting characteristics, an excellent heat dissipation capacity and achievement of a thin shape at the same time.SOLUTION: A semiconductor light-emitting device comprises: a mounting substrate having a plurality of level difference parts; a plurality of semiconductor light-emitting elements each mounted on each level difference part of the mounting substrate; connection means for electrically connecting each semiconductor light-emitting element; and a fluorescent resin for encapsulating the plurality of semiconductor light-emitting elements each mounted on each level difference part of the mounting substrate.
摘要翻译：要解决的问题：为了解决使用荧光树脂的LED发光装置特有的黄色环，该荧光树脂具有使用荧光树脂的LED发光装置所期望的条件，例如良好的发光特性，优异的散热能力并同时实现薄形状。解决方案：一种半导体发光器件，包括：具有多个电平差值部分的安装基板; 多个半导体发光元件，各自安装在所述安装基板的每个高度差部分上; 用于电连接每个半导体发光元件的连接装置; 以及用于封装安装在安装基板的各个高度差部分上的多个半导体发光元件的荧光树脂。

2. 发明专利

JP2013093130A Led lamp 有权
标题翻译：点灯
公开(公告)号：JP2013093130A
公开(公告)日：2013-05-16
申请号：JP2011232937
申请日：2011-10-24
申请人： Citizen Electronics Co Ltd , シチズン電子株式会社 , Citizen Holdings Co Ltd , シチズンホールディングス株式会社
发明人： IMAI SADATO
IPC分类号： F21S2/00 , F21Y101/02 , H01L33/00 , H01L33/64
摘要： PROBLEM TO BE SOLVED: To provide an LED lamp with a simple structure, that is excellent in heat radiation characteristics and can select illumination directions.SOLUTION: The LED lamp has a body part, a transparent cover installed on an upper side of the body part, and a base part installed on a lower side of the body part. A support pole is formed by integrating at least two rectangular metal members with an insulating member interposed in between, the upper part of the support pole making an element mounting part for mounting an LED, the lower part of the support pole making a support part, the LED is electrically installed on the two metal members interposing the insulating member at the element mounting part of the support pole, and the support part of the support pole is connected and fixed to a power supply part built-in in the body part.
摘要翻译：要解决的问题：为了提供具有简单结构的LED灯，其散热特性优异并且可以选择照明方向。解决方案：LED灯具有主体部分，安装在主体部分的上侧的透明盖，以及安装在主体部分的下侧的基部。通过将至少两个矩形金属构件与介于其间的绝缘构件集成在一起形成支撑杆，支撑杆的上部形成用于安装LED的元件安装部分，制成支撑部的支撑杆的下部， LED被安装在两个金属构件上，该两个金属构件将绝缘构件插入到支撑杆的元件安装部分处，并且支撑杆的支撑部分连接并固定到内置于主体部分中的电源部分。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2013069765A Semiconductor light-emitting device and manufacturing method of the same 有权
标题翻译：半导体发光器件及其制造方法
公开(公告)号：JP2013069765A
公开(公告)日：2013-04-18
申请号：JP2011206011
申请日：2011-09-21
申请人： Citizen Electronics Co Ltd , シチズン電子株式会社 , Citizen Holdings Co Ltd , シチズンホールディングス株式会社
发明人： IMAI SADATO
IPC分类号： H01L33/48
CPC分类号： H01L33/505 , F21K9/20 , F21V23/00 , F21Y2115/10 , H01L24/97 , H01L33/486 , H01L33/56 , H01L2224/48091 , H01L2224/48227 , H01L2924/12041 , H05B33/02 , H05B33/10 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an LED light-emitting device which improves visibility of a polarity mark while maintaining a small shape and without increase in a substrate size to enable an operation without generating an error in polarity at the time of mounting the LED light-emitting device, and which requires no excess process such as additional processing.SOLUTION: A semiconductor light-emitting device comprises a phosphor plate 3 adhered to a light emitting face of a semiconductor light-emitting element 1 having bump electrodes 1a, 1b on an undersurface; a white resin 4 covering side faces of the semiconductor light-emitting element 1; a groove 3a formed on the phosphor plate 3; and a colored resin 4a filled in the groove. The colored resin 4a filled in the groove serves as a polarity mark 5.
摘要翻译：解决的问题：提供一种提高极性标记的可视性的LED发光装置，同时保持小的形状并且不增加基板尺寸，从而能够在安装时不产生极性误差而进行操作 LED发光装置，并且不需要额外的处理等多余的处理。解决方案：半导体发光器件包括在下表面上粘附到具有凸起电极1a，1b的半导体发光元件1的发光面的荧光体板3; 覆盖半导体发光元件1的侧面的白色树脂4; 形成在荧光体板3上的槽3a; 和填充在凹槽中的着色树脂4a。填充在凹槽中的着色树脂4a用作极性标记5.版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2006319224A White light emitting diode 审中-公开
标题翻译：白光发光二极管
公开(公告)号：JP2006319224A
公开(公告)日：2006-11-24
申请号：JP2005141998
申请日：2005-05-13
申请人： Citizen Electronics Co Ltd , シチズン電子株式会社
发明人： KANAMORI MASAYOSHI , IMAI SADATO
IPC分类号： H01L33/50 , H01L33/54 , H01L33/56
摘要： PROBLEM TO BE SOLVED: To provide a white LED that prevents both a halo effect and light transmission deterioration.
SOLUTION: This white light emitting diode comprises a light emitting diode generating white light by blending the lights of multiple wavelengths and a white light emitting diode made of light collection lenses placed in a light emitting direction of the light emitting diode, scatters light difussing agents evenly within the lenses, and reduces the halo effect by mixing them below a weight percent. This light emitting diode is provided with a LED element 1 on a substrate 2 for blue light emission, so that a light emitting efficiency is maintained to prevent the halo effect and light transmission deterioration and a good white light emitting diode can be provided. Concretely, a sealing resin 3, namely, a YAG fluorescent material sealing resin is provided around the LED element 1. Light collection lenses 4 are placed in a light emitting direction of the LED element 1 and light difussing agents 5 are mingled in the lenses 4. A LED 10 for white light emission combining the blue LED element 1 and YAG fluorescent material produces the white light by mixing the blue light from the LED element 1 and the yellow light generated by exciting the YAG fluorescent material with that blue light.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供防止光晕效应和光透射劣化的白色LED。解决方案：该白色发光二极管包括通过混合多个波长的光产生白光的发光二极管和由放置在发光二极管的发光方向上的集光透镜制成的白色发光二极管，散射光弥散剂均匀地在透镜内，并通过将它们混合在重量百分数以下来降低光晕效应。该发光二极管在用于蓝色发光的基板2上设置有LED元件1，从而保持发光效率以防止光晕效应和光透射劣化，并且可以提供良好的白色发光二极管。具体地说，在LED元件1周围设置密封树脂3，即YAG荧光材料密封树脂。集光透镜4被放置在LED元件1的发光方向上，并且光弥散剂5混合在透镜4中组合蓝色LED元件1和YAG荧光材料的白色发光用LED10通过混合来自LED元件1的蓝色光和通过用该蓝色光激发YAG荧光材料而产生的黄色光产生白色光。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2005353802A Light emitting diode 审中-公开
标题翻译：发光二极管
公开(公告)号：JP2005353802A
公开(公告)日：2005-12-22
申请号：JP2004172261
申请日：2004-06-10
申请人： Citizen Electronics Co Ltd , シチズン電子株式会社
发明人： IMAI SADATO
IPC分类号： H01L29/24 , H01L33/56 , H01L33/62 , H01L33/00
CPC分类号： H01L33/486 , H01L33/62 , H01L2224/48227 , H01L2924/181 , H01L2224/48091 , H01L2924/00014 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a light emitting diode in which a resinous body sealing a light emitting element is formed on a circuit board with a good adherive force, and also which prevents a separation of the resinous body or the internal contact failure of a bonding wire or the like with respect to abrupt changes in temperature.
SOLUTION: A light emitting diode 21 comprises a circuit board 22, an upper face electrode 23 which is pattern-formed on this circuit board 22, a lower face electrode 24 which is electrically conducted to this upper face electrode 23, a light emitting element 25 mounted on the upper face electrode 23, and a resinous body 26 which seals the light emitting element 25 on the circuit board 22. The upper face electrode 23 is formed inside a joining boundary part 29 in a planar direction on a joining face between itself and the resinous body 26 on the upper face of the circuit board 22.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题：提供一种发光二极管，其中密封发光元件的树脂体在电路板上形成具有良好的附着力，并且还防止树脂体或内部接触件的分离关于温度突然变化的接合线等的故障。解决方案：发光二极管21包括电路板22，在该电路板22上图案形成的上表面电极23，与该上表面电极23导电的下表面电极24，光安装在上表面电极23上的发光元件25以及密封电路板22上的发光元件25的树脂体26.上表面电极23在接合面的平面方向上形成在接合边界部29内在它自身与电路板22上表面上的树脂体26之间。（C）2006年，JPO＆NCIPI

6. 发明专利

JP2013004808A Light emitting device 有权
标题翻译：发光装置
公开(公告)号：JP2013004808A
公开(公告)日：2013-01-07
申请号：JP2011135591
申请日：2011-06-17
申请人： Citizen Electronics Co Ltd , シチズン電子株式会社 , Citizen Holdings Co Ltd , シチズンホールディングス株式会社
发明人： IMAI SADATO
IPC分类号： H01L33/48
CPC分类号： H01L2224/48091 , H01L2224/48137 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a light emitting device which prevents warpage of a metal container that is caused by a difference in heat expansion coefficients, achieves excellent heat radiation effect, and has a simple structure enabling a user to easily take out wiring.SOLUTION: A light emitting device has a long metal container having a bottom surface and both side surfaces and opening at an upper part thereof, and multiple light emitting elements. The multiple light emitting elements are fastened and mounted on the bottom surface of the metal container so as to be spaced a predetermined distance away from each other. Connection terminal substrates are disposed at both end parts of the metal container. The multiple light emitting elements are serially connected between the connection terminal substrates by conducting wire bonding to connect the light emitting element with the connection terminal substrate, which are located adjacent to each other, and to connect the light emitting elements with each other.
摘要翻译：要解决的问题：提供一种防止由热膨胀系数差引起的金属容器翘曲的发光装置，实现优异的散热效果，并且具有使用户能够容易地取出的简单结构接线。解决方案：发光器件具有长的金属容器，其具有底表面和两个侧表面以及在其上部的开口，以及多个发光元件。多个发光元件被紧固并安装在金属容器的底表面上，以便彼此隔开预定距离。连接端子基板设置在金属容器的两端部。多个发光元件通过导线接合连接在连接端子基板之间，以将发光元件与彼此相邻的连接端子基板连接并将发光元件彼此连接。版权所有（C）2013，JPO＆INPIT

7. 发明专利

JP2011028864A Light emitting diode light source device 有权
标题翻译：发光二极管光源装置
公开(公告)号：JP2011028864A
公开(公告)日：2011-02-10
申请号：JP2009170453
申请日：2009-07-21
申请人： Citizen Electronics Co Ltd , Citizen Holdings Co Ltd , シチズンホールディングス株式会社 , シチズン電子株式会社
发明人： KADOTANI NORIKAZU , FUKAZAWA KOICHI , IMAI SADATO
IPC分类号： F21S2/00 , F21V19/00 , F21V29/00 , F21Y101/02 , H01L33/00 , H01L33/64
CPC分类号： F21V29/85 , F21K9/232 , F21V29/74 , F21V29/89 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/62 , H01L2224/48137 , H01L2224/48091 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a light emitting diode light source device which is suitable for a lighting system of a bulb type or the like, is small size, and high in lumen density. SOLUTION: The light emitting diode light source device includes a thermally conductive base 2, an insulating plate 10 having a conductive pattern formed on a surface and fixed to a surface of the base 2, and a plurality of LED elements 20 mounted to a mounting area 14 on the surface of the base 2 exposed from a through-hole 13 formed on the insulating plate 10. Outer shapes of the base 2 and insulating plate 10 are circular. The through-hole 13 has a circular shape concentric with the outer shape of the insulating plate 10. The LED elements 20 are connected in series by wiring. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供适用于灯泡型等的照明系统的发光二极管光源装置，体积小，流明密度高。解决方案：发光二极管光源装置包括导热基座2，具有形成在表面上并固定到基座2的表面上的导电图案的绝缘板10，以及多个LED元件20，其安装到基座2的表面露出的，从形成在绝缘板10上的通孔13露出的安装区域14.基座2和绝缘板10的外形是圆形的。通孔13具有与绝缘板10的外形同心的圆形.LED元件20通过布线串联连接。版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2011018801A Method for manufacturing semiconductor device 审中-公开
标题翻译：制造半导体器件的方法
公开(公告)号：JP2011018801A
公开(公告)日：2011-01-27
申请号：JP2009162961
申请日：2009-07-09
申请人： Citizen Electronics Co Ltd , Citizen Holdings Co Ltd , シチズンホールディングス株式会社 , シチズン電子株式会社
发明人： KADOTANI NORIKAZU , IMAI SADATO , ISHIZAKA MITSUSATO
IPC分类号： H01L33/48
CPC分类号： H01L2224/48091 , H01L2224/48137 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device that includes a process capable of easily and certainly insulating and isolating a plating lead used in a plating treatment process from an electrode in a substrate and a wiring pattern.SOLUTION: The LED lamp 11 includes: the substrate 12; the wiring pattern 17 formed on the substrate 12; and the plating lead 21 for a plating treatment being extended from one end of the wiring pattern 17 and exposing a front end to the outer peripheral surface of the substrate 12. In the LED lamp 11, a common contact 20 connected to the plating lead 21 from one end of the wiring pattern 17, is mounted on the substrate 12, and the plating treatment from the plating lead 21 via the common contact 20 is completed. In the LED lamp, the wiring pattern 17 is isolated electrically from the plating lead 21 by insulating the common contact 20.
摘要翻译：要解决的问题：提供一种半导体器件的制造方法，该半导体器件包括能够容易地且绝对地绝缘并且从基板中的电极和布线图案中将电镀处理中使用的镀层引线绝缘和隔离的方法。解决方案：LED 灯11包括：基板12; 形成在基板12上的布线图案17; 并且用于电镀处理的电镀引线21从布线图案17的一端延伸并将前端暴露于基板12的外周面。在LED灯11中，连接到电镀引线21的公共触点20 从布线图案17的一端安装在基板12上，并且通过公共接点20从电镀引线21进行电镀处理。在LED灯中，布线图案17通过使公共接触部20绝缘而与电镀引线21电隔离。

9. 发明专利

JP2006319290A Light emitting diode light source unit and valve type thereof 有权
标题翻译：发光二极管光源单元及其阀类型
公开(公告)号：JP2006319290A
公开(公告)日：2006-11-24
申请号：JP2005143329
申请日：2005-05-16
申请人： Citizen Electronics Co Ltd , シチズン電子株式会社
发明人： FUKAZAWA KOICHI , IMAI SADATO
IPC分类号： H01L33/56 , H01L33/64
摘要： PROBLEM TO BE SOLVED: To provide an LED light source unit superior in heat dissipating characteristics and a valve type LED light source. SOLUTION: A long-length base mount 2 having an almost trapezoidal cross section comprising a metal of high heat conductivity comprises the base mounts 2 which has a surface fast sticking to each other on at least a part of adjoining side surfaces when side surfaces of the base mounts 2 are made to adjacent to each other, a plurality of light emitting diode elements 4 mounted on the upper surface of the base mount 2, and a printed board 3 arranged on the upper surface of the base mount 2. The printed board 3 has two terminal electrodes 3e and 3f electrically connected to each other via each electrode of the light emitting diode element 4 and a wiring pattern. A plurality of light emitting diode light sources 1 in which the upper surface of the base mount 2 other than the terminal electrodes 3e and 3f is sealed with a transparent resin 7 are combined into an almost cylindrical shape by directly connecting the side surfaces of the base mounts 2 fast sticking to each other, thereby forming the valve type light emitting diode light source. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供散热特性优异的LED光源单元和阀式LED光源。解决方案：具有包含高导热性金属的几乎梯形的横截面的长度基座2具有基座2，当基座2具有邻接的侧表面的至少一部分时，表面彼此紧贴基座2的表面彼此相邻，安装在基座2的上表面上的多个发光二极管元件4和布置在基座2的上表面上的印刷电路板3。印刷电路板3具有通过发光二极管元件4的每个电极和布线图案彼此电连接的两个端子电极3e和3f。多个发光二极管光源1，其中除了端子电极3e和3f之外的基座2的上表面被透明树脂7密封，通过直接连接基座的侧表面而组合成几乎圆柱形安装件2彼此紧贴，从而形成阀式发光二极管光源。版权所有（C）2007，JPO＆INPIT

10. 发明专利

JP2006310515A Light emitting unit 有权
标题翻译：发光单元
公开(公告)号：JP2006310515A
公开(公告)日：2006-11-09
申请号：JP2005130790
申请日：2005-04-28
申请人： Citizen Electronics Co Ltd , シチズン電子株式会社
发明人： IMAI SADATO , KANAMORI MASAYOSHI
IPC分类号： H01L33/64
CPC分类号： H01L2224/48091 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a high output light emitting unit exhibiting high heat dissipation effect in which the size and weight can be reduced.
SOLUTION: A plurality of substrates each mounting a plurality of light emitting diodes connected with substrate electrodes through a bonding wire and covered with translucent resin are prepared. High density packaging is performed by arranging the plurality of substrates on respective side faces of a prismatic supporting material. The prismatic supporting material is provided with grooves or holes for performing high efficiency cooling by injecting cooling refrigerant of liquid or gas.
COPYRIGHT: (C)2007,JPO&INPIT

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