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121. 发明专利

JP2003008201A Method of manufacturing metal foil laminate and wiring board 审中-公开
标题翻译：制造金属箔层压板和接线板的方法
公开(公告)号：JP2003008201A
公开(公告)日：2003-01-10
申请号：JP2001182922
申请日：2001-06-18
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： KAWASHIMA TOSHIYUKI , TAWARA SHINJI , IKEDA KENICHI
IPC分类号： B32B5/18 , B32B15/08 , H05K3/00 , H05K3/02 , H05K3/38 , H05K3/40 , H05K3/46
CPC分类号： B32B15/08 , B32B5/18 , B32B7/12 , B32B27/281 , B32B27/32 , B32B27/34 , B32B27/36 , B32B37/00 , B32B2038/0076 , B32B2305/026 , B32B2311/00 , B32B2323/04 , B32B2323/10 , B32B2367/00 , B32B2377/00 , B32B2379/08 , B32B2398/10 , B32B2457/08 , H05K3/022 , H05K3/386 , H05K3/4069 , H05K3/4652 , H05K3/4655 , H05K2201/0116 , H05K2201/0154 , H05K2201/0195 , H05K2203/0191 , H05K2203/066 , H05K2203/1147 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/49163 , Y10T29/49165
摘要： PROBLEM TO BE SOLVED: To provide methods of manufacturing a metal foil laminate and a wiring board, where the metal foil laminate with a flat surface can be formed and improved in mass productivity because a gap for the lamination of metal foils can be controlled easily, and the problem caused due to solution hardly occurs when an adhesive layer is formed. SOLUTION: A method of manufacturing a metal foil laminate comprises a first process of forming an adhesive layer 12 that contains thermosetting resin on a lower wiring layer, a metal layer 1 or an insulation layer, a second process of temporarily attaches a porous layer 13 where a releasing film 11 is attached to the surface of the adhesive layer 12, a third process of separating the release type film 11 from the porous layer 13, a fourth process of laminating a metal foil 20 on the porous layer 13 where the releasing film 11 has been separated off, and a fifth process of thermocompressing the laminate, to shift the adhesive layer 12 to the metal foil 20 and combining them into one piece.
摘要翻译：要解决的问题：为了提供可以容易地控制金属箔层压间隙的金属箔层压体和布线板的制造方法，其中可以形成具有平坦表面的金属箔层压体并提高批量生产率，并且当形成粘合剂层时，由溶液引起的问题几乎不发生。解决方案：制造金属箔层压体的方法包括在下布线层，金属层1或绝缘层上形成含有热固性树脂的粘合剂层12的第一工艺，临时附着多孔层13的第二工艺，在粘合剂层12的表面上附着剥离膜11，将剥离型膜11与多孔层13分离的第3工序，在多孔层13上层叠金属箔20的第4工序，脱模膜11 已经分离出来，以及第五种热压层压体的方法，将粘合剂层12移动到金属箔20上并将它们组合成一体。

122. 发明专利

JPS6135245A Fluoropolymer composite material and novel manufacture thereof 失效
标题翻译：氟聚合物复合材料及其制造方法
公开(公告)号：JPS6135245A
公开(公告)日：1986-02-19
申请号：JP7915485
申请日：1985-04-12
申请人： Chem Fab Corp
发明人： JIYON EI ETSUFUENBAAGAA , ROBAATO SHII RIBANSU ZA SAADO
IPC分类号： B32B27/30 , B44C1/17 , H05K1/03
CPC分类号： B32B27/06 , B32B7/12 , B32B27/20 , B44C1/17 , H05K1/036 , H05K1/0366 , H05K2201/015 , H05K2201/0209 , H05K2201/0212 , H05K2203/066

123. 发明专利

JPS59175798A Flexible printed circuit board,improving method of printed board and improved printed board 失效
标题翻译：柔性印刷电路板，改进打印板和改进印刷板的方法
公开(公告)号：JPS59175798A
公开(公告)日：1984-10-04
申请号：JP1453684
申请日：1984-01-31
申请人： Inf Milit Spatiale Aeronaut
发明人： JIYATSUKU SERUBORU , KUROODO TONERA
IPC分类号： H05K3/28 , H05K1/00 , H05K1/14 , H05K3/00 , H05K3/22 , H05K3/30 , H05K3/34 , H05K3/36 , H05K3/38 , H05K3/46
CPC分类号： H05K3/363 , H05K1/0393 , H05K1/141 , H05K3/0058 , H05K3/225 , H05K3/305 , H05K3/3447 , H05K3/386 , H05K2201/096 , H05K2201/09845 , H05K2201/10666 , H05K2201/10977 , H05K2203/066

124. 发明专利

JPS5915936A Manufacture of substrate having through hole 失效
标题翻译：具有通孔的衬底的制造
公开(公告)号：JPS5915936A
公开(公告)日：1984-01-27
申请号：JP12531382
申请日：1982-07-19
申请人： Asahi Chem Ind Co Ltd
发明人： KAWATSUJI SHINICHI , YAMAGATA TAKESHI
IPC分类号： G03C5/00 , G03F7/16 , H05K3/00 , H05K3/06 , H05K3/28
CPC分类号： H05K3/281 , G03F7/161 , H05K3/0094 , H05K3/064 , H05K3/28 , H05K2203/066 , H05K2203/1394
摘要： PURPOSE:To obtain a substrate having through holes and showing high reliability and resolving power by laminating a liq. photosensitive resin on both sides of a substrate having electrically conductive metallic layers, curing the resin by exposure, forming polymer images by washing-out, removing the unmasked parts of the metallic layers, and removing the images. CONSTITUTION:Transparent flexible carriers 3 are coated with a liq. photosensitive resin 2 in a uniform thickness, and the resin coated surfaces are placed as opposed to a substrate 1 having electrically conductive metallic layers 1b. The carriers 3 are pressed against the substrate 1 under uniform pressure to laminate the resin 2 in a uniform thickness. Mask films 11 are brought into contact with the surfaces of the carriers 3, and the resin 2 is exposed to active light to form polymer images. The carriers 3 are stripped from the substrate 1, the unpolymerized resin 2 is washed out, and the unmasked parts of the layers 1b are removed by etching using the polymer images 2a present on both sides of the substrate 1 at holes 1a for through holes and the necessary parts. The images 12a are then removed. Thus, a substrate having through holes is obtd.
摘要翻译：目的：获得具有通孔的基板，通过层压液晶显示高可靠性和分辨能力。在具有导电金属层的基板的两侧上具有感光性树脂，通过曝光固化树脂，通过洗去形成聚合物图像，去除金属层的未被遮蔽的部分，以及去除图像。构成：透明柔性载体3涂有液体。感光性树脂2的厚度均匀，与具有导电性金属层1b的基板1相对地设置树脂被覆面。载体3在均匀的压力下压靠基板1，以均匀的厚度层压树脂2。掩模膜11与载体3的表面接触，并且树脂2暴露于活性光以形成聚合物图像。载体3从基板1剥离，未聚合的树脂2被清洗，并且通过使用存在于基板1的两侧的聚合物图像2a的孔1a中的通孔进行蚀刻来除去层1b的未掩蔽部分，必要的部分。然后移除图像12a。因此，具有通孔的基板。

125. 发明专利

JPS592049A Aligment and exposure of sheet substrate 失效
标题翻译：基材的表面和接触
公开(公告)号：JPS592049A
公开(公告)日：1984-01-07
申请号：JP10297183
申请日：1983-06-10
申请人： Du Pont
发明人： ROBAATO BAANAADO HEIAATO
IPC分类号： G03B27/02 , B32B37/24 , G03F7/16 , G03F7/20 , H05K3/00 , H05K3/02
CPC分类号： B32B37/24 , B32B37/0038 , G03F7/16 , G03F7/2035 , H05K3/0082 , H05K2203/066 , H05K2203/0759 , H05K2203/1572

126. 发明专利

JPS5721890A Laminating method 失效
标题翻译：层压方法
公开(公告)号：JPS5721890A
公开(公告)日：1982-02-04
申请号：JP8181581
申请日：1981-05-27
申请人： Du Pont
发明人： ABURAHAMU BAANAADO KOOEN
IPC分类号： G03C1/74 , B29C63/00 , B32B37/00 , B32B37/22 , B32B38/00 , B32B38/16 , G03F7/004 , G03F7/16 , H05K3/06 , H05K3/38
CPC分类号： B32B37/226 , B32B37/0038 , B32B38/162 , B32B2037/243 , B32B2309/02 , B32B2309/105 , B32B2311/12 , B32B2311/24 , B32B2457/08 , G03F7/161 , H05K2203/066 , H05K2203/068 , H05K2203/0783 , H05K2203/0786

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