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101. 发明专利

JP2001305073A METHOD AND DEVICE FOR PROCESSING INSPECTION DATA 失效
公开(公告)号：JP2001305073A
公开(公告)日：2001-10-31
申请号：JP2000128996
申请日：2000-04-25
申请人： HITACHI LTD
发明人： MAEDA SHUNJI , YOSHITAKE YASUHIRO , OKA KENJI , SHIMODA ATSUSHI , SHIBA MASATAKA
IPC分类号： G01N21/956 , G06T1/00 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a method and a device for processing inspection data, allowing the accurate selection of a critical defect on the basis of the inspection data detected by an appearance inspecting device. SOLUTION: This method for processing inspection data comprising position coordinate data and feature quantity data on a defect generated on an inspection object detected by an appearance inspecting device has a preparation process of previously storing a first criticalness determining data group corresponding to the sort of a region on the inspected object and a second criticalness determining data group corresponding to the category of the defect; a first criticalness determining process of determining the first critical level of the defect according to the sort of the region where the defect exists; a category imparting process of imparting a category to the defect in the inspection data; and a second criticalness determining process of determining the second criticalness of the defect on the basis of the second criticalness determining data selected according to the imparted category on the basis of the first critical level determined in the first criticalness determining process.

102. 发明专利

JPH11251377A DEFECT INSPECTION METHOD/DEVICE AND OBSERVATION OR ANALYSIS METHOD/SYSTEM FOR DEFECT 失效
公开(公告)号：JPH11251377A
公开(公告)日：1999-09-17
申请号：JP4985098
申请日：1998-03-02
申请人： HITACHI LTD
发明人： SHIMODA ATSUSHI , YOSHITAKE YASUHIRO , SHIBA MASATAKA
IPC分类号： H01L21/66
摘要： PROBLEM TO BE SOLVED: To reduce the stage positioning error of a defect inspection device and the error of the position coordinate of a defect owing to the deformation of a substrate to be inspected such as a wafer, by converting the position coordinate of the defect into a coordinate system based on design data through the use of the position coordinate of a measured reference position mark. SOLUTION: A picture signal outputted from an image sensor 3 is inputted to a defect detection part 8, and a defect coordinate 9 is outputted from the defect detection part 8. The picture signal from the sensor 3 and the position coordinate of the inspected substrate 1 from a linear scale 6 are inputted to an alignment mark detection part 10. The position coordinates 11 of alignment marks being reference marks installed for respective exposure units are calculated and outputted. In a defect coordinate conversion part 12, data which is read from a data recording part 12a is converted into a position coordinate system based on design data in a coordinate conversion 12c by using design data 12b, and it is recorded in a data recording part 12d. Thus, the error of the position coordinate of the defect can be reduced.

103. 发明专利

JPH1055957A METHOD AND APPARATUS FOR MAGNIFIED PROJECTION EXPOSURE 失效
公开(公告)号：JPH1055957A
公开(公告)日：1998-02-24
申请号：JP13817797
申请日：1997-05-28
申请人： HITACHI LTD
发明人： TANAKA TSUTOMU , OSHIDA YOSHITADA , SHIBA MASATAKA , NAKAJIMA NAOTO , FUNATSU RYUICHI
IPC分类号： G03F7/20 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To correct the optical system error to transfer a pattern from a mask to a substrate, thereby improving the throughput by relatively shifting the mask and substrate to magnify, project and expose the pattern on the substrate. SOLUTION: The apparatus comprises a mask 1 with a mask holder 2, magnifying lens 3 for magnifying and projecting a pattern of the mask on a substrate 4 with a substrate chuck 5 and exposure illuminating system for illuminating a resist on the substrate 4 through the lens 3. It is coupled with an actuator to drive the chuck 5 and with a computer 8 for controlling its driver 7 through an interface 9 and provided with a relative position detector for detect the relative position of patterns on the mask and substrate 4. Thus the pattern on the mask 1 is magnified, projected and exposed on the substrate 4 with relative shift of the mask 1 to the substrate 4.

104. 发明专利

JPH09213756A SEMICONDUCTOR MANUFACTURING METHOD AND ITS MANUFACTURING LINE 失效
公开(公告)号：JPH09213756A
公开(公告)日：1997-08-15
申请号：JP2091796
申请日：1996-02-07
申请人： HITACHI LTD
发明人： NOGUCHI MINORU , KENBO YUKIO , SHIBA MASATAKA
IPC分类号： G06M11/00 , B65G61/00 , G01N21/88 , G01N21/94 , G01N21/956 , G05B19/418 , G06Q50/00 , G06Q50/04 , H01L21/02 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To manage effectively a manufacturing line by a method wherein, in an intermediate portion of a manufacturing step of semiconductors, a foreign substance in a repetition pattern portion and a portion of low pattern density in chips is inspected and a generation state of a foreign substance is judged from manufacturing data and the inspection results. SOLUTION: In an intermediate portion of a manufacturing step of semiconductors, a foreign substance in a repetition pattern portion and a portion of low formation pattern density in chips of a semiconductor board 1 is inspected. A production state of a foreign substance of a manufacturing step and each manufacturing equipment in the manufacturing step is judged from manufacturing data and the inspection results. For example, an on-line monitor having a detection head 101, comprising illumination means 102, detection optical system 103, a rotation coordination mechanism 105, a space filter unit 106; a dictator 107, rotation detection means 108, an operational amplifier 210, and an A/D converter 202, inspects a foreign substance adhered onto the semiconductor board 1.

105. 发明专利

JPH08250385A SEMICONDUCTOR PRODUCING METHOD AND THE SYSTEM 失效
公开(公告)号：JPH08250385A
公开(公告)日：1996-09-27
申请号：JP5429895
申请日：1995-03-14
申请人： HITACHI LTD
发明人： KENBO YUKIO , SHIBA MASATAKA , MORIOKA HIROSHI , NISHIYAMA HIDETOSHI , DOI HIDEAKI , NOGUCHI MINORU , SHIGYO YOSHIHARU , MATSUOKA KAZUHIKO , WATANABE KENJI , OSHIMA YOSHIMASA , TANIGUCHI YUZO , ENDO FUMIAKI
IPC分类号： H01L21/66 , G01N21/88 , G01N21/94 , G01N21/956 , H01L21/02
摘要： PURPOSE: To increase a manufacturing yield by a method wherein the number of foreign matters to adhere to work before and after a process treatment, and by comparing the number of foreign matters adhered to work before the process with that after the process, the number of foreign matters adhered to work in the processing is processed. CONSTITUTION: Before a work (wafer) 4 is carried from work supply stations 8a, 8b to a process execution chamber 7, after an adhering condition of foreign matter, etc., to the work 4 is measured by a foreign matter detector 1, the work 4 is carried to the execution chamber 7 to perform film forming process and etching process. Next, the work 4 after the process treatment is measured for an adhering condition of foreign matter, etc., by the foreign matter detector 1, and thereafter, the work 4 is received in the stations 8a, 8b. At this time, the results of the adhering condition of foreign matter, etc., to the measured work 4 are processed in a data processing part 9 and stored in a memory. The processing part 9 performs a comparison processing of the number of foreign matters or a foreign matter detecting position between a foreign matter map before the precess treatment and the foreign matter map after the treatment to display the increased foreign matter map.

106. 发明专利

JPH0878320A PROJECTION TYPE ALIGNMENT METHOD AND ITS EQUIPMENT 失效
公开(公告)号：JPH0878320A
公开(公告)日：1996-03-22
申请号：JP1118795
申请日：1995-01-27
申请人： HITACHI LTD
发明人： SHIBA MASATAKA , OSHIDA YOSHITADA , KOIZUMI MITSUYOSHI , NAKADA TOSHIHIKO , UTO YUKIO
IPC分类号： G03F7/20 , G03B27/53 , G03F9/00 , H01L21/027
摘要： PURPOSE: To align a substrate to be exposed through a projection lens with high accuracy at high speed by extracting a reference place between a mask and a reference plate by exposure light by using a target mark formed onto the reference plate mounted on a substrate stage not coated with a resist. CONSTITUTION: A reference place between a mask and a reference plate by exposure light is extracted by using a target mark formed onto the reference plate installed onto a substrate stage not coated with a resist. An alignment mark shaped onto a substrate to be exposed such as a wafer is illuminated by illumination light for alignment having a wavelength different from an exposure wavelength. The alignment mark is detected through a projection lens, and the substrate to be exposed is aligned with the reference place. Accordingly, the substrate to be exposed can be aligned through the projection lens with high accuracy at high speed.

107. 发明专利

JPH07181350A OPTICAL INTERCONNECTOR AND ITS MANUFACTURE 失效
公开(公告)号：JPH07181350A
公开(公告)日：1995-07-21
申请号：JP32680693
申请日：1993-12-24
申请人： HITACHI LTD
发明人： SHISHIDO HIROAKI , FURUICHI HIROO , SAKAI TOSHIHIKO , SHIBA MASATAKA
IPC分类号： G02B6/24 , G02B6/30 , G02B6/42
摘要： PURPOSE:To suppress the influence on the reduction in coupling efficiency by the manufacturing error or positioning error of pitch by performing a coupling by use of a light emitting element array such as a fiber array or laser diode having an interval twice in the past. CONSTITUTION:When the imaging magnification of an optical coupling part such as lens is (m), and the difference between the highest temperature and lowest temperature of the using temperature of an optical interconnector is DELTAT, the thermal expansion ratio RD of the base material of a light emitting element array, the thermal expansion ratio RL of the base material of an optical coupling part array, and the holding material RF of an optical fiber array satisfy E>=((RD-RL)Xm-RF))x DELTAT on the basis of the allowance E of position slippage of the optical coupling part such as lens in which the loss of a preset optical coupling is within an allowable range. The interval of fibers 361 in a fiber array 36, the interval of lens 332 in a flat lens array, and the interval of elements 11 in a light emitting element array 311 such as laser diode are extended to 500mum which is twice.

108. 发明专利

JPH0711492B2 失效
公开(公告)号：JPH0711492B2
公开(公告)日：1995-02-08
申请号：JP19791190
申请日：1990-07-27
申请人： HITACHI LTD
发明人： UTO YUKIO , SHIBA MASATAKA , OSHIDA YOSHITADA
IPC分类号： G01B11/30 , G01N21/88 , G01N21/94 , G01N21/956 , H01L21/66

109. 发明专利

JPH065382B2 失效
公开(公告)号：JPH065382B2
公开(公告)日：1994-01-19
申请号：JP27520385
申请日：1985-12-09
申请人： HITACHI LTD
发明人： UTO YUKIO , SHIBA MASATAKA , KOIZUMI MITSUYOSHI , WAKAI KYOSHI
IPC分类号： H01L21/66 , G01N21/88 , G01N21/94 , G01N21/956 , G03F1/00 , G03F1/84 , H01L21/027 , H01L21/30 , G03F1/08

110. 发明专利

JPH063789B2 失效
公开(公告)号：JPH063789B2
公开(公告)日：1994-01-12
申请号：JP28920985
申请日：1985-12-24
申请人： HITACHI LTD
发明人： NAKADA TOSHIHIKO , OSHIDA YOSHITADA , SHIBA MASATAKA
IPC分类号： G03F9/00 , H01L21/027 , H01L21/30 , H01L21/67 , H01L21/68

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