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91. 发明专利

JP2014084255A Carbon nanotube thin film, transparent electrode and electrode for lithography 审中-公开
标题翻译：碳纳米薄膜，透明电极和电极用于光刻
公开(公告)号：JP2014084255A
公开(公告)日：2014-05-12
申请号：JP2012235106
申请日：2012-10-24
申请人： Hokkaido Univ , 国立大学法人北海道大学 , Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： FURUZUKI FUMIJI , YAMAURA ITARU , HABA EISUKE , YOSHII TAKAO , UEDA SHUNSUKE
IPC分类号： C01B31/02
摘要： PROBLEM TO BE SOLVED: To provide a carbon nanotube thin film having high transmittance and low sheet resistance.SOLUTION: There is provided a dispersion liquid of a carbon nanotube which contains a carbon nanotube having an average length of 10 μm or more.
摘要翻译：要解决的问题：提供具有高透射率和低薄层电阻的碳纳米管薄膜。解决方案：提供一种含有平均长度为10μm以上的碳纳米管的碳纳米管的分散液。

92. 发明专利

JP2014082489A Manufacturing method for multilayer wiring board 有权
标题翻译：多层布线板的制造方法
公开(公告)号：JP2014082489A
公开(公告)日：2014-05-08
申请号：JP2013204115
申请日：2013-09-30
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： SUGIBAYASHI MANABU , TAMURA TADASHI , WAKABAYASHI AKIHIKO , SUZUKI KUNIJI , ISODA SATOSHI
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a high density multilayer wiring board capable of reducing production man-hours and lead time.SOLUTION: A method for manufacturing a multilayer wiring board comprises: a step (A) for forming a core substrate on which an interlayer connection between wiring layers formed on both surfaces of an insulation layer via a through hole connecting their wiring layers, is formed thereon; a step (B) for overlaying the insulation layer and a metal foil on wiring layers formed on a lower layer side and an upper layer side of the core substrate respectively to stack them on a separation layer capable of physically separating layers; a step (C) for being multilayered the upper layer side of the core substrate by the build-up method to form a wiring layer having two or more layers, and for stacking the insulation layer and the metal foil; a step (D) for separating the multilayer wiring board by the separation layer; and a step (E) for forming a circuit on metal foils on both surfaces after insulation, and for forming the wiring layer.
摘要翻译：要解决的问题：提供能够降低生产工时和交货时间的高密度多层布线板。解决方案：一种多层布线板的制造方法，包括：形成芯基板的工序（A），其中夹层形成在绝缘层的两面上的配线层之间的连接通过连接其布线层的通孔而形成在其上; 分别在形成在芯基板的下层侧和上层侧的布线层上分别覆盖绝缘层和金属箔的工序（B），将其堆叠在能够物理分离层的分离层上; 通过聚集方法将芯基板的上层侧多层化以形成具有两层或多层的布线层，并堆叠绝缘层和金属箔的步骤（C）; 用于通过分离层分离多层布线板的步骤（D）; 以及用于在绝缘之后在两个表面上的金属箔上形成电路并形成布线层的步骤（E）。

93. 发明专利

JP2014082443A Multilayer wiring board 有权
标题翻译：多层接线板
公开(公告)号：JP2014082443A
公开(公告)日：2014-05-08
申请号：JP2013069054
申请日：2013-03-28
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： YAMAGUCHI HIROSHI , KURIHARA SEIICHI , SAKURAI HIROSHI , KANNA SHUNSUKE
IPC分类号： H05K3/46
CPC分类号： H05K1/116 , H05K1/0216 , H05K1/0218 , H05K1/0251 , H05K1/0298 , H05K1/115 , H05K3/0047 , H05K3/429 , H05K3/4611 , H05K2201/0154 , H05K2201/09509 , H05K2201/09518 , H05K2201/09545 , H05K2201/0959 , H05K2201/09854 , H05K2201/10287 , H05K2203/061 , H05K2203/1572
摘要： PROBLEM TO BE SOLVED: To provide a multilayer wiring board making it possible to mount a surface mount component having a narrow pitch, while increasing a wiring housing amount and suppressing a warpage amount.SOLUTION: A multilayer wiring board includes: a first metal foil wiring layer having at least two layers of metal foil wiring, arranged on a side of a mounting face for mounting a surface mount component; a wire wiring layer having an insulation coated wire, arranged on an inner layer side of the first metal foil wiring layer; a second metal foil wiring layer arranged on a side opposite to a mounting face for mounting the wire wiring layer; and an inter-layer conduction hole electrically connecting the metal foil wiring on a surface of the first metal foil wiring layer to the metal foil wiring in the inner layer of the first metal foil wiring layer or the insulation coated wire of the wire wiring layer or the second metal foil wiring. A hole diameter of the inter-layer conduction hole varies in a plate-thickness direction of the multilayer wiring board.
摘要翻译：要解决的问题：提供一种多层布线板，其可以在增加布线容纳量并抑制翘曲量的同时安装具有窄间距的表面安装部件。解决方案：多层布线板包括：第一金属箔布线层，具有至少两层金属箔布线，布置在用于安装表面安装部件的安装面的一侧; 具有绝缘被覆线的布线层布置在所述第一金属箔布线层的内层侧上; 第二金属箔布线层，布置在与用于安装所述布线层的安装面相对的一侧上; 以及将第一金属箔布线层的表面上的金属箔布线电连接到第一金属箔布线层的内层中的金属箔布线或布线层的绝缘被覆线的层间导电孔，或第二金属箔布线。层间导电孔的孔径在多层布线基板的板厚方向上变化。

94. 发明专利

JP2014082331A Liquid composition 有权
标题翻译：液体组合物
公开(公告)号：JP2014082331A
公开(公告)日：2014-05-08
申请号：JP2012229278
申请日：2012-10-16
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： KURODA KYOKO , KAMISHIRO YASUSHI , NAKAKO TAKEO , NODO TAKAAKI , INADA MAKI
IPC分类号： H01L21/306 , H01L31/06
CPC分类号： Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide a novel liquid composition capable of being used as an etching paste.SOLUTION: A liquid composition contains: at least one etching composition selected from among a Lewis acid containing, in the structure thereof, boron and halogen bonded to the boron, a salt of the Lewis acid, and a compound generating the Lewis acid; a solvent; and at least one fine particle selected from among an organic fine particle, a metal oxide particle and an inorganic fine particle. The etching composition is solid at room temperatures, and the percentage content of the fine particle is 0.1-5 mass% of the total.
摘要翻译：要解决的问题：提供能够用作蚀刻膏的新型液体组合物。溶液：液体组合物含有：至少一种蚀刻组合物，其选自在其结构中含有硼和卤素键合至硼，路易斯酸的盐和产生路易斯酸的化合物; 溶剂; 以及选自有机细颗粒，金属氧化物颗粒和无机细颗粒中的至少一种细颗粒。蚀刻组合物在室温下为固体，微粒的百分含量为总量的0.1〜5质量％。

95. 发明专利

JP2014080478A Resin composition for printed wiring board, resin film for printed wiring board and method for producing the same 有权
标题翻译：印刷线路板用树脂组合物，印刷线路板用树脂薄膜及其制造方法
公开(公告)号：JP2014080478A
公开(公告)日：2014-05-08
申请号：JP2012228183
申请日：2012-10-15
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： MIZUNO YASUYUKI , KONDO YUSUKE , MIZUSHIMA ETSUO , MURAI HIKARI , TANIGAWA TAKAO
IPC分类号： C08L53/02 , C08K5/13 , C08K5/159 , C08K5/3415 , C08K5/3492 , C08K9/06 , C08L63/00 , C08L79/04 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a resin composition for a printed wiring board capable of providing a printed wiring board with good dielectric characteristics in a high frequency region while sufficiently maintaining compatibility of a resin component and to provide a method for producing the same.SOLUTION: There is provided a resin composition for a printed wiring board which comprises: (A) a saturated thermoplastic elastomer having a styrene unit; (B) at least one component selected from the group consisting of an epoxy resin, a cyanate ester resin and a maleimide compound; and (C) a spherical silica which is surface-treated with an amino-based silane coupling agent, wherein the mass ratio W/Wof the (A) component to the (B) component is 0.43 to 5.0.
摘要翻译：要解决的问题：提供一种印刷线路板的树脂组合物，其能够在充分保持树脂组分的相容性的同时，在高频区域提供具有良好介电特性的印刷线路板，并提供其制造方法。提供一种用于印刷线路板的树脂组合物，其包括：（A）具有苯乙烯单元的饱和热塑性弹性体; （B）至少一种选自环氧树脂，氰酸酯树脂和马来酰亚胺化合物的组分; 和（C）用氨基类硅烷偶联剂进行表面处理的球形二氧化硅，其中（A）成分与（B）成分的质量比W / W为0.43〜5.0。

96. 发明专利

JP2014080464A Thermosetting resin composition 有权
标题翻译：热固性树脂组合物
公开(公告)号：JP2014080464A
公开(公告)日：2014-05-08
申请号：JP2012227493
申请日：2012-10-12
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社 , Tokyo Institute Of Technology , 国立大学法人東京工業大学
发明人： KOYAMA NAOYUKI , GOTO AKIHITO , KUBONAI MASATOSHI , AOKI TOSHIKO , TANAKA HIROHA
IPC分类号： C08L71/00 , B22C1/22 , C08K5/14 , C08K5/42
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition derived from plants, which is composed of a uniformly curable furan resin.SOLUTION: Provided a thermosetting resin composition and a method for curing the same, the surface and inside of a molded article of which become uniformly curable by adding a peroxide together with a curing agent into a furan resin, wherein the peroxide is selected from a hydrogen peroxide solution, sodium percarbonate, hydrogen peroxide, ammonium persulfate, potassium persulfate, sodium persulfate, hypochlorous acid and chlorous acid, and a content of the peroxide is 0.01 pts.mass or more and less than 5 pts.mass based on 100 pts.mass of the furan resin.
摘要翻译：要解决的问题：提供由均匀固化的呋喃树脂组成的植物衍生的热固性树脂组合物。溶解性：提供一种热固性树脂组合物及其固化方法，其中模塑制品的表面和内部通过将一种过氧化物与固化剂一起加入到呋喃树脂中，可以均匀地固化，其中过氧化物选自过氧化氢溶液，过碳酸钠，过氧化氢，过硫酸铵，过硫酸钾，过硫酸钠，次氯酸和氯酸，以及基于100份呋喃树脂，过氧化物的含量为0.01质量份或更多且小于5份。

97. 发明专利

JP2014078663A Thermoelectric conversion element assembly, thermoelectric conversion module and manufacturing method of the same 有权
标题翻译：热电转换元件组件，热电转换模块及其制造方法
公开(公告)号：JP2014078663A
公开(公告)日：2014-05-01
申请号：JP2012226858
申请日：2012-10-12
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： FUJIWARA SHINICHI , TOHIRA TOMOTAKE , ISHIJIMA ZENZO , JINUSHI TAKAHIRO , HATA SHOHEI
IPC分类号： H01L35/08 , H01L35/14 , H01L35/32 , H01L35/34 , H02N11/00
CPC分类号： H01L35/32 , H01L35/08 , H01L35/34
摘要： PROBLEM TO BE SOLVED: To suppress a drop of bonding reliability between a thermoelectric conversion element and an electrode even under a high temperature environment and to efficiently transmit a peripheral temperature to the thermoelectric conversion element, in a structure where the thermoelectric conversion element and the electrode of a thermoelectric conversion module are bonded.SOLUTION: A thermoelectric conversion module includes a structure where a plurality of P-type thermoelectric conversion elements and a plurality of N-type thermoelectric conversion elements are alternately arranged and they are electrically connected in series with electrode materials. Portions of the electrode materials, which are connected with the P-type thermoelectric conversion elements, and portions of the electrode materials, which are connected with the N-type thermoelectric conversion elements, are formed of different materials.
摘要翻译：要解决的问题：为了抑制即使在高温环境下热电转换元件和电极之间的接合可靠性降低并且有效地将周围温度传递到热电转换元件，在热电转换元件和电极的热电转换模块。热电转换模块包括多个P型热电转换元件和多个N型热电转换元件交替布置并且与电极材料串联电连接的结构。与N型热电转换元件连接的与P型热电转换元件连接的电极材料的部分和电极材料的部分由不同的材料形成。

98. 发明专利

JP2014075959A Thermoelectric generator 有权
标题翻译：热电发生器
公开(公告)号：JP2014075959A
公开(公告)日：2014-04-24
申请号：JP2012223632
申请日：2012-10-05
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社 , Honda Motor Co Ltd , 本田技研工業株式会社
发明人： JINUSHI TAKAHIRO , TOMINAGA MASANAO , ISHIJIMA ZENZO , MORI MASAYOSHI , YAMAGAMI TAKESHI , MATSUDA HIROSHI
IPC分类号： H02N11/00 , H01L35/32
摘要： PROBLEM TO BE SOLVED: To bring each of heating-side and cooling-side plate members, which are provided on both sides of a thermoelectric conversion module to create a temperature difference therefor, in a hermetically sealed container into close contact with the thermoelectric conversion module in a uniformly pressurized state without complexity and increased costs.SOLUTION: In a hermetically sealed container 3 including a circulation pipe 35 through which a heated fluid H is flown and which is disposed on the inside of a housing 30, the housing 30 includes a movable plate part 31 having a flexible deformable part 313 provided on the periphery of an inside rigid part 312. A thermoelectric conversion module 4 is sandwiched between the inside rigid part 312 and an inner plate part 36 of the circulation pipe 35 to be disposed, and the movable plate part 31 is cooled with cooling water W supplied into cooling jackets 53a, 53b provided on the outside of the movable plate part 31. The deformable part 313 of the movable plate part 31 is deformed by an inner pressure caused in the cooling jackets 53a, 53b, so that the inside rigid part 312 is pressurized to contact with the thermoelectric conversion module 4.
摘要翻译：要解决的问题：为了使设置在热电转换模块的两侧的每个加热侧和冷却侧板构件在气密密封的容器中形成与该热电转换模块紧密接触的温差处于均匀的加压状态，没有复杂性和增加的成本。解决方案：在包括循环管35的气密密封容器3中，加热的流体H通过该循环管35被设置在壳体30的内部，壳体30包括可移动的板部31具有设置在内部刚性部312的外周上的柔性变形部313.热电转换模块4夹在内部刚性部312和要布置的循环管35的内板部36之间，可动板部31被供给到设置在可动板部31的外侧的冷却套53a，53b的冷却水W冷却。变形通过在冷却套53a，53b中产生的内压使可动板部31的能量部313变形，使得内部刚性部312被加压而与热电转换模块4接触。

99. 发明专利

JP2014075541A Thermoelectric generator 有权
标题翻译：热电发生器
公开(公告)号：JP2014075541A
公开(公告)日：2014-04-24
申请号：JP2012223442
申请日：2012-10-05
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社 , Honda Motor Co Ltd , 本田技研工業株式会社
发明人： JINUSHI TAKAHIRO , TOMINAGA MASANAO , ISHIJIMA ZENZO , MORI MASAYOSHI , YAMAGAMI TAKESHI , MATSUDA HIROSHI
IPC分类号： H01L35/30 , H02N11/00
摘要： PROBLEM TO BE SOLVED: To bring each of heating-side and cooling-side plate members, which are provided on both sides of a thermoelectric conversion module to create a temperature difference therefor, in a hermetically sealed container into close contact with the thermoelectric conversion module in a uniformly pressurized state without complexity and increased costs.SOLUTION: In a hermetically sealed container 3, which has a circulation pipe 35 disposed on the inside of a housing 30, the housing 30 includes a movable plate part 31 having a flexible deformable part 313 provided on the periphery of an inside rigid part 312, and is disposed such that a thermoelectric conversion module 4 is sandwiched between the inside rigid part 312 and an inner plate part 36 of the circulation pipe 35 in the hermetically sealed container 3. When the inside of the hermetically sealed container 3 is depressurized, the deformable part 313 of the movable plate part 31 deforms such that the inside rigid part 312 is brought into close contact with the thermoelectric conversion module 4 in a uniformly pressurized state. By cooling the inside rigid part 312 of the movable plate part 31 with cooling parts 5A, 5B and flowing a heated fluid H through the circulation pipe 35 to heat the inner plate part 36, a temperature difference is created for the thermoelectric conversion module 4 to generate power.
摘要翻译：要解决的问题：为了使设置在热电转换模块的两侧的每个加热侧和冷却侧板构件在气密密封的容器中形成与该热电转换模块紧密接触的温差在均匀加压的状态下，没有复杂性并增加成本。解决方案：在具有设置在壳体30内部的循环管35的气密密封容器3中，壳体30包括具有柔性可变形部分313的可动板部分31 设置在内部刚性部312的周边，并且被配置为使得热电转换模块4夹在密封容器3内的循环管35的内部刚性部312和内板部36之间。当内部气密容器3的可变形部313被减压，使可动板部31的变形部313发生变形， 312以均匀加压状态与热电转换模块4紧密接触。通过用冷却部件5A，5B冷却可动板部件31的内部刚性部件312并使加热的流体H流过循环管35以加热内部板件36，从而产生热电转换模块4的温度差发电。

100. 发明专利

JP2014072447A Composition for formation of semiconductor substrate passivation film, semiconductor substrate with passivation film and manufacturing method thereof, and solar battery element and manufacturing method thereof 有权
标题翻译：用于形成半导体衬底钝化膜的组合物，具有钝化膜的半导体衬底及其制造方法及其太阳能电池元件及其制造方法
公开(公告)号：JP2014072447A
公开(公告)日：2014-04-21
申请号：JP2012218464
申请日：2012-09-28
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： HAYASAKA TAKESHI , TANAKA TORU , YOSHIDA MASATO , NOJIRI TAKESHI , KURATA YASUSHI , ODA AKIHIRO
IPC分类号： H01L21/316 , H01L21/312 , H01L31/04
CPC分类号： Y02E10/50 , Y02P70/521
摘要： PROBLEM TO BE SOLVED: To provide a composition for formation of a semiconductor substrate passivation film which makes possible to form a semiconductor substrate passivation film in a desired shape by a simple and convenient method, and to suppress the occurrence of unevenness in printing.SOLUTION: A composition for formation of a semiconductor substrate passivation film comprises: an organic aluminum compound expressed by the general formula (I) below; and at least one compound selected from a metal oxide and a silicon oxide. In the formula (I), R's represent an alkyl group with 1-8 carbon atoms independently of each other; n represents an integer of 0-3; Xand Xrepresent an oxygen atom or a methylene group independently of each other; and R, Rand Rrepresent a hydrogen atom or an alkyl group with 1-8 carbon atoms independently of each other. [Formula (I)]
摘要翻译：要解决的问题：提供一种用于形成半导体衬底钝化膜的组合物，其可以通过简单方便的方法形成所需形状的半导体衬底钝化膜，并且抑制印刷中的不均匀性的发生。解决方案：用于形成半导体衬底钝化膜的组合物包括：由下述通式（I）表示的有机铝化合物; 和至少一种选自金属氧化物和氧化硅的化合物。在式（I）中，R表示彼此独立地具有1-8个碳原子的烷基; n表示0-3的整数; X和X独立地表示氧原子或亚甲基; 并且R，Rand R表示氢原子或具有1-8个碳原子的烷基彼此独立地表示。 [式（I）]

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