专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2011033592A Gas measurement board unit and gas measuring system, and method for manufacturing gas measurement board unit 审中-公开
标题翻译：气体测量板单元和气体测量系统以及制造气体测量板单元的方法
公开(公告)号：JP2011033592A
公开(公告)日：2011-02-17
申请号：JP2009182948
申请日：2009-08-06
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： KOIDE AKIRA , OKADA RYOJI
IPC分类号： G01N27/12 , G01N9/00 , G01N27/04
摘要： PROBLEM TO BE SOLVED: To obtain a compact and low cost gas measurement board unit by integrating gas absorption films having different gas absorption characteristics. SOLUTION: The gas measurement board unit includes a plurality of gas absorption films formed with a gap on the surface of a board and an electric wiring for detecting an electric output value in each of the gas absorption films. In the gas measurement board unit, a heat insulating part is provided between the juxtaposing gas absorption films. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：通过集成具有不同气体吸收特性的气体吸收膜来获得紧凑且低成本的气体测量板单元。气体测量板单元包括在板表面上形成有间隙的多个气体吸收膜和用于检测每个气体吸收膜中的电输出值的电线。在气体测量板单元中，在并置气体吸收膜之间设置隔热部。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2009204584A Chemical sensor device, and material measuring device equipped with it 审中-公开
标题翻译：化学传感器装置及其配备的材料测量装置
公开(公告)号：JP2009204584A
公开(公告)日：2009-09-10
申请号：JP2008050003
申请日：2008-02-29
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： KOIDE AKIRA , OKADA RYOJI , KAZAMA ATSUSHI
IPC分类号： G01N5/02
摘要： PROBLEM TO BE SOLVED: To provide a chemical material measuring device which can reduce a cost of a conventional device while maintaining selectivity (resolution capability) to the same level as that of the device or higher.
SOLUTION: This invented chemical sensor utilizes a variation in the resonance frequency of a vibrator when a molecule has been absorbed to or removed from the vibrator. In the sensor, a vibrator substrate composed of a plurality of vibrators different in desorption properties of chemical materials is laminated with a piezoelectric substrate which may be deformed if a voltage is superimposed. Thus the plurality of all vibrators constituting the vibrator substrate is simultaneously excited by the excitation of the vibrator substrate utilizing the deformation of the piezoelectric substrate when an AC voltage has been applied to the piezoelectric substrate.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种化学材料测量装置，其可以降低常规装置的成本，同时将选择性（分辨率能力）保持在与装置或更高装置相同的水平。解决方案：当分子已经被吸收到振动器或从振动器移除时，本发明的化学传感器利用振动器的共振频率的变化。在传感器中，将由化学材料的解吸性不同的多个振动体构成的振动器基板与压电基板层叠，压电基板如果叠加有电压则会变形。因此，当对压电基板施加交流电压时，利用压电基板的变形，振子基板的激发同时激励构成振动器基板的多个所有振动器。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2009075039A Semiconductor strain sensor, and attaching method of semiconductor strain sensor 有权
标题翻译：半导体应变传感器和半导体应变传感器的连接方法
公开(公告)号：JP2009075039A
公开(公告)日：2009-04-09
申请号：JP2007246695
申请日：2007-09-25
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： KAZAMA ATSUSHI , OKADA RYOJI , KAWAI TETSURO
IPC分类号： G01B7/16 , G01L1/18
摘要： PROBLEM TO BE SOLVED: To stabilize characteristics for a long period of time and stabilize the conversion coefficient of a strain generated in the strain sensor chip corresponding to a strain of a subject to be measured, within a strain range, in a semiconductor strain sensor having a semiconductor strain sensor gauge.
SOLUTION: The back surface of a strain sensor chip is bonded to a base board surface, and a groove that has a length of a side length or longer and separates a strain sensor chip connecting part from a connecting area is formed in the back surface of the base board and in the side part of the strain sensor chip. A projecting part surrounded by the groove is formed in the back surface of the strain sensor chip, thereby improving the rigid balance between front and back sides, suppressing bending deformation of the strain sensor chip, and stabilizing the conversion coefficient of the strain.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了稳定长时间的特性并且使应变传感器芯片中产生的应变的变换系数稳定在应变测量对象的应变范围内，在半导体中应变传感器具有半导体应变传感器。解决方案：将应变传感器芯片的背面接合到基板表面，并且形成具有侧部长度或更长的长度并且将应变传感器芯片连接部分与连接区域分离的凹槽基板的后表面和应变传感器芯片的侧面部分。在应变传感器芯片的背面形成由凹槽包围的突出部，从而提高前后两面之间的刚性平衡，抑制应变传感器芯片的弯曲变形，并稳定应变的转换系数。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2008276158A Substrate component and optical component 审中-公开
标题翻译：基板部件和光学部件
公开(公告)号：JP2008276158A
公开(公告)日：2008-11-13
申请号：JP2007219773
申请日：2007-08-27
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： ANDO TAKAYUKI , FURUSAWA MITSUYASU , HAMAGUCHI YASUHIRO , OKADA RYOJI
IPC分类号： G02B7/182 , G02B7/02 , G02B26/08
摘要： PROBLEM TO BE SOLVED: To provide a substrate component, with which an optical component can be assembled with high accuracy and convenience assembled, and to provide an optical component that uses the component. SOLUTION: The substrate component is for holding an optical element and is such that grooves to be installed on fixed shafts for positioning are formed on both sides of a section for mounting the optical element, and dimensions of depth from the base to the edge of the groove are different between that on the center side of the substrate component and that on the end side thereof; furthermore, a through-hole or an opening part for passing an optical path guided to the optical element is arranged on the substrate component so as to penetrate the substrate component, along the longitudinal direction of the groove. Furthermore, the groove has a semicircular, a semi-oblong or a square cross-sectional shape which is perpendicular to the longitudinal direction of the groove. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种可以组装高精度和方便组装光学部件的基板部件，并提供使用该部件的光学部件。解决方案：基板部件用于保持光学元件，并且使得安装在用于定位的固定轴上的槽形成在用于安装光学元件的部分的两侧上，并且从基部到槽的边缘在基板部件的中心侧和端部侧的边缘之间不同; 此外，通过导向光学元件的光路的通孔或开口部，沿着槽的长度方向布置在基板部件上，以穿透基板部件。此外，槽具有垂直于槽的纵向方向的半圆形，半长方形或正方形横截面形状。版权所有（C）2009，JPO＆INPIT

5. 发明专利

JP2008190892A Acceleration sensor and electronic device using it 审中-公开
标题翻译：加速传感器和使用它的电子设备
公开(公告)号：JP2008190892A
公开(公告)日：2008-08-21
申请号：JP2007022888
申请日：2007-02-01
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： OKADA RYOJI , TAKADA YOSHIAKI
IPC分类号： G01P15/12 , G01P15/125 , G01P15/18 , H01L29/84 , H01L41/08
摘要： PROBLEM TO BE SOLVED: To provide an acceleration sensor capable of detecting even acceleration having a greatly different level, and having a small size and high versatility.
SOLUTION: This acceleration sensor has a support frame, the first weight part held by the support frame through the first beam part having flexibility, and the second weight part held by the first weight part through the second beam part having flexibility. The acceleration sensor has characteristics wherein the first weight part is arranged inside the support frame, and the second weight part is arranged inside the first weight part, and the first acceleration sensor part and the second acceleration sensor part are provided respectively on the first beam part and the second beam part.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够检测均匀加速度的加速度传感器，具有很小的尺寸和高的通用性。解决方案：该加速度传感器具有支撑框架，第一重量部分由支撑框架通过具有柔性的第一梁部分保持，并且第二重量部分通过具有柔性的第二梁部分由第一重量部分保持。加速度传感器的特征在于，第一重量部配置在支撑框架的内部，第二重量部配置在第一重量部内，第一加速度传感器部和第二加速度传感器部分别分别设置在第一梁部和第二梁部分。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2009117869A Method of manufacturing functional element package 有权
标题翻译：制造功能元件包的方法
公开(公告)号：JP2009117869A
公开(公告)日：2009-05-28
申请号：JP2009039183
申请日：2009-02-23
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： HATA SHOHEI , MATSUSHIMA NAOKI , SAKAMOTO EIJI , OKADA RYOJI , AONO TAKANORI , KAZAMA ATSUSHI , KIDA TOSHIKI
IPC分类号： H01L23/02
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive functional element package having an improved manufacturing yield by providing bonding construction superior in solder wettability and bonding property, in a structure for air-sealing a functional element at a wafer level with solder bonding.
SOLUTION: The method of manufacturing functional element package includes: a step of preparing a first Si substrate 5 having a recessed portion 25 formed on the substrate, a metallized portion 22B formed on the surface of the substrate including the recessed portion, and a soldered portion 23 formed on the metallized portion; a step of preparing a second Si substrate 1 having a metallized portion 22A formed on the substrate; a step of making the first Si substrate and the second Si substrate opposing each other; and a step of making the opposed first and second Si substrates close to each other and bonding them to each other.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：通过提供焊料润湿性和接合性能优异的接合结构，提供一种廉价的功能元件封装，其具有通过焊接粘合在晶片级空气密封功能元件的结构，具有提高的制造成品率。解决方案：制造功能元件封装的方法包括：制备具有形成在基板上的凹部25的第一Si基板5的步骤，形成在包括凹部的基板的表面上的金属化部22B，以及形成在金属化部分上的焊接部分23; 制备在基板上形成有金属化部分22A的第二Si基板1的步骤; 使第一Si衬底和第二Si衬底彼此相对的步骤; 以及使相对的第一和第二Si衬底彼此靠近并将它们彼此结合的步骤。版权所有（C）2009，JPO＆INPIT

7. 发明专利

JP2008177481A Semiconductor sensor device and manufacturing method therefor 有权
标题翻译：半导体传感器器件及其制造方法
公开(公告)号：JP2008177481A
公开(公告)日：2008-07-31
申请号：JP2007011473
申请日：2007-01-22
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： AONO TAKANORI , OKADA RYOJI , KAZAMA ATSUSHI , TAKADA YOSHIAKI
IPC分类号： H01L23/02 , B81C3/00 , H01L21/56 , H01L29/84
CPC分类号： H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To resolve problems, wherein when a MEMS assembly in which a MEMS chip and a silicon-made cap chip are jointed is resin-casted, wires move and contact with a side of the silicon-made cap chip, thereby generating noises and line short circuiting. SOLUTION: The side of the silicon-made cap chip is formed by wet etching, and an insulation protecting film is formed on the wet-etched surface, thereby forming the insulation protecting film having a high adhesion force; whereby even if wires moves and come into contact with a cap chip side at resin-molding, generation of noises and line short circuiting can be prevented. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了解决问题，其中当MEMS芯片和硅制帽芯片接合的MEMS组件被树脂铸造时，导线移动并与硅制帽盖的一侧接触，从而产生噪声和线路短路。解决方案：通过湿式蚀刻形成硅制帽盖的一侧，并且在湿蚀刻表面上形成绝缘保护膜，从而形成具有高粘合力的绝缘保护膜; 由此即使电线在树脂成型时移动并与盖芯片侧接触，也可以防止产生噪声和线路短路。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2009053180A Acceleration sensor 审中-公开
标题翻译：加速传感器
公开(公告)号：JP2009053180A
公开(公告)日：2009-03-12
申请号：JP2007319038
申请日：2007-12-11
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： KAZAMA ATSUSHI , SAITO MASAKATSU , OKADA RYOJI , AONO TAKANORI
IPC分类号： G01P15/12 , G01P15/18 , H01L29/84
CPC分类号： G01P15/18 , G01P15/123 , G01P2015/0842 , H01L24/45 , H01L2224/32145 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48247 , H01L2224/73265 , H01L2924/1461 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/20752 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide an acceleration sensor of which properties such as sensitivity hardly change to disturbing forces added to a sensor chip. SOLUTION: The acceleration sensor has a supporting frame; a weight part supported in the supporting frame via flexible beam parts; semiconductor piezoresistive elements provided in the beam parts; and wiring for connecting them. The acceleration sensor detects acceleration on the basis of changes in the resistance of the piezoresistive elements. Stress buffering parts are formed in the beam parts except parts in which the piezoresistive elements are formed. The stress buffering parts are formed at approximately center parts of the beam part. Even if disturbing forces are added to a sensor element in the longitudinal directions of the beam parts, the stress buffering parts absorbs the disturbing forces. Since stress in the longitudinal directions of the beam parts hardly changes, the shape changeability of beams hardly changes to reduce sensitivity changes due to the effects of disturbing forces. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种加速度传感器，其特性如灵敏度对于传感器芯片中的干扰力几乎不变化。
解决方案：加速度传感器具有支撑框架; 通过柔性梁部支撑在支撑框架中的重物; 提供在梁部分的半导体压阻元件; 和连接它们的接线。加速度传感器基于压阻元件的电阻的变化来检测加速度。应力缓冲部分形成在除了形成压阻元件的部分之外的梁部分中。应力缓冲部分形成在梁部分的大致中心部分。即使在梁部件的纵向方向上将扰动力加到传感器元件上，应力缓冲部分也吸收干扰力。由于梁部件的纵向方向的应力几乎不变化，所以光束的形状变化性几乎不变化，以减少由于干扰力的影响而导致的灵敏度变化。版权所有（C）2009，JPO＆INPIT

9. 发明专利

JP2009053179A Acceleration sensor 有权
公开(公告)号：JP2009053179A
公开(公告)日：2009-03-12
申请号：JP2007319037
申请日：2007-12-11
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： KAZAMA ATSUSHI , SAITO MASAKATSU , OKADA RYOJI , AONO TAKANORI
IPC分类号： G01P15/12 , G01P15/18 , H01L29/84
CPC分类号： G01P15/18 , G01P15/123 , G01P2015/0842 , H01L24/45 , H01L2224/32145 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48247 , H01L2224/73265 , H01L2924/1461 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/20752 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide an acceleration sensor of which properties such as sensitivity hardly change to disturbing forces added to a sensor chip. SOLUTION: The acceleration sensor has a supporting frame; a weight part supported in the supporting frame via flexible beam parts; semiconductor piezoresistive elements provided in the beam parts; and wiring for connecting them. The acceleration sensor detects acceleration on the basis of changes in the resistance of the piezoresistive elements. Stress buffering parts are formed in the beam parts except parts in which the piezoresistive elements are formed. The stress buffering parts are formed at approximately center parts of the beam part. Even if disturbing forces are added to a sensor element in the longitudinal directions of the beam parts, the stress buffering parts absorbs the disturbing forces. Since stress in the longitudinal directions of the beam parts hardly changes, the shape changeability of beams hardly changes to reduce sensitivity changes due to the effects of disturbing forces. COPYRIGHT: (C)2009,JPO&INPIT

10. 发明专利

JP2008070312A Multi-range acceleration sensor 审中-公开
标题翻译：多范围加速度传感器
公开(公告)号：JP2008070312A
公开(公告)日：2008-03-27
申请号：JP2006251006
申请日：2006-09-15
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： KAZAMA ATSUSHI , OKADA RYOJI , SAITO MASAKATSU , SUGIMOTO MASAKAZU
IPC分类号： G01P15/08 , G01P15/12 , G01P15/18 , H01L29/84
摘要： PROBLEM TO BE SOLVED: To manufacture a plurality of three-axis acceleration sensors of significantly different measurement ranges in small area at low cost, and to accurately align the directions of the acceleration detection axes of the plurality of sensors. SOLUTION: A first three-axis acceleration sensor element comprises a frame section, a weight section held in the frame section via a flexible section, and a semiconductor piezo resistance element disposed in the flexible section. In the frame section of the first three-axis acceleration sensor element, a second three-axis acceleration sensor element having an output voltage per unit acceleration smaller than that of the first three-axis acceleration sensor element is formed. The miniaturization is allowed by sharing the frame section, the manufacturing cost is low because collective formation on one chip is allowed by a process of photolithography, etching or the like, and the acceleration detection axes of the plurality of sensor elements are aligned at a high photolithography mask accuracy. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：以低成本在小面积上制造具有显着不同的测量范围的多个三轴加速度传感器，并且精确地对准多个传感器的加速度检测轴的方向。解决方案：第一三轴加速度传感器元件包括框架部分，通过柔性部分保持在框架部分中的配重部分和设置在柔性部分中的半导体压电电阻元件。在第一三轴加速度传感器元件的框架部分中，形成具有小于第一三轴加速度传感器元件的单位加速度的输出电压的第二三轴加速度传感器元件。通过共享框架部分允许小型化，制造成本低，因为通过光刻，蚀刻等的处理允许一个芯片上的集体形成，并且多个传感器元件的加速度检测轴对齐在高处光刻掩模精度。版权所有（C）2008，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式