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1. 发明专利

JP2009117869A Method of manufacturing functional element package 有权
标题翻译：制造功能元件包的方法
公开(公告)号：JP2009117869A
公开(公告)日：2009-05-28
申请号：JP2009039183
申请日：2009-02-23
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： HATA SHOHEI , MATSUSHIMA NAOKI , SAKAMOTO EIJI , OKADA RYOJI , AONO TAKANORI , KAZAMA ATSUSHI , KIDA TOSHIKI
IPC分类号： H01L23/02
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive functional element package having an improved manufacturing yield by providing bonding construction superior in solder wettability and bonding property, in a structure for air-sealing a functional element at a wafer level with solder bonding.
SOLUTION: The method of manufacturing functional element package includes: a step of preparing a first Si substrate 5 having a recessed portion 25 formed on the substrate, a metallized portion 22B formed on the surface of the substrate including the recessed portion, and a soldered portion 23 formed on the metallized portion; a step of preparing a second Si substrate 1 having a metallized portion 22A formed on the substrate; a step of making the first Si substrate and the second Si substrate opposing each other; and a step of making the opposed first and second Si substrates close to each other and bonding them to each other.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：通过提供焊料润湿性和接合性能优异的接合结构，提供一种廉价的功能元件封装，其具有通过焊接粘合在晶片级空气密封功能元件的结构，具有提高的制造成品率。解决方案：制造功能元件封装的方法包括：制备具有形成在基板上的凹部25的第一Si基板5的步骤，形成在包括凹部的基板的表面上的金属化部22B，以及形成在金属化部分上的焊接部分23; 制备在基板上形成有金属化部分22A的第二Si基板1的步骤; 使第一Si衬底和第二Si衬底彼此相对的步骤; 以及使相对的第一和第二Si衬底彼此靠近并将它们彼此结合的步骤。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2008218811A Function element package 审中-公开
标题翻译：功能元件包
公开(公告)号：JP2008218811A
公开(公告)日：2008-09-18
申请号：JP2007055860
申请日：2007-03-06
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： HATA SHOHEI , MATSUSHIMA NAOKI , SAKAMOTO EIJI , OKADA RYOJI , AONO TAKANORI , KAZAMA ATSUSHI , KIDA TOSHIKI
IPC分类号： H01L23/02
CPC分类号： B81C1/00269 , B81C2203/019 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive function element package by providing a bonding structure which has superior solder wettability and has bonding property as a structure for airtightly sealing a function element by soldering at a wafer level, and improving the manufacture yield. SOLUTION: The function element package includes the function element, a first Si substrate 1 having a metallized-22A recessed portion 25 on an internal surface, and a second Si substrate 5 metallized 22B at a position opposed to the recessed portion 25, and the metallization 22A performed on the internal surface of the recessed portion 25 formed on the first Si substrate 1 and the metallization 22B performed at the position of the second Si substrate 5 opposed to the recessed portion 25 are connected by melting a solder 23 to join the first Si substrate 1 and second Si substrate 5 together, thereby airtightly sealing the function element. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决问题：为了提供廉价的功能元件封装，通过提供具有优异的焊料润湿性的粘合结构，并且具有作为通过在晶片级焊接气密密封功能元件的结构的结合特性，并且提高制造成品率。功能元件封装包括功能元件，在内表面上具有金属化-22A凹部25的第一Si衬底1和与凹部25相对的位置处金属化的第二Si衬底5，在形成在第一Si衬底1上的凹部25的内表面上进行的金属化22A和在与凹部25相对的第二Si衬底5的位置处执行的金属化22B通过熔化焊料23连接第一Si衬底1和第二Si衬底5在一起，从而气密地密封功能元件。版权所有（C）2008，JPO＆INPIT

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