专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2012184491A Device for mounting ceramic substrate to inner set rack 审中-公开
标题翻译：将陶瓷衬底安装到内置机架上的装置
公开(公告)号：JP2012184491A
公开(公告)日：2012-09-27
申请号：JP2011050034
申请日：2011-03-08
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： YAMADA HIROSHI
IPC分类号： C25D17/08
摘要： PROBLEM TO BE SOLVED: To provide a device for mounting a ceramic substrate to an inner set rack, capable of accurately attaching a pair of pins in which the bend of pins is corrected while preventing the destruction of the ceramic substrate.SOLUTION: The device 10 for mounting the ceramic substrate to the inner set rack includes: a support 11 for mounting the inner set rack 20 in a horizontal state; a table 12 for mounting the ceramic substrate 30; a projection part 13 for clamping a vertical member 21 in it; a pressurizing body 14 for opening the pin 23; a guide groove 15 for correcting the bend of the pin 23; a means for mounting the inner set rack 20 to the support 11, then clamping the vertical member 21 by the projection part 13 and fixing it; a means for opening the pin 23 while correcting the bend; and a means for mounting the ceramic substrate 30, clamping a notched part 35 of the ceramic substrate 30 by a pawl part 24 by releasing pressurization of the pressurizing body 14, and then releasing pressurization by the projection part 13.
摘要翻译：要解决的问题：为了提供一种用于将陶瓷基板安装到内部固定架上的装置，能够精确地安装一对销，其中销的弯曲被校正，同时防止陶瓷基板的破坏。＆lt; P＆gt;解决方案：用于将陶瓷基板安装到内置架上的装置10包括：用于将内置架20安装在水平状态的支撑件11; 用于安装陶瓷基板30的工作台12; 用于将垂直构件21夹紧在其中的突出部13; 用于打开销23的加压体14; 用于校正销23的弯曲的引导槽15; 用于将内部固定架20安装到支撑件11上的装置，然后通过突出部分13夹紧垂直构件21并将其固定; 用于在校正弯头的同时打开销23的装置; 以及用于安装陶瓷基板30的装置，通过释放加压体14的加压，通过棘爪部分24夹持陶瓷基板30的切口部分35，然后通过突出部分13释放加压。 C）2012，JPO＆INPIT

2. 发明专利

JP2012138437A Electronic component housing package 审中-公开
标题翻译：电子元件封装
公开(公告)号：JP2012138437A
公开(公告)日：2012-07-19
申请号：JP2010289079
申请日：2010-12-27
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： YAMAMOTO TOMOYASU
IPC分类号： H01L23/14 , H01L23/34 , H01L23/373 , H01S5/022
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive electronic component housing package capable of efficiently radiating heat from electronic components.SOLUTION: In an electronic component housing package 10 including a rectangular plate-shaped substrate 11 for mounting electronic components for optical communication on the upper surface and a frame body 13 which is vertically erected against the upper surface to produce a cavity part 12 for housing the electronic components, the substrate 11 is made of clad material about which a first Cu plate 15 on one main surface on the side where the frame body 13 of a Fe-Ni-Co-based alloy metal plate is arranged is bonded with a second Cu plate 15a thinner than the first Cu plate 15 on the other main surface; and the frame body 13 consists of a joint body of a rectangular cylindrical metallic sidewall body 16 made of Fe-Ni-Co-based alloy or Fe-Ni-based alloy, and ceramic sidewall body 18 made of a ceramic feedthrough substrate provided in a notch 17 made by removing a part of the upper part of the sidewall body 16.
摘要翻译：要解决的问题：提供能够有效地散发来自电子部件的热量的便宜的电子部件壳体封装。解决方案：在包括用于安装在上表面上用于光通信的电子部件的矩形板状基板11和在上表面垂直竖立以制造空腔部分12的框体13的电子部件收纳包装10中为了容纳电子部件，基板11由包覆材料制成，在该包覆材料上，配置有Fe-Ni-Co系合金金属板的框体13的一侧的一个主面上的第一Cu板15与比另一个主表面上的第一Cu板15薄的第二Cu板15a; 框架体13由以Fe-Ni-Co系合金或Fe-Ni系合金构成的矩形圆筒状的金属侧壁体16的接合体，陶瓷侧壁体18，陶瓷侧壁体18 通过去除侧壁体16的上部的一部分制成的凹口17.版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2012052827A Warpage inspection apparatus for ceramic substrate 审中-公开
标题翻译：陶瓷基板的检验检验装置
公开(公告)号：JP2012052827A
公开(公告)日：2012-03-15
申请号：JP2010193383
申请日：2010-08-31
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： FUJITA SUMIO , YAMADA TOMOAKI
IPC分类号： G01B11/24
摘要： PROBLEM TO BE SOLVED: To provide a warpage inspection apparatus for ceramic substrates capable of accurately and efficiently measuring the amount of warpage in a mid-course of conveying and preventing an occurrence of defect.SOLUTION: This warpage inspection apparatus includes: conveying means for conveying ceramic substrates to prescribed positions; detecting means for inspecting a ceramic substrate 11 in being conveyed by a two-dimensional laser displacement meter 12 while letting it pass therethrough with the full width of the ceramic substrate 11 defined as a measuring object; and calculating means for calculating the amount of warpage acquired by processing the inspection value through a filter. The conveying means includes: a rotary actuator 13 adsorbing the ceramic substrates 11 with adsorption heads 17 and consecutively mounting them on the upper faces of a plurality of measuring tables 18 respectively; index tables 14, while horizontally and intermittently indexing and rotating the measuring tables 18, allowing the detecting means and the calculating means to measure the amount of warpage of the ceramic substrates 11 mounted on the measuring tables; and scraping bodies 15 located near the measuring tables 18 and discharging the ceramic substrates 11 after measuring the amount of warpage according to ranks of the amount of warpage from the measuring tables 18.
摘要翻译：要解决的问题：提供一种用于陶瓷基板的翘曲检查装置，其能够准确有效地测量输送中期的翘曲量并防止缺陷的发生。该翘曲检查装置包括：输送装置，用于将陶瓷基板输送到规定位置; 检测装置，用于检查由二维激光位移计12输送的陶瓷基板11，同时使其被定义为测量对象的陶瓷基板11的整个宽度通过; 以及计算装置，用于计算通过过滤器处理检查值所获得的翘曲量。传送装置包括：旋转致动器13，其吸附陶瓷基板11与吸附头17分别连续地安装在多个测量台18的上表面上; 索引表14，同时水平和间歇地分度和旋转测量台18，允许检测装置和计算装置测量安装在测量台上的陶瓷基板11的翘曲量; 以及位于测量台18附近的刮削体15，并根据测量台18的翘曲量的度量测量翘曲量后排出陶瓷基板11.（C）2012年，JPO＆INPIT

4. 发明专利

JP2011228319A Package for housing electronic component element 有权
标题翻译：外壳电子元件元件包装
公开(公告)号：JP2011228319A
公开(公告)日：2011-11-10
申请号：JP2010093636
申请日：2010-04-15
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： NISHIKAWA KATSUHIRO , KIMURA YUKIO , KUMURA NORIFUMI , KAWAGUCHI HIDEYO
IPC分类号： H01L23/04 , H01L23/02 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a package for housing an electronic component element which can improve packing density of an electronic component, has high reliability of air tightness and is inexpensive.SOLUTION: A package for housing an electronic component element 10 comprises: an assembly formed by laminating a ceramic substrate 11 having a shape of a rectangular plate with a first metalized film 14 on a lower surface and a second metalized film 16 on an upper surface and, on an upper periphery of the ceramic substrate 11, a ceramic frame body 12 having a shape of a rectangular frame with a third metalized film 18 on an upper surface; cutout portions 19 at the corners of the assembly; forth metalized films 21 and 21a formed on wall surfaces of the cutout portions 19 to electrically connect the first metalized film 14 and the second metalized film 16 or the first metalized film 14 and the third metalized film 18; and a ceramic insulation film 22 formed on the superior surfaces of the forth metalized films 21 and 21a with cladding extended upward from a connection portion with the first metalized film 14 to cross the forth metalized films 21 and 21a.
摘要翻译：要解决的问题：提供一种用于容纳能够提高电子部件的包装密度的电子元件的包装，具有高可靠性的气密性并且便宜。解决方案：用于容纳电子元件10的包装件包括：通过将具有矩形板形状的陶瓷基板11与下表面上的第一金属化膜14层叠在第一金属化膜16上而形成的组件在陶瓷基板11的上表面上形成具有矩形框架形状的陶瓷框体12，上表面具有第三金属化膜18; 在组件的角部处的切口部分19; 形成在切口部分19的壁表面上的第一金属化膜21和21a，以将第一金属化膜14和第二金属化膜16或第一金属化膜14和第三金属化膜18电连接; 以及形成在第四金属化膜21和21a的上表面上的陶瓷绝缘膜22，其中包层从与第一金属化膜14的连接部分向上延伸以与第四金属化膜21和21a交叉。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2011077063A Ceramic package for housing semiconductor element 审中-公开
标题翻译：用于住宅半导体元件的陶瓷包装
公开(公告)号：JP2011077063A
公开(公告)日：2011-04-14
申请号：JP2009223596
申请日：2009-09-29
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： NAKASU KOICHI
IPC分类号： H01L23/04 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a ceramic package for housing a semiconductor element that can prevent the occurrence of the sulfidization discoloration of Ag on a cut surface of a lead terminal where a tie bar is cut away.
SOLUTION: In the ceramic package 10 for semiconductor element storage having a lead terminal 12 whose one end is brazed to a metallized film 14 formed on a surface of a ceramic base 11 through a brazing material 13, and the other end protrudes from the ceramic base 11, the ceramic package has notches 17 on both side faces of a part which protrudes from the ceramic base 11 at the lead terminal 12, and a wax pool 18 which has a wax passage of a brazing material 13 spread to the other end side at the lead terminal 12, and in which the thickness of wax generated by the flow of the wax to the notches 17 is thicker than that of the surface of the lead terminal 12, and also thicker than those of both side faces of the lead terminal 12 other than the notches 17.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：提供一种用于容纳半导体元件的陶瓷封装，其能够防止在切断连接条的引线端子的切割表面上发生Ag的硫化变色。解决方案：在用于半导体元件存储的陶瓷封装10中，具有引线端子12，引线端子12的一端钎焊到通过钎焊材料13形成在陶瓷基体11的表面上的金属化膜14，另一端从陶瓷基体11，在引线端子12处从陶瓷基体11突出的部分的两个侧面上的陶瓷封装体具有切口17，并且具有扩散到另一个的钎焊材料13的蜡通道的蜡池18 末端侧在引线端子12处，并且其中由蜡流到凹口17产生的蜡的厚度比引线端子12的表面的厚度厚，并且还比第二端面的两个侧面的厚度厚导线端子12除了凹口17.版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2010240697A Powder press forming apparatus 审中-公开
标题翻译：粉末成型装置
公开(公告)号：JP2010240697A
公开(公告)日：2010-10-28
申请号：JP2009093002
申请日：2009-04-07
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： WAKAI TOSHIFUMI , SEKIYA MASAKAZU
IPC分类号： B30B11/00 , B30B11/02
CPC分类号： B30B15/304
摘要： PROBLEM TO BE SOLVED: To provide a powder press forming apparatus that can uniform a filling density and form an inexpensive ceramic substrate formed body.
SOLUTION: In the powder press forming apparatus 10 which includes: a mold composed of a die 14, a lower punch 15 and an upper punch 16; and a feeder 18 for filling ceramic granulating powder 12 in a space 17 formed by the upper face of the lower punch 15 and the wall face of a through hole 13, and forms a ceramic substrate formed body 11 by filling the ceramic granulating powder 12 in the space 17 and by press-forming with the lower punch 15 and the upper punch 16, the feeder 18 is composed of a box body with the bottom made an opening 19, and is provided with a levelling plate 23 which makes the ceramic granulating powder 12 supplied from the opening 19 into the space 17 flush with the upper face of the die 14, which is pressurized through a pressurizing body 22 from the inside of the tip end wall bottom face of the box body, which is erected projectingly from the tip end wall bottom face.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够使填充密度均匀并形成廉价的陶瓷基板成形体的粉末成形装置。解决方案：在粉末压制成形设备10中，其包括：由模具14，下冲头15和上冲头16组成的模具; 以及用于将陶瓷制粒粉末12填充在由下冲头15的上表面和通孔13的壁面形成的空间17中的进料器18，并且通过将陶瓷成粒体12填充在陶瓷基材成形体11中而形成陶瓷基板成形体11 空间17并通过下冲头15和上冲头16进行冲压成形，进料器18由具有开口19的底部的箱体构成，并且设置有调平板23，其使陶瓷制粒粉末 12从开口部19供给到与模具14的上表面齐平的空间17中，该模具14从箱体的前端壁底面的内侧通过加压体22加压，端壁底面。版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2010074563A Circuit board and high-frequency package for housing the same 审中-公开
标题翻译：电路板和高频套件，用于容纳它们
公开(公告)号：JP2010074563A
公开(公告)日：2010-04-02
申请号：JP2008240020
申请日：2008-09-18
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： KUBO NOBORU
IPC分类号： H01P1/02 , H01L23/12 , H01P5/08
摘要： PROBLEM TO BE SOLVED: To provide a circuit board which reduces reflection or a quantity of radiation of electromagnetic energy accompanied with a change in direction and improves transmission characteristic, and to provide a high-frequency package for housing the same.
SOLUTION: The rectangular circuit board is arranged together with a semiconductor device 15 in a high-frequency package 10 provided with a coaxial connector 12, wherein the coaxial connector 12 is arranged on the first side face 14a of adjoining two sides and the semiconductor device 15 is arranged on the second side face 14b thereof. In the circuit board, a signal line 16 connecting the coaxial connector 12 with the semiconductor device 15 is provided on its substrate, and the signal line 16 is loosely formed by at least 30 degrees from the axial direction Y of the coaxial connector 12 as a reference.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种电路板，其减少伴随方向改变的电磁辐射的反射或数量，并改善传输特性，并提供用于容纳该电极的高频封装。解决方案：矩形电路板与设置有同轴连接器12的高频封装10中的半导体器件15一起布置，其中同轴连接器12布置在邻接的两侧的第一侧面14a上，并且半导体器件15布置在其第二侧面14b上。在电路基板上，在其基板上设置有连接同轴连接器12和半导体装置15的信号线16，信号线16与同轴连接器12的轴向Y成一定距离至少30度。参考。版权所有（C）2010，JPO＆INPIT

8. 发明专利

JP2009295661A Ceramic wiring board and its manufacturing method 有权
标题翻译：陶瓷接线板及其制造方法
公开(公告)号：JP2009295661A
公开(公告)日：2009-12-17
申请号：JP2008145528
申请日：2008-06-03
申请人： Stanley Electric Co Ltd , Sumitomo Metal Electronics Devices Inc , スタンレー電気株式会社 , 株式会社住友金属エレクトロデバイス
发明人： TSUKIYAMA YOSHIO , TEZUKA MASASHI , TACHIBANA YOSHIORI
IPC分类号： H05K3/46 , H05K3/24
摘要： PROBLEM TO BE SOLVED: To provide a ceramic wiring board capable of demonstrating a relaxation effect of a sufficient residual stress in a junction part of a junction structure, even when a thickness of the junction structure constituted by loading a wiring board consisting of ceramic and a refractory metal on a loading object is thinned. SOLUTION: The ceramic wiring board includes: a board 2 made from the ceramic; a first wiring pattern 4 formed on a front surface of the board 2; and a second wiring pattern 9 for packaging the board 2 on the loading object, which is formed at a rear face 2b side of the board 2. The first wiring pattern 4 consists of W or Mo, and the second wiring pattern 9 consists of Cu, and a thickness of the ceramic wiring board is 20 μm or more. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够在接合结构的接合部中显示出足够的残余应力的松弛效果的陶瓷接线板，即使通过将由陶瓷和加载物体上的难熔金属变薄。陶瓷布线板包括：由陶瓷制成的板2; 形成在基板2的前表面上的第一布线图案4; 以及第二布线图案9，用于将基板2封装在形成在基板2的背面2b侧的装载对象上。第一布线图案4由W或Mo构成，第二布线图案9由Cu ，陶瓷布线板的厚度为20μm以上。版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP2009277814A Package for storing semiconductor device 审中-公开
标题翻译：存储半导体器件的封装
公开(公告)号：JP2009277814A
公开(公告)日：2009-11-26
申请号：JP2008126657
申请日：2008-05-14
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： NAGASE KENJI
IPC分类号： H01L23/04
CPC分类号： H01L2224/48091 , H01L2924/16195 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a package for storing a semiconductor device to prevent Ag wax from creeping up to a bonding pad part of the top face of an external connection terminal. SOLUTION: The package 10 for storing the semiconductor device has the Ag wax 14a for keeping the volume per unit area of the pattern of a metalized film 13 in a range of 0.0210-0.0285 mm 3 /mm 2 by holding it between the metalized film 13 provided on a ceramic substrate 12 and an external connection terminal 15 before it melts, and the bonding pad part 16 for connecting a bonding wire 19 to the top surface of the external connection terminal 15 to make the Ag wax 14a melt and bond to the metalized film 13. The external connection terminal 15 is bonded by the Ag wax 14a having a thickness of 0.045-0.085 mm before it melts. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于存储半导体器件的封装，以防止Ag蜡爬行到外部连接端子的顶面的焊盘部分。解决方案：用于存储半导体器件的封装10具有Ag蜡14a，用于将金属化膜13的图案的每单位面积的体积保持在0.0210-0.0285mm 3 / 通过将其保持在设置在陶瓷基板12上的金属化膜13和熔融之前的外部连接端子15之间，将接合线19连接到顶面的接合焊盘部16 外部连接端子15使Ag蜡14a熔融并结合到金属化膜13.外部连接端子15在其熔化之前由厚度为0.045-0.085mm的Ag蜡14a粘合。版权所有（C）2010，JPO＆INPIT

10. 发明专利

JP2009267227A Package for storing semiconductor element, and manufacturing method therefor 审中-公开
标题翻译：存储半导体元件的封装及其制造方法
公开(公告)号：JP2009267227A
公开(公告)日：2009-11-12
申请号：JP2008117118
申请日：2008-04-28
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： KAWAMURA TAKU
IPC分类号： H01L23/12
CPC分类号： H01L24/97 , H01L2224/48091 , H01L2224/48227 , H01L2924/14 , H01L2924/15311 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a package for storing semiconductor elements which is superior in the transmission characteristics of high-speed differential signals and is low-cost, and to provide a manufacturing method for the elements. SOLUTION: A package for storing semiconductor elements has a BGA-type, having differential pair signal lines 4 and 4. To external connection terminal pads 2a and 2a arranged in the vicinity of the outer peripheral edge 1b of a substantially rectangular shaped substrate 1, each of the differential pair signal lines 4 and 4 and plating leader lines 3 and 3 is connected. Each of the plating leader lines 3 and 3 is extended from the external connection terminal pads 2a and 2a, vertically with respect to the outer peripheral edge 1b of the substrate 1. A notched part 5, provided in the outer peripheral edge 1b of the substrate 1, is formed, in such a manner that the end part 3a of the plating leader line 3 reaches an end surface 5a. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于存储高速差分信号的传输特性优异且低成本的半导体元件的封装，并提供元件的制造方法。解决方案：用于存储半导体元件的封装具有BGA型，具有差分对信号线4和4.对于布置在大致矩形基板的外周边缘1b附近的外部连接端子焊盘2a和2a 如图1所示，差分对信号线4和4以及电镀引线3和3中的每一个被连接。每个电镀引出线3和3从外部连接端子焊盘2a和2a相对于基板1的外周边缘1b垂直延伸。设置在基板的外周边缘1b中的切口部分5 如图1所示，以电镀引导线3的端部3a到达端面5a的方式形成。版权所有（C）2010，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式