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1. 发明专利

JP2012243781A Semiconductor element housing package 审中-公开
标题翻译：半导体元件外壳包装
公开(公告)号：JP2012243781A
公开(公告)日：2012-12-10
申请号：JP2011108948
申请日：2011-05-16
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： ISHIZAKI MASATO , KAWAMURA TAKU , SHIRAISHI KATSUHISA , KUBO NOBORU
IPC分类号： H01L23/02 , H01L23/04
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive semiconductor element housing package which has low transmission loss, facilitates impedance adjustment, is not easily affected by an electromagnetic field, and is easy to manufacture.SOLUTION: In a semiconductor element housing package 10 which includes a base substrate 11 and a frame body 12 and is for housing a semiconductor element, the package 10 includes two L-shaped lead terminals 25 for signals and for the ground or three of them for signals and for the ground on both sides, and a dielectric substrate 26 provided with wiring conductors 19f and 19g for connecting them on one main surface and provided with a ground plane 21a connected through the wiring conductor 19g for the ground and a conductor via 20a for connection on the other, a unit 27 for connecting the lead terminals 25 to it is provided by connecting the ground plane 21a to the frame body 12 and/or a feed-through substrate 24, and one end of the lead terminals 25 of the unit 27 is connected to the feed-through substrate 24.
摘要翻译：要解决的问题：为了提供低传输损耗，便于阻抗调节的便宜的半导体元件外壳封装，不容易受到电磁场的影响，并且易于制造。解决方案：在包括基底基板11和框架体12并且用于容纳半导体元件的半导体元件外壳封装10中，封装10包括用于信号和地面或三个的两个L形引线端子25 它们用于信号和两侧的地面;以及电介质基板26，其设置有布线导体19f和19g，用于在一个主表面上连接布线导体19f和19g，并设置有通过布线布线导体19g连接到地面的接地平面21a和导体通孔20a用于连接，用于将引线端子25连接到其上的单元27通过将接地平面21a连接到框架体12和/或馈通基板24而提供，并且引线端子25的一端单元27连接到直通基板24.版权所有：（C）2013，JPO＆INPIT

2. 发明专利

JP2010088046A High-frequency transmission line substrate 有权
标题翻译：高频传输线基板
公开(公告)号：JP2010088046A
公开(公告)日：2010-04-15
申请号：JP2008257666
申请日：2008-10-02
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： KUBO NOBORU
IPC分类号： H01P5/08 , H01L23/12 , H01P5/02 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide a high-frequency transmission line substrate capable of preventing transmission characteristics from being deteriorated, by suppressing elevation of characteristic impedance of a transforming section in the case that a GND via exists near the transforming section between a grounded coplanar line and a microstrip line.
SOLUTION: The high-frequency transmission line substrate 1 includes: a base 2 constituted of dielectrics; a signal line conductor 3 formed on a front side 2a of the base 2; a pair of ground conductors 4, 4 formed to hold the signal line conductor 3 therebetween; a ground conductor 5 formed on a rear side 2b of the base 2; a GND via 11 conducting the ground conductors 4, 4 with the ground conductor 5; and a capacitance pattern 9 formed to widen a width of the signal line conductor 3, for a predetermined length, at a portion that is not held between the ground conductors 4, 4. The capacitance pattern 9 is provided in such an area that a distance L measured parallel from the GND via 11 closest to a transforming section 8 to the signal line conductor 3 becomes less than or equal to thickness of the base 2.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种能够防止传输特性劣化的高频传输线基板，通过在变压部分附近存在GND通孔的情况下抑制变压部分的特性阻抗的升高接地共面线和微带线。解决方案：高频传输线基板1包括：由电介质构成的基座2; 形成在基座2的前侧2a上的信号线导体3; 形成为将信号线导体3保持在其间的一对接地导体4,4; 形成在基座2的后侧2b上的接地导体5; 通过接地导体5将接地导体4,4导通的GND通孔11; 以及电容图案9，其形成为在未保持在接地导体4,4之间的部分处将信号线导体3的宽度扩大预定长度。电容图案9设置在距离从GND最靠近变压部8到信号线导体3的GND并联测量变得小于或等于基体2的厚度。（C）2010，JPO＆INPIT

3. 发明专利

JP2004336321A High frequency signal transmission line substrate 有权
公开(公告)号：JP2004336321A
公开(公告)日：2004-11-25
申请号：JP2003128680
申请日：2003-05-07
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： KUBO NOBORU
IPC分类号： H01P5/19 , H01P5/02
摘要： PROBLEM TO BE SOLVED: To provide a high frequency signal transmission line substrate which propagates high frequency signals, provided with a chip resistor mounting area for sufficient isolation, and has stable transmission characteristics.
SOLUTION: In the high frequency signal transmission line substrate 10 having a Wilkinson type circuit on which a transmission line 12 extended from an input terminal 14 formed on a dielectric substrate 11 is divided into two transmission lines at a branch point 15, and a chip resistor 18 is joined with the transmission line 12 extended from the branch point 15 to an output terminal 17, a connecting pad 19 having the length of wavelength/4 is attached to the transmission line 12; a first intermediate line 21 is connected between the connecting pad 19 and an output side line 20 to match characteristic impedance; and a second intermediate line 23 is connected between a branch line 16 formed between the connecting pad 19 and the branch line 15, and an input side line 22 to match characteristic impedance.
COPYRIGHT: (C)2005,JPO&NCIPI

4. 发明专利

JP2004055598A Package for high-frequency module 审中-公开
标题翻译：高频模块的包装
公开(公告)号：JP2004055598A
公开(公告)日：2004-02-19
申请号：JP2002207100
申请日：2002-07-16
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： KUBO NOBORU
IPC分类号： H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a package for a high-frequency module which is kept superior in transmission characteristics even when the high-frequency module is advanced to have a higher frequency.
SOLUTION: A GND pattern (1) around a connector of a chip connection RF signal wire (2) with an RF signal wire via (3) is eliminated so as to reduce a capacity obtained between the connector of the chip connection RF signal wire (2) with the RF signal wire via (3) and the GND pattern (1) located around it.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了提供即使在高频模块前进到具有较高频率的情况下也保持传输特性优异的高频模块的封装。解决方案：消除了具有RF信号线通孔（3）的芯片连接RF信号线（2）的连接器周围的GND图案（1），以便减小芯片连接RF的连接器信号线（2）与RF信号线通路（3）和GND图案（1）位于其周围。版权所有（C）2004，JPO

5. 发明专利

JP2009076828A Package for housing semiconductor element and semiconductor device 审中-公开
标题翻译：外壳半导体元件和半导体器件的封装
公开(公告)号：JP2009076828A
公开(公告)日：2009-04-09
申请号：JP2007246945
申请日：2007-09-25
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： KUBO NOBORU
IPC分类号： H01L23/02
CPC分类号： H01L2224/48091 , H01L2924/3011 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive package for housing a semiconductor element which can prevent the degradation of a transmission characteristic caused by the mismatching of characteristic impedance in a joint between a line conductor and a connector core wire, and to provide a semiconductor device.
SOLUTION: The package 10 for housing a semiconductor element is provided with: a metal substrate 11; a metal frame 12; a metal adapter 19 engaged with one side wall thereof; a coaxial connector 22 engaged with a through hole 21a formed thereat; and a dielectric substrate 27 that is provided with a wire conductor 28 to join one end of a connector core wire 25 and bonded to a seat 26 provided at the adapter 19. In such the package 10, a drilled part 30 is formed at the seat 26 of the lower adapter 19 corresponding to a region of one end of the connector core wire 25 that is joined to the line conductor 28 formed on one main surface of the dielectric substrate 27, and an opening 31 is formed at a ground conductor film 29a formed on the other main surface of the dielectric substrate 27 from which the dielectric substrate 27 having an area nearly equivalent to that of the drilled part 30 is exposed.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种廉价的用于容纳半导体元件的封装，其可以防止由线路导体和连接器芯线之间的接头中的特性阻抗的不匹配引起的传输特性的劣化，并且提供半导体器件。解决方案：用于容纳半导体元件的封装10设置有：金属基板11; 金属框架12; 与其一个侧壁接合的金属适配器19; 与形成在其上的通孔21a接合的同轴连接器22; 以及电介质基板27，其设置有导线28，以连接连接器芯线25的一端并且接合到设置在适配器19上的座26上。在这种封装10中，在座椅上形成有钻孔部分30 26对应于连接器芯线25的一端的区域，其连接到形成在电介质基板27的一个主表面上的线路导体28，并且开口31形成在接地导体膜29a 形成在电介质基板27的另一个主表面上，具有几乎与钻孔部30的面积大致相同的电介质基板27。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2007142122A Multiple piece wiring board and its electrolytic processing method therefor 审中-公开
标题翻译：多层接线板及其电解处理方法
公开(公告)号：JP2007142122A
公开(公告)日：2007-06-07
申请号：JP2005333451
申请日：2005-11-17
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： KUBO NOBORU
IPC分类号： H05K3/18 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a multiple piece wiring board which is capable of being subjected uniformly to electrolytic plating and electrolytic polishing, and to provide its electrolytic processing method.
SOLUTION: The multiple piece wiring board 1a is equipped with four nearly rectangular wiring board regions 2, which are arranged in two rows in both the horizontal and the vertical directions and is located at the center of a nearly rectangular plate-like insulator formed of sintered ceramic material; outer interconnections 3a and 3b and inner interconnections 4a and 4b which are provided around the wiring board regions 2 nearly in a rectangular shape; auxiliary interconnections 10 which electrically connect the outer interconnections 3a and 3b and inner interconnections 4a and 4b with the wiring substrate regions 2; a terminal connection 6a provided at the center 5a of the outer interconnection 3a; and terminal connections 6b and 6b, which are provided at two points that are located on the outer interconnection 3b and symmetric with respect to the center 5b. The ends of the inner interconnections 4a and 4b are electrically connected to the centers 5a and 5b of the outer interconnections 3a and 3b, and terminals 9a and 9b are connected to the terminal connections 6a and 6b via the intermediary of terminal interconnections 8.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供能够均匀地进行电解电镀和电解抛光的多片式布线板，并提供其电解处理方法。解决方案：多片布线板1a配备有四个近似矩形的布线板区域2，它们在水平和垂直方向上排成两行，并且位于近似矩形的板状绝缘体的中心由烧结陶瓷材料形成; 外部互连件3a和3b以及设置在布线板区域2周围几乎为矩形形状的内部互连件4a和4b; 辅助互连10，其将外部互连3a和3b以及内部互连4a和4b与布线基板区域2电连接; 设置在外部互连件3a的中心5a处的端子连接6a; 以及端子连接6b和6b，其设置在位于外部互连3b上的两个点处，并相对于中心5b对称。内互连4a和4b的端部电连接到外互连3a和3b的中心5a和5b，并且端子9a和9b经由端子互连8的中间端子连接到端子连接6a和6b。 >版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2005294479A Circuit board 审中-公开
标题翻译：电路板
公开(公告)号：JP2005294479A
公开(公告)日：2005-10-20
申请号：JP2004106514
申请日：2004-03-31
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： TSUKIYAMA YOSHIO , KUBO NOBORU
IPC分类号： H05K1/02 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a circuit board in which the phases of high-frequency signals can be equalized even when the physical lengths of the signal lines of the high-frequency signals differ and the yield of a manufacture can be improved while reducing the manufacturing cost of the circuit board and which can be miniaturized.
SOLUTION: In the circuit board 1, an element and a plurality of the signal lines 2a to 2h connected to the element are disposed on a dielectric-substrate surface layer 7 on a surface. In the circuit board 1, a part of at least one signal lines 2c to 2d in a plurality of the signal lines 2a to 2h is disposed in the dielectric-substrate surface layer 7.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：即使当高频信号的信号线的物理长度不同并且可以提高制造成品率时，提供一种其中高频信号的相位可相等的电路板同时降低电路板的制造成本并且可以小型化。解决方案：在电路板1中，连接到元件的元件和多个信号线2a至2h设置在表面上的电介质 - 基板表面层7上。在电路基板1中，多个信号线2a〜2h中的至少一条信号线2c〜2d的一部分配置在电介质基板表面层7中。（C）2006，JPO＆NCIPI

8. 发明专利

JP2010074563A Circuit board and high-frequency package for housing the same 审中-公开
标题翻译：电路板和高频套件，用于容纳它们
公开(公告)号：JP2010074563A
公开(公告)日：2010-04-02
申请号：JP2008240020
申请日：2008-09-18
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： KUBO NOBORU
IPC分类号： H01P1/02 , H01L23/12 , H01P5/08
摘要： PROBLEM TO BE SOLVED: To provide a circuit board which reduces reflection or a quantity of radiation of electromagnetic energy accompanied with a change in direction and improves transmission characteristic, and to provide a high-frequency package for housing the same.
SOLUTION: The rectangular circuit board is arranged together with a semiconductor device 15 in a high-frequency package 10 provided with a coaxial connector 12, wherein the coaxial connector 12 is arranged on the first side face 14a of adjoining two sides and the semiconductor device 15 is arranged on the second side face 14b thereof. In the circuit board, a signal line 16 connecting the coaxial connector 12 with the semiconductor device 15 is provided on its substrate, and the signal line 16 is loosely formed by at least 30 degrees from the axial direction Y of the coaxial connector 12 as a reference.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种电路板，其减少伴随方向改变的电磁辐射的反射或数量，并改善传输特性，并提供用于容纳该电极的高频封装。解决方案：矩形电路板与设置有同轴连接器12的高频封装10中的半导体器件15一起布置，其中同轴连接器12布置在邻接的两侧的第一侧面14a上，并且半导体器件15布置在其第二侧面14b上。在电路基板上，在其基板上设置有连接同轴连接器12和半导体装置15的信号线16，信号线16与同轴连接器12的轴向Y成一定距离至少30度。参考。版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP2008147757A High-frequency signal transmission substrate 审中-公开
标题翻译：高频信号传输基板
公开(公告)号：JP2008147757A
公开(公告)日：2008-06-26
申请号：JP2006329509
申请日：2006-12-06
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： KUBO NOBORU
IPC分类号： H01P3/08 , H01L23/12 , H01P1/04
CPC分类号： H01L2224/05554 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2924/30107 , H01L2924/3011 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a high-frequency signal transmission substrate that can prevent a ceramic substrate from cracking due to a via hole and prevent high-frequency characteristics from deteriorating to pass a high-frequency signal.
SOLUTION: The high-frequency signal transmission substrate 10 has: a coplanar line 17 with a ground comprising a signal conductor line 13, a first ground conductor film 14 and a lower-side second ground conductor film 16 connected thereto through the plurality of via holes 15; and a microstrip line 20 comprising a strip conductor line 19 and the second ground conductor film 16, wherein the plurality of via holes 15 are arrayed in a direction getting away from the signal line conductor line 13, and a cut portion 24 extended from the ridge portion 12 to the first ground conductor film 14 is provided while leaving a proximity portion 21 of the first ground conductor film 14, extending from a ridge portion 12, a via hole peripheral portion 22 including the via holes 15 and a connection portion 23 connecting the via peripheral portion 22 and the proximity portion 21 to each other.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种高频信号传输基板，其可以防止陶瓷基板由于通孔而破裂，并且防止高频特性劣化以通过高频信号。解决方案：高频信号传输基板10具有：共面线17，其具有通过多个连接到其的信号导体线13，第一接地导体膜14和下侧第二接地导体膜16的接地的通孔15; 以及包括带状导体线19和第二接地导体膜16的微带线20，其中多个通孔15沿远离信号线导体线13的方向排列，并且从脊部延伸的切口部分24 设置第一接地导体膜14的第一接地导体膜14的一部分，同时留下第一接地导体膜14的接近部分21，其从脊部12延伸，通孔周边部分22包括通孔15，连接部分23连接经由周边部分22和邻近部分21彼此。版权所有（C）2008，JPO＆INPIT

10. 发明专利

JP2005347924A High frequency signal transmission line substrate 审中-公开
标题翻译：高频信号传输线路基板
公开(公告)号：JP2005347924A
公开(公告)日：2005-12-15
申请号：JP2004163075
申请日：2004-06-01
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： KUBO NOBORU
IPC分类号： H05K3/46 , H01P5/12
摘要： PROBLEM TO BE SOLVED: To provide a high frequency signal transmission line substrate which can propagate a high frequency signal and match characteristic impedances before and after wiring branching and has a stable transmission characteristic.
SOLUTION: In this high frequency signal transmission line substrate 10, wherein a transmission line for transmitting a high frequency signal of a characteristic impedance Z
0 system having first and second wirings 12 and 17 respectively provided on the both principal planes of a laminated body of a plurality of dielectric substrates 11, 11a and 11b and a viahole 13 for a signal line for connecting the first and second wirings 12 and 17 is divided into two at a branching point 18 of one of the both principal planes, 1/2
1/2 × Z
0 wavelength/4 line is constructed at the viahole 13 for a signal line of the transmission line, and the connection part of an end face of the viahole 13 for signal line exposed on the one principal plane of the laminated body and the second wiring 17 is defined as the branching point 18.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种可以传播高频信号并匹配布线分支之前和之后的特征阻抗并具有稳定的传输特性的高频信号传输线基板。解决方案：在这种高频信号传输线基板10中，其中用于传输具有第一和第二布线12和17的特征阻抗Z 0 系统的高频信号的传输线分别设置在多个电介质基板11,11a和11b的层叠体的两个主平面和用于连接第一和第二布线12和17的信号线的通孔13在其中一个的分支点18处被分成两个在传输线的信号线的通孔13处构造两个主平面，1/2 1/2 ×Z 0 波长/ 4线，并且连接部用于在层叠体的一个主平面上暴露的信号线的通孔13的端面和第二布线17被定义为分支点18.（C）2006，JPO和NCIPI

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