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1. 发明专利

JP2011228319A Package for housing electronic component element 有权
标题翻译：外壳电子元件元件包装
公开(公告)号：JP2011228319A
公开(公告)日：2011-11-10
申请号：JP2010093636
申请日：2010-04-15
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： NISHIKAWA KATSUHIRO , KIMURA YUKIO , KUMURA NORIFUMI , KAWAGUCHI HIDEYO
IPC分类号： H01L23/04 , H01L23/02 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a package for housing an electronic component element which can improve packing density of an electronic component, has high reliability of air tightness and is inexpensive.SOLUTION: A package for housing an electronic component element 10 comprises: an assembly formed by laminating a ceramic substrate 11 having a shape of a rectangular plate with a first metalized film 14 on a lower surface and a second metalized film 16 on an upper surface and, on an upper periphery of the ceramic substrate 11, a ceramic frame body 12 having a shape of a rectangular frame with a third metalized film 18 on an upper surface; cutout portions 19 at the corners of the assembly; forth metalized films 21 and 21a formed on wall surfaces of the cutout portions 19 to electrically connect the first metalized film 14 and the second metalized film 16 or the first metalized film 14 and the third metalized film 18; and a ceramic insulation film 22 formed on the superior surfaces of the forth metalized films 21 and 21a with cladding extended upward from a connection portion with the first metalized film 14 to cross the forth metalized films 21 and 21a.
摘要翻译：要解决的问题：提供一种用于容纳能够提高电子部件的包装密度的电子元件的包装，具有高可靠性的气密性并且便宜。解决方案：用于容纳电子元件10的包装件包括：通过将具有矩形板形状的陶瓷基板11与下表面上的第一金属化膜14层叠在第一金属化膜16上而形成的组件在陶瓷基板11的上表面上形成具有矩形框架形状的陶瓷框体12，上表面具有第三金属化膜18; 在组件的角部处的切口部分19; 形成在切口部分19的壁表面上的第一金属化膜21和21a，以将第一金属化膜14和第二金属化膜16或第一金属化膜14和第三金属化膜18电连接; 以及形成在第四金属化膜21和21a的上表面上的陶瓷绝缘膜22，其中包层从与第一金属化膜14的连接部分向上延伸以与第四金属化膜21和21a交叉。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2009054742A Method of manufacturing ceramic substrate 审中-公开
标题翻译：制造陶瓷基板的方法
公开(公告)号：JP2009054742A
公开(公告)日：2009-03-12
申请号：JP2007219197
申请日：2007-08-27
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： KAWAGUCHI HIDEYO
IPC分类号： H05K3/00 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a ceramic substrate that can prevent the deterioration of the dividing capability of grooves for dividing and the deterioration of electric component mounting reliability, and that can improve the hermetical sealing reliability of the package and the cover.
SOLUTION: The present invention relates to the manufacturing method of the ceramic substrate, by which a ceramic substrate assembly can be divided using the grooves for dividing. The manufacturing method includes: a process to arrange a conductor printing pattern on one principal plane of a ceramic green sheet, a connection conductor printing pattern that connects the above (ceramic green sheet and conductor printing pattern) and continues on one side of an individual piece that counters the other side, and a conductor printing pattern for plating that extends from the above printing pattern to connect with a dummy portion; a process to arrange a first pushing groove in parallel with the connection conductor printing pattern on one principal plane, a second pushing groove that counters the first groove on the other principal plane, and a third pushing groove that intersects perpendicularly with the second groove and partitions into individual pieces; and a process to form the ceramic substrate of individual pieces by dividing the substrate assembly using the first, second and third grooves for dividing after the green sheet and refractory metal have been baked at the same time and an electrolytic plating film has been arranged in the conductor pattern.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造陶瓷基板的方法，该陶瓷基板能够防止分割槽分割能力的劣化和电气部件安装可靠性的劣化，并且可以提高封装的密封可靠性和封面。陶瓷基板的制造方法技术领域本发明涉及陶瓷基板的制造方法，通过该方法可以使用用于分割的凹槽来分割陶瓷基板组件。该制造方法包括：将导体印刷图案布置在陶瓷生片的一个主平面上的连接导体印刷图案，连接上述（陶瓷生片和导体印刷图案）并在单件的一面上延续的连接导体印刷图案以及从上述打印图案延伸的与虚拟部连接的用于电镀的导体印刷图案; 在一个主平面上布置与连接导体印刷图案平行的第一推动槽，在另一个主平面上对置第一槽的第二推动槽和与第二槽垂直相交的第三推动槽，分成单件以及通过在生片和难熔金属同时烘烤之后通过使用第一，第二和第三沟槽分割基板组件来形成单个件的陶瓷衬底的工艺，并且电镀电镀膜已经布置在导体图案。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2010135657A Ceramic package for housing electronic component, and method of manufacturing the same 有权
标题翻译：用于住宅电子元件的陶瓷包装及其制造方法
公开(公告)号：JP2010135657A
公开(公告)日：2010-06-17
申请号：JP2008311765
申请日：2008-12-08
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： NISHIKAWA KATSUHIRO , OBA AKIRA , KAWAGUCHI HIDEYO , ANO SEIJI
IPC分类号： H01L23/08 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive ceramic package for housing an electronic component easily mounted by stably erecting one side surface of a square ceramic base on a wiring substrate for mounting, and to provide a method of manufacturing the same.
SOLUTION: The ceramic package 10 for housing an electronic component houses the electronic component 12 by mounting on the ceramic base 11. The ceramic package includes: a cut surface 15, which is arranged on the square one side surface of the ceramic base 11 entirely in a thickness direction and orthogonally to a surface of the ceramic base 11; a dividing groove 16 formed on other three side surfaces except for the one side surface of the ceramic base 11 from the surface of the ceramic base 11 to the middle in the thickness direction; and a fracture surface 17 adjacent to the dividing groove 16.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种廉价的陶瓷封装，用于容纳通过稳定地将方形陶瓷基底的一个侧面稳定地安装在用于安装的布线基板上而容易安装的电子部件，并提供其制造方法。解决方案：用于容纳电子部件的陶瓷封装10通过安装在陶瓷基座11上而容纳电子部件12.陶瓷封装包括：切割面15，其布置在陶瓷基体的正方形侧表面上 11完全在厚度方向上并且与陶瓷基体11的表面正交; 形成在从陶瓷基体11的表面到厚度方向的中间除陶瓷基体11的一个侧面以外的其他三个侧面上的分割槽16; 以及与分隔槽16相邻的断裂表面17.版权所有（C）2010，JPO＆INPIT

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