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1. 发明专利

JP2012243781A Semiconductor element housing package 审中-公开
标题翻译：半导体元件外壳包装
公开(公告)号：JP2012243781A
公开(公告)日：2012-12-10
申请号：JP2011108948
申请日：2011-05-16
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： ISHIZAKI MASATO , KAWAMURA TAKU , SHIRAISHI KATSUHISA , KUBO NOBORU
IPC分类号： H01L23/02 , H01L23/04
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive semiconductor element housing package which has low transmission loss, facilitates impedance adjustment, is not easily affected by an electromagnetic field, and is easy to manufacture.SOLUTION: In a semiconductor element housing package 10 which includes a base substrate 11 and a frame body 12 and is for housing a semiconductor element, the package 10 includes two L-shaped lead terminals 25 for signals and for the ground or three of them for signals and for the ground on both sides, and a dielectric substrate 26 provided with wiring conductors 19f and 19g for connecting them on one main surface and provided with a ground plane 21a connected through the wiring conductor 19g for the ground and a conductor via 20a for connection on the other, a unit 27 for connecting the lead terminals 25 to it is provided by connecting the ground plane 21a to the frame body 12 and/or a feed-through substrate 24, and one end of the lead terminals 25 of the unit 27 is connected to the feed-through substrate 24.
摘要翻译：要解决的问题：为了提供低传输损耗，便于阻抗调节的便宜的半导体元件外壳封装，不容易受到电磁场的影响，并且易于制造。解决方案：在包括基底基板11和框架体12并且用于容纳半导体元件的半导体元件外壳封装10中，封装10包括用于信号和地面或三个的两个L形引线端子25 它们用于信号和两侧的地面;以及电介质基板26，其设置有布线导体19f和19g，用于在一个主表面上连接布线导体19f和19g，并设置有通过布线布线导体19g连接到地面的接地平面21a和导体通孔20a用于连接，用于将引线端子25连接到其上的单元27通过将接地平面21a连接到框架体12和/或馈通基板24而提供，并且引线端子25的一端单元27连接到直通基板24.版权所有：（C）2013，JPO＆INPIT

2. 发明专利

JP2012221971A Heat sink and package for housing high heat dissipation type semiconductor element using the same 审中-公开
标题翻译：用于外壳高热消散型半导体元件的散热和封装
公开(公告)号：JP2012221971A
公开(公告)日：2012-11-12
申请号：JP2011082523
申请日：2011-04-04
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： KOSAKATA AKIYOSHI
IPC分类号： H01L23/373 , H01L23/08 , H01L23/14
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive heat sink with excellent heat dissipation, and a package for housing a high heat dissipation type semiconductor element using the heat sink.SOLUTION: A heat sink 10 has a first metal plate 11 made of a Cr-Cu composite member, and second planar metal plates 12, 12a jointed to both principal surfaces of the first metal plate and made of a Cu plate. Also, in a package 20 for housing a high heat dissipation type semiconductor element, a ceramic frame body 22 with a window frame shape is soldered and jointed on an upper face of the heat sink 10, and heat generated from a semiconductor element 21 directly held on and housed in the upper face of the heat sink 10 of a cavity part 23 formed by the upper face of the heat sink 10 and an inner peripheral wall of the ceramic frame body 22 is dissipated via the heat sink 10. The heat sink 10 is provided so that the second planar metal plates 12, 12a made of the Cu plate are jointed to both principal faces of the first planar metal plate 11 made of the Cr-Cu composite member.
摘要翻译：要解决的问题：提供具有优异散热性的便宜的散热器和用于容纳使用散热器的高散热型半导体元件的封装。解决方案：散热器10具有由Cr-Cu复合构件制成的第一金属板11和与第一金属板的两个主表面连接并由Cu板制成的第二平面金属板12,12a。此外，在用于容纳高散热型半导体元件的封装20中，将具有窗框形状的陶瓷框体22焊接并接合在散热器10的上表面上，并且从直接保持的半导体元件21产生的热量在由散热片10的上表面形成的空腔部23的散热片10的上表面和陶瓷框体22的内周壁上经由散热器10散发。散热片10 使得由Cu板制成的第二平面金属板12,12a连接到由Cr-Cu复合构件制成的第一平面金属板11的两个主面。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP4977049B2 Snap line processing equipment 有权
公开(公告)号：JP4977049B2
公开(公告)日：2012-07-18
申请号：JP2008016638
申请日：2008-01-28
申请人：株式会社住友金属エレクトロデバイス
发明人：英雄岡藤 , 文雄福光 , 祐貴鶴田
IPC分类号： B28B11/14 , B26D3/08 , B26D5/34 , H05K3/00

4. 发明专利

JP2012091301A Cutting method of ceramic green sheet 审中-公开
标题翻译：陶瓷绿板切割方法
公开(公告)号：JP2012091301A
公开(公告)日：2012-05-17
申请号：JP2010242626
申请日：2010-10-28
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： YAMADA HIROSHI , YAMADA MASATO
IPC分类号： B26D7/20 , B26D1/06
摘要： PROBLEM TO BE SOLVED: To provide a cutting method of a ceramic green sheet capable of preventing the sticking of a foreign matter in cutting, and capable of preventing a cost increase in product.SOLUTION: A receiving part 16 of a bar body 14 formed of hard plastic is flushed with an upper surface of a cutting base 11 in a groove 13 formed in a grating-shaped predetermined position of the metallic cutting base 11, and in a state of placing a ceramic green sheet 12 on a placing surface of the heated cutting base 11, the tip of a cutting blade 15 for the vertical direction for juxtaposing the respective cutting blades 15 and 15a adjusted to lengths of the respective receiving parts 16 in the vertical direction and the lateral direction is lowered to abut on the receiving part 16 in the vertical direction above the cutting base 11, and the ceramic green sheet 12 is cut in a predetermined dimension by lowering the tip of the cutting blade 15a for the horizontal direction to abut on the receiving part 16 in the horizontal direction.
摘要翻译：要解决的问题：提供一种能够防止异物在切割中粘附并且能够防止产品成本增加的陶瓷生片的切割方法。解决方案：由硬质塑料形成的棒体14的容纳部分16在切割基座11的上表面上冲刷在形成在金属切割基座11的光栅形状的预定位置的槽13中，并且将陶瓷生片12放置在加热的切割基座11的放置面上的状态，切割刀片15的上下方向的前端，使与各接收部16的长度对应的各切削刃15,15a并置垂直方向和横向方向下降以在切割基部11上方的垂直方向上抵靠在容纳部16上，并且通过使切割刀片15a的前端向下水平地切割而将陶瓷生片12预定尺寸切割方向在水平方向上抵靠接收部分16。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2012000875A Screen printing apparatus 审中-公开
标题翻译：丝印印刷机
公开(公告)号：JP2012000875A
公开(公告)日：2012-01-05
申请号：JP2010138066
申请日：2010-06-17
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： SASAKI AKINORI
IPC分类号： B41F15/40 , B41F15/08 , H05K3/12
摘要： PROBLEM TO BE SOLVED: To provide a screen printing apparatus which can measure a paste amount of resin-containing solvent paste of which viscosity is low and fluidity is high, and can respond to an optimized paste amount on a screen mask.SOLUTION: The screen printing apparatus 10 extracts the resin-containing solvent paste 15 supplied to a paste accumulating part 14 on a printed material 11 mounted below the screen mask 13 to print. The screen printing apparatus 10 includes a paste refilling unit 18 for refilling a quantitative value of the resin-containing solvent paste 15 in the paste accumulating part 14, a sensor 19 for measuring an amount of the resin-containing solvent paste 15 on the paste accumulating part 14, and a print continuing means 20 which alarms and stops the paste refilling unit 18 and a printer when it is determined that a measured value measured by the sensor 19 exceeds a previously set normal print limit value in comparison with the limit value, and continues printing after an operator checks and deals with the amount of the resin-containing solvent paste 15.
摘要翻译：要解决的问题：提供一种丝网印刷装置，其可以测量粘度低，流动性高的含树脂溶剂浆料的糊量，并且可以对筛网掩模上的优化糊剂量做出响应。解决方案：丝网印刷设备10将提供给糊剂积聚部分14的含树脂溶剂浆料15提取在安装在筛网掩模13下方的印刷材料11上进行印刷。丝网印刷装置10包括用于重新填充糊剂积存部14中的含树脂的溶剂浆料15的定量值的浆料补充单元18，用于测量糊料积聚的含树脂的溶剂浆料15的量的传感器19 并且当确定由传感器19测量的测量值与限制值相比超过预先设定的正常打印限制值时，报警和停止粘贴补充单元18和打印机的打印继续装置20，以及运营商检查并处理含树脂溶剂浆料15的量后继续印刷。版权所有（C）2012，JPO＆INPIT

6. 发明专利

JP4796518B2 Ceramic lid 有权
公开(公告)号：JP4796518B2
公开(公告)日：2011-10-19
申请号：JP2007026227
申请日：2007-02-06
申请人：株式会社住友金属エレクトロデバイス
发明人：恭男和田 , 佳彦宮田 , 英二高橋
IPC分类号： H01L23/02 , H01L27/14

7. 发明专利

JP4769092B2 Tilt sensor 有权
公开(公告)号：JP4769092B2
公开(公告)日：2011-09-07
申请号：JP2006029499
申请日：2006-02-07
申请人：株式会社住友金属エレクトロデバイス
发明人：勝裕西川
IPC分类号： H01H35/02 , G01C9/06 , G01C9/10

8. 发明专利

JP4763393B2 Method of manufacturing a light emitting element package for housing 有权
公开(公告)号：JP4763393B2
公开(公告)日：2011-08-31
申请号：JP2005264515
申请日：2005-09-13
申请人：株式会社住友金属エレクトロデバイス
发明人：恵二成重
IPC分类号： H01L33/60 , H01L33/48 , H01L33/64
CPC分类号： H01L2224/48091 , H01L2224/48227 , H01L2924/15174 , H01L2924/00014

9. 发明专利

JP4746376B2 Ceramic multi-layer substrate and a method of manufacturing the same 有权
公开(公告)号：JP4746376B2
公开(公告)日：2011-08-10
申请号：JP2005229103
申请日：2005-08-08
申请人：株式会社住友金属エレクトロデバイス
发明人：勝裕西川
IPC分类号： H05K3/46

10. 发明专利

JP2011121807A Method for producing alumina sintered compact 审中-公开
标题翻译：生产氧化铝烧结方法
公开(公告)号：JP2011121807A
公开(公告)日：2011-06-23
申请号：JP2009279963
申请日：2009-12-10
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： YAMAMOTO JUNYA , TOMINAGA KIYOTAKA , EBIHARA AKIHIKO
IPC分类号： C04B35/64 , C04B35/111 , H01S5/022
摘要： PROBLEM TO BE SOLVED: To provide a method for producing an alumina sintered compact having a small dielectric loss if the alkali metal oxide in an alumina raw material is ≤0.1 wt.%. SOLUTION: The method for producing the alumina sintered compact comprises the steps of: mixing alumina raw material powder containing ≥99.4 wt.% Al 2 O 3 and ≤0.1 wt.% alkali metal oxide, a sintering aid, a binder, a plasticizer and a solvent to form slurry; compacting the slurry to form an alumina compact; and placing the alumina compact on a setter of an alumina-made refractory containing 85.0-97.5 wt.% Al 2 O 3 and 2.5-15.0 wt.% SiO 2 and firing the placed alumina compact. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：待解决的问题：提供如果氧化铝原料中的碱金属氧化物≤0.1重量％，则介电损耗小的氧化铝烧结体的制造方法。解决方案：制造氧化铝烧结体的方法包括以下步骤：将含有≥99.4重量％的Al 2 O 3 的氧化铝原料粉末与≤0.1 重量％的碱金属氧化物，烧结助剂，粘合剂，增塑剂和溶剂以形成浆料; 压制浆料以形成氧化铝压块; 并将氧化铝压块放置在含有85.0-97.5重量％Al 2 SB 3 O 3 / SB 3和2.5-15.0重量％SiO 2的氧化铝制耐火材料的固化器中， 2 并烧制放置的氧化铝压块。版权所有（C）2011，JPO＆INPIT

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