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1. 发明专利

JP2005136024A High-frequency package and its manufacturing method 审中-公开
标题翻译：高频包及其制造方法
公开(公告)号：JP2005136024A
公开(公告)日：2005-05-26
申请号：JP2003368371
申请日：2003-10-29
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： NAKASU KOICHI
IPC分类号： H01L23/02
CPC分类号： H01L2224/48091 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive high-frequency package, exhibiting superior heat dissipation characteristics or electrical characteristics, and to provide its manufacturing method. SOLUTION: In the high-frequency package 10, comprising a body 14 touching one major surface of a substantially rectangular heat sink plate 11 having a metal plating coat 15 on the surface to a base mount, having cuts 16 for screwing it to the base mount at the opposite end parts of the heat sink plate 11 in the longitudinal direction, bonding one major surface of a ring-like ceramic frame 12 to the longitudinal central part of the other major surface of the heat sink plate 11 and bonding an external connection terminal 13, made of a metal plate to the other major surface of the ceramic frame 12, the metal plating coat 15 on one major surface of the heat sink plate 11 has the same thickness at the opposite end parts in the longitudinal direction and at the longitudinal central part, or the metal plating coat 15 has a thickness, projecting in a curved surface shape from the opposite end parts in the longitudinal direction across the longitudinal central part. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供廉价的高频封装，具有优异的散热特性或电特性，并提供其制造方法。解决方案：在高频包装10中，包括接触基本上矩形的散热板11的主表面的本体14，其具有在基座上的表面上的金属镀覆层15，其具有用于将其拧到底座安装在散热板11的纵向方向的相对端部，将环状陶瓷框架12的一个主表面连接到散热板11的另一个主表面的纵向中心部分，并将由金属板制成的外部连接端子13连接到陶瓷框架12的另一个主表面，散热板11的一个主表面上的金属镀覆层15在纵向的相对端部具有相同的厚度，或者金属电镀涂层15具有从纵向方向的相对端部跨越纵向中心部以曲面形状突出的厚度。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2004363520A Package for high frequency and its manufacturing method 有权
公开(公告)号：JP2004363520A
公开(公告)日：2004-12-24
申请号：JP2003163429
申请日：2003-06-09
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： KOSAKATA AKIYOSHI , NAKASU KOICHI , MURAKI ICHIRO
IPC分类号： H01L23/36 , H01L23/02 , H01L23/08
CPC分类号： H01L2224/49175 , H01L2924/01019 , H01L2924/01078 , H01L2924/01322
摘要： PROBLEM TO BE SOLVED: To provide a package for a high frequency and its manufacturing method in which a radiation characteristic or an electric characteristic is excellent at a low cost.
SOLUTION: The package for the high frequency 10 comprises a notch 17 for screwing to a base 20 which is provided at both ends in the longitudinal direction of the heat sink plate 11 of a substantially rectangular shape, and a joined body 15 for joining an external connection terminal 14 from one surface of an annular frame body 12 composed of ceramics at a center in the longitudinal direction of one surface of the heat sink 11 to the other surface thereof. The other surface of the heat sink plate 11 is composed of a convex surface 18 having a curved surface which projects from both ends in the longitudinal direction thereof to a center line part to form a maximum projected part at the center line part. Moreover, the package 10 comprises the projected shape having the convex surface 18 in which, when the notch 17 is screwed to the base 20, the other surface of the heat sink plate 11 corresponding to the mounting area of a semiconductor element 19 mounted to at least the annular frame body 12 is closed adhered to the base 20.
COPYRIGHT: (C)2005,JPO&NCIPI

3. 发明专利

JP2009277794A Package for semiconductor element storage 审中-公开
标题翻译：半导体元件存储包装
公开(公告)号：JP2009277794A
公开(公告)日：2009-11-26
申请号：JP2008126218
申请日：2008-05-13
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： NAKASU KOICHI
IPC分类号： H01L23/02
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive package for semiconductor element storage which is improved in reliability of bonding of a semiconductor element and in bonding strength between a heat sink plate and a ceramic substrate.
SOLUTION: The package 10 for semiconductor element storage is provided with a cavity portion 18 for mounting and storing a semiconductor element in a hollow state by the inner peripheral wall surface 17 of the ceramic substrate 12 in a window frame shape and the surface of the heat sink plate 11 while soldering the heat sink plate 11 and the ceramic substrate 12 together with a solder material 16, the surface roughness of a surface of a bonded portion 20 of the heat sink plate 11 where the ceramic substrate 12 is boned being larger than that of the bottom surface of the cavity portion 18 to which the ceramic substrate 12 is not bonded.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供廉价的用于半导体元件存储的封装，其提高了半导体元件的接合的可靠性以及散热板和陶瓷基板之间的接合强度。解决方案：用于半导体元件存储的封装10设置有用于通过陶瓷基板12的内周壁表面17以窗框形状安装和存储中空状态的半导体元件的空腔部分18，在将散热板11和陶瓷基板12与焊料材料16一起焊接的同时，散热板11的被接合的散热板11的接合部20的表面的表面粗糙度为大于未与陶瓷基板12接合的空腔部分18的底表面的尺寸。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2011077063A Ceramic package for housing semiconductor element 审中-公开
标题翻译：用于住宅半导体元件的陶瓷包装
公开(公告)号：JP2011077063A
公开(公告)日：2011-04-14
申请号：JP2009223596
申请日：2009-09-29
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： NAKASU KOICHI
IPC分类号： H01L23/04 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a ceramic package for housing a semiconductor element that can prevent the occurrence of the sulfidization discoloration of Ag on a cut surface of a lead terminal where a tie bar is cut away.
SOLUTION: In the ceramic package 10 for semiconductor element storage having a lead terminal 12 whose one end is brazed to a metallized film 14 formed on a surface of a ceramic base 11 through a brazing material 13, and the other end protrudes from the ceramic base 11, the ceramic package has notches 17 on both side faces of a part which protrudes from the ceramic base 11 at the lead terminal 12, and a wax pool 18 which has a wax passage of a brazing material 13 spread to the other end side at the lead terminal 12, and in which the thickness of wax generated by the flow of the wax to the notches 17 is thicker than that of the surface of the lead terminal 12, and also thicker than those of both side faces of the lead terminal 12 other than the notches 17.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：提供一种用于容纳半导体元件的陶瓷封装，其能够防止在切断连接条的引线端子的切割表面上发生Ag的硫化变色。解决方案：在用于半导体元件存储的陶瓷封装10中，具有引线端子12，引线端子12的一端钎焊到通过钎焊材料13形成在陶瓷基体11的表面上的金属化膜14，另一端从陶瓷基体11，在引线端子12处从陶瓷基体11突出的部分的两个侧面上的陶瓷封装体具有切口17，并且具有扩散到另一个的钎焊材料13的蜡通道的蜡池18 末端侧在引线端子12处，并且其中由蜡流到凹口17产生的蜡的厚度比引线端子12的表面的厚度厚，并且还比第二端面的两个侧面的厚度厚导线端子12除了凹口17.版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2006303092A Package for mounting light emitting element 审中-公开
标题翻译：安装发光元件的包装
公开(公告)号：JP2006303092A
公开(公告)日：2006-11-02
申请号：JP2005121068
申请日：2005-04-19
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： HONDA TAKAHIKO , NAKASU KOICHI
IPC分类号： H01L33/60
CPC分类号： H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/15174 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To obtain a package for mounting a light emitting element in which discoloring on the surface of a silver plating layer becoming a light reflecting surface can be prevented over a long term.
SOLUTION: Firing of an underlying metallization layer 18 composed of a high melting point metal such as tungsten or molybdenum is carried out simultaneously with a package body 11 on the circumferential side face of a cavity 13 in the package body 11 composed of high temperature firing ceramic such as alumina or aluminum nitride. Subsequently, an underlying nickel plating layer 19 is formed on the underlying metallization layer 18, a silver plating layer 20 is further formed on the underlying nickel plating layer 19 to serve as a light reflecting surface 22. A transparent and thin silver antitarnish film 21 is formed by processing the surface of the silver plating layer 20 with a silver antitarnish agent to cover the entire surface of the silver plating layer 20 becoming the light reflecting surface 22.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了获得用于安装发光元件的封装，可以长期地防止在镀银层的表面上变色成为光反射表面的发光元件。解决方案：由高温熔融金属如钨或钼构成的下面的金属化层18的烧制与封装体11同时与封装主体11在包含主体11的外壳13的周向侧面上的高温温度焙烧陶瓷如氧化铝或氮化铝。随后，在下面的金属化层18上形成下面的镀镍层19，在下面的镀镍层19上进一步形成镀银层20，以作为光反射表面22.透明和薄的银防抛光膜21是通过用银防火剂将银镀层20的表面加工成覆盖形成光反射表面22的镀银层20的整个表面而形成。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2006303069A Package for mounting light emitting element 审中-公开
标题翻译：安装发光元件的包装
公开(公告)号：JP2006303069A
公开(公告)日：2006-11-02
申请号：JP2005120705
申请日：2005-04-19
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： HONDA TAKAHIKO , NAKASU KOICHI
IPC分类号： H01L33/60 , H01L33/62
CPC分类号： H01L24/97 , H01L2224/48091 , H01L2224/48227 , H01L2924/15174 , H01L2924/15787 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To obtain a package for mounting a light emitting element in which discoloring on the surface of a silver plating layer becoming a light reflecting surface can be prevented over a long term.
SOLUTION: Firing of an underlying metallization layer 18 composed of a high melting point metal such as tungsten or molybdenum is carried out simultaneously with a package body 11 on the circumferential side face of a cavity 13 in the package body 11 composed of high temperature firing ceramic such as alumina or aluminum nitride. Subsequently, an underlying nickel plating layer 19 is formed on the underlying metallization layer 18, a silver plating layer 20 is further formed on the underlying nickel plating layer 19 to serve as a light reflecting surface 22. A noble metal plating layer 21 as thin as about 0.05 μm is formed on the silver plating layer 20 to cover the entire surface of the silver plating layer 20 becoming the light reflecting surface 22. The noble metal plating layer 21 is a substantially transparent coating so long as the noble metal plating layer 21 is thin.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了获得用于安装发光元件的封装，可以长期地防止在镀银层的表面上变色成为光反射表面的发光元件。解决方案：由高温熔融金属如钨或钼构成的下面的金属化层18的烧制与封装体11同时与封装主体11在包含主体11的外壳13的外周侧面上的高温温度焙烧陶瓷如氧化铝或氮化铝。接下来，在下面的金属化层18上形成下面的镀镍层19，在下面的镀镍层19上进一步形成镀银层20，作为光反射面22。在银镀层20上形成约0.05μm，以覆盖成为光反射表面22的银镀层20的整个表面。贵金属镀层21是基本上透明的涂层，只要贵金属镀层21为瘦。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2005252121A Package for storing semiconductor element and method for manufacturing the same 审中-公开
标题翻译：存储半导体元件的封装及其制造方法
公开(公告)号：JP2005252121A
公开(公告)日：2005-09-15
申请号：JP2004063418
申请日：2004-03-08
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： NAKASU KOICHI
IPC分类号： H01L23/04
CPC分类号： H01L2224/48091 , H01L2224/49175 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive semiconductor element storing package in which the thickness of an Au plated film can be thinned, and both of solder wettability and joint intensity on a soldered joint can be obtained; and to provide a method for manufacturing the semiconductor element storing package.
SOLUTION: The semiconductor element storing package has wire bonding pads 18, 18a for electrically connecting at least a semiconductor element 11, and constituted so that the surfaces of the wire bonding pads 18, 18a are coated with a 1st Ni plated film 20, a 2nd Ni plated film 25, and an Au plated film 23 or coated with the 2nd Ni plated film 25 and the Au plated film 23. An Ni sintering plated film 22 is formed by heating the 1st Ni plated film 20 and the 2nd Ni plated film 25 of the wire bonding pads 18, 18a in a reduction atmosphere or heating the 2nd Ni plated film 25 in the reduction atmosphere, and the Au plated film 23 is formed on the Ni sintering plated film 22.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供廉价的半导体元件存储封装，其中可以使Au镀膜的厚度变薄，并且可以获得焊接接头上的焊料润湿性和接合强度两者; 并且提供一种用于制造半导体元件存储包装的方法。解决方案：半导体元件存储封装具有用于电连接至少半导体元件11的引线键合焊盘18,18a，并且构成为使引线键合焊盘18,18a的表面涂覆有第一Ni镀膜20 ，第二Ni镀膜25和Au镀膜23或涂覆有第二Ni镀膜25和Au镀膜23.通过加热第一Ni镀膜20和第二Ni镀膜20形成Ni烧结镀膜22 还原气氛中的引线接合焊盘18,18a的镀膜25，还原还原气氛中加热第二Ni镀膜25，在Ni烧结镀膜22上形成Au镀膜23。 C）2005，JPO＆NCIPI

8. 发明专利

JP2008159975A Package for housing semiconductor element, and method of manufacturing the same 审中-公开
标题翻译：外壳半导体元件的封装及其制造方法
公开(公告)号：JP2008159975A
公开(公告)日：2008-07-10
申请号：JP2006348992
申请日：2006-12-26
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： NAKASU KOICHI
IPC分类号： H01L23/36 , H01L23/34
CPC分类号： H01L2224/48091 , H01L2224/49111 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a package for housing a semiconductor element and a method of manufacturing the same, having superior heat radiation performance and electrical characteristics and proper dimensional accuracy, at a low cost. SOLUTION: A package 10 for housing a semiconductor element consists of: an approximate rectangular shaped heat sink 11 made of a metallic plate having a high heat radiation performance; a window flame shaped insulating frame body 12 made of ceramics in the center part in a longitudinal direction of one main surface of the heat sink 11; and a junction structure 15 to which an external connection terminal 14 made of a metallic plate on an upper side of the insulating frame body 12 are jointed. In the package 10, a grinding surface 18 is provided over the whole surface of the other main surface of the heat sink 11 of the junction structure 15. The position of the grinding surface 18 intersects notch surfaces 19 and 19a, consisting of a C side and an R side preliminarily provided at both ridges of at least short-length direction of the other main surface of the heat sink 11. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供用于容纳半导体元件的封装及其制造方法，以低成本具有优异的散热性能和电特性以及适当的尺寸精度。解决方案：用于容纳半导体元件的封装10包括：由具有高散热性能的金属板制成的近似矩形散热器11; 在散热器11的一个主表面的纵向方向上的中心部分由陶瓷制成的窗口火焰形绝缘框体12; 连接结构15，在绝缘框体12的上侧由金属板构成的外部连接端子14连接。在封装10中，在接合结构15的散热器11的另一个主表面的整个表面上设置研磨表面18.研磨表面18的位置与切口表面19和19a相交，由C侧和R侧预先设置在散热片11的另一个主表面的至少短长方向的两个脊上。（C）2008，JPO＆INPIT

9. 发明专利

JP2006295011A Package for mounting light-emitting element 审中-公开
标题翻译：安装发光元件的包装
公开(公告)号：JP2006295011A
公开(公告)日：2006-10-26
申请号：JP2005116369
申请日：2005-04-14
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： HONDA TAKAHIKO , NAKASU KOICHI
IPC分类号： H01L33/60
CPC分类号： H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/15174 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To manufacture a package for mounting a light-emitting element, which package improves the gloss of a light reflection surface, by a simple method.
SOLUTION: A package body 11 is formed of a high-temperature baked ceramics, such as alumina and aluminum nitride, and has a cavity 13. A substrate metalized layer 18 made of such a metal showing a high melting point as tungsten and molybdenum is baked on the peripheral side face of the cavity 13 simultaneously with the package body 11. Subsequently, a gloss nickel plating layer 19 is formed on the substrate metalized layer 18, and a gloss silver plating layer 20 is further formed on the gloss nickel plating layer 19, where the surface of the silver plating layer 20 serves as a light reflection surface 21. In forming the gloss nickel plating layer 19 and the silver plating layer 20, a conventional plating method is employed except a process of adding a brightener to a nickel plating solution and to a silver plating solution.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：通过简单的方法制造用于安装发光元件的封装，该封装提高了光反射表面的光泽。解决方案：包装体11由诸如氧化铝和氮化铝的高温焙烧陶瓷形成，并且具有空腔13.由这样的金属制成的基板金属化层18，其表现出高熔点如钨和在封装主体11的同时，在空腔13的外周侧面上焙烧钼。然后，在基板金属化层18上形成光泽镀镍层19，并且在光泽镍上进一步形成光泽银镀层20 镀银层20的表面用作光反射表面21.在形成光泽镀镍层19和镀银层20时，采用常规的镀覆方法，除了将增白剂加入到镀镍溶液和镀银溶液。版权所有（C）2007，JPO＆INPIT

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