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1. 发明公开

EP3140099A4 METHODS TO FORM AND TO DISMANTLE HERMETICALLY SEALED CHAMBERS 审中-公开
公开(公告)号：EP3140099A4
公开(公告)日：2017-11-15
申请号：EP15789584
申请日：2015-04-07
申请人： PICOSYS INCORPORATED
发明人： KARAM RAYMOND MILLER , WYNNE THOMAS , CHOBOT ANTHONY THOMAS
IPC分类号： B32B43/00 , B01L3/00 , B23K26/21 , B32B37/00 , B32B37/06 , B32B38/00
CPC分类号： B32B43/006 , B01L3/50273 , B01L2200/0689 , B01L2300/0816 , B01L2300/0887 , B01L2400/0481 , B23K26/21 , B32B37/0076 , B32B37/06 , B32B38/0008 , B32B38/0036 , B32B43/00 , B32B2037/0092 , B32B2310/00 , B32B2310/0843 , B32B2439/80 , B32B2535/00 , Y10T156/1195 , Y10T156/1972
摘要： Embodiments generally relate to methods for forming and dismantling a hermetically sealed chamber. In one embodiment, the method comprises using room temperature laser bonding to create a hermetic seal between a first element and a second element to form a chamber. A bond interface of the hermetic seal is configured to allow the hermetic seal to be opened under controlled conditions using a release technique. In one embodiment, the chamber is formed within a microfluidic chip and the chamber is configured to hold a fluid. In one embodiment a chip comprises a first hermetic seal bonding first and second elements to create a first chamber and a second hermetic seal bonding third and fourth elements to create a second chamber encompassing the first chamber. The first hermetic seal may be broken open independently of the second hermetic seal by the application of a mechanical or thermal technique.

2. 发明公开

EP3140099A1 METHODS TO FORM AND TO DISMANTLE HERMETICALLY SEALED CHAMBERS 审中-公开
标题翻译： VERFAHREN ZUM AUF- UND ABBAUEN VON HERMETISCH VERSIEGELTEN KAMMERN
公开(公告)号：EP3140099A1
公开(公告)日：2017-03-15
申请号：EP15789584.8
申请日：2015-04-07
申请人： Picosys Incorporated
发明人： KARAM, Raymond Miller , WYNNE, Thomas , CHOBOT, Anthony Thomas
IPC分类号： B29C65/16 , B29C65/14 , B29C65/02
CPC分类号： B32B43/006 , B01L3/50273 , B01L2200/0689 , B01L2300/0816 , B01L2300/0887 , B01L2400/0481 , B32B37/0076 , B32B37/06 , B32B38/0008 , B32B38/0036 , B32B43/00 , B32B2037/0092 , B32B2310/00 , B32B2310/0843 , B32B2439/80 , B32B2535/00 , Y10T156/1195 , Y10T156/1972
摘要： Embodiments generally relate to methods for forming and dismantling a hermetically sealed chamber. In one embodiment, the method comprises using room temperature laser bonding to create a hermetic seal between a first element and a second element to form a chamber. A bond interface of the hermetic seal is configured to allow the hermetic seal to be opened under controlled conditions using a release technique. In one embodiment, the chamber is formed within a microfluidic chip and the chamber is configured to hold a fluid. In one embodiment a chip comprises a first hermetic seal bonding first and second elements to create a first chamber and a second hermetic seal bonding third and fourth elements to create a second chamber encompassing the first chamber. The first hermetic seal may be broken open independently of the second hermetic seal by the application of a mechanical or thermal technique.
摘要翻译：实施例通常涉及用于形成和拆卸密封室的方法。在一个实施例中，该方法包括使用室温激光键合来在第一元件和第二元件之间产生气密密封以形成腔室。气密密封件的粘合界面被构造成允许气密密封件使用释放技术在受控条件下打开。在一个实施例中，腔室形成在微流体芯片内，腔室被配置成保持流体。在一个实施例中，芯片包括接合第一和第二元件以形成第一腔室的第一密封密封件和粘合第三和第四元件的第二密封件，以形成包围第一腔室的第二腔室。通过应用机械或热技术，第一气密密封可以独立于第二气密密封而断开。

3. 发明公开

EP2422357A1 VORRICHTUNG UND VERFAHREN ZUM TRENNEN EINES SUBSTRATS VON EINEM TRÄGERSUBSTRAT 有权
标题翻译： VORRICHTUNG UND VERFAHREN ZUM TRENNEN EINES SUBSTRATS VON EINEMTRÄGERSUBSTRAT
公开(公告)号：EP2422357A1
公开(公告)日：2012-02-29
申请号：EP10712355.6
申请日：2010-03-31
申请人： EV Group GmbH
发明人： WIMPLINGER, Markus , LINDNER, Paul
IPC分类号： H01L21/00
CPC分类号： B32B38/10 , B32B43/006 , H01L21/67092 , H01L21/67132 , Y10T156/1105 , Y10T156/1168 , Y10T156/1189 , Y10T156/19 , Y10T156/1906 , Y10T156/1972
摘要： A device for separating a substrate from a carrier substrate bonded to the substrate by a bonding layer, with a carrier substrate receptacle with a receiving surface for receiving the carrier substrate, a substrate receptacle, arranged opposite the carrier substrate receptacle, with a substrate receiving surface that can be arranged parallel to the first-mentioned receiving surface and is intended for receiving the substrate, wherein separating means are provided for the parallel displacement of the substrate with respect to the carrier substrate in a bonded state of the substrate and the carrier substrate. Furthermore, the invention relates to a method for separating a substrate from a carrier substrate bonded to the substrate by a bonding layer with the following steps: receiving a bonded substrate/carrier-substrate assembly comprising the carrier substrate, the bonding layer and the substrate, between a substrate receiving surface of a substrate receptacle and a receiving surface of a carrier substrate receptacle that can be arranged parallel to the substrate receiving surface and separation of the substrate from the carrier substrate by parallel displacement of the substrate with respect to the carrier substrate in a bonded state of the substrate and the carrier substrate.
摘要翻译：用于通过互连层与衬底分离衬底与装置衬底的装置。该装置包括具有用于保持载体衬底的保持表面的载体衬底保持器和与载体衬底保持器相对定位的衬底保持器，衬底保持表面可平行于容纳衬底的保持表面定位。在衬底和载体衬底的互连状态下，存在用于平行移动衬底相对于载体衬底的分离装置。

4. 发明授权

EP1464414B1 METHOD AND FACILITY FOR SEPARATING AND RECOVERING STEEL PIPE AND COVERING RESIN IN RESIN-COVERED STEEL PIPE 有权
标题翻译：用于切割方法以及设备和恢复从钢管混凝土及涂料树脂在同一树脂涂塑钢管
公开(公告)号：EP1464414B1
公开(公告)日：2010-01-20
申请号：EP02778056.8
申请日：2002-11-05
申请人： Yazaki Kako Corporation
发明人： MATSUMOTO, Tatsuo, YAZAKI IND. CHEMICAL CO.,LTD , FUJITA, Haruo, YAZAKI IND. CHEMICAL CO. LTD
IPC分类号： B09B5/00 , B29B17/02
CPC分类号： B29B17/021 , B09B5/00 , B29B17/02 , B29B17/0412 , B29B2017/044 , B29B2017/0448 , B29C2035/0811 , B29K2105/20 , B29L2023/00 , B29L2023/22 , Y02W30/521 , Y02W30/622 , Y02W30/625 , Y10S156/935 , Y10T156/11 , Y10T156/1126 , Y10T156/1153 , Y10T156/19 , Y10T156/1972
摘要： There are provided a method and a facility for separating and recovering a steel pipe and a covering resin in a resin-covered steel pipe, which do not produce cuttings of the steel pipe and which make it possible to continuously operate the facility. The method comprises the steps of using a cut line forming means installed forwardly of the position that a high frequency induction coil passes, so as to form a cut line extending from the surface of the resin-covered steel pipe toward the steel pipe, deep enough to reach the surface of the steel pipe from the surface of the covering resin, throughout the length of the resin-covered steel pipe, circumferentially dividing the covering resin into at least two parts, heating the steel pipe by high frequency induction heating, in the position of a separating device disposed at a suitable position immediately after the passage of the position of the high frequency induction coil, to the extent the boundary between the covering resin and the steel pipe assumes the state for the release of the covering resin from the steel pipe, and cutting each covering resin into at least two parts along the cut line and toward the outside of the steel pipe by the separating device while releasing and separating it from the steel pipe.

5. 发明公开

EP2100706A2 Automatic mask peeling apparatus 有权
标题翻译：自动掩膜剥离装置
公开(公告)号：EP2100706A2
公开(公告)日：2009-09-16
申请号：EP09250673.2
申请日：2009-03-10
申请人： NGK Insulators, Ltd.
发明人： Furukubo, Hiroshi
IPC分类号： B28B11/00 , B28B17/00 , B29C63/00
CPC分类号： B28B11/006 , B28B17/00 , B29C63/0013 , Y10T156/1137 , Y10T156/1168 , Y10T156/1939 , Y10T156/1972 , Y10T156/1978 , Y10T156/1989
摘要： An automatic mask peeling apparatus 10 includes: a brushing apparatus 30 for removing solidified plugging slurry attached to the mask 24; an air injection apparatus 36 for injecting, after the removal of the solidified plugging slurry, air from the opposite end face-side of the one end face to raise a folded surplus part of the mask from the one end face; a mask peeling apparatus 50 for holding the part raised by the air injection apparatus 36 to peel the mask 24; and a carrying apparatus 55 for carrying a masked plugging honeycomb structure 200 from the brushing apparatus 30 to the mask peeling apparatus 50. This apparatus can be used to peel a mask 24 which has been used for plugging only the predetermined cells of a masked plugging honeycomb structure 200; the mask 24 having an area larger than the area of the end face of the structure.
摘要翻译：自动掩模剥离装置10包括：用于去除附着于掩模24的固化封堵浆液的刷洗装置30; 空气注入装置36，用于在去除凝固的封堵浆液之后从该一个端面的相反端面侧注入空气，以从该一个端面升起掩模的多余部分; 掩模剥离装置50，用于保持由空气注射装置36抬起的部分以剥离掩模24; 以及用于将来自刷洗装置30的掩蔽堵塞蜂窝结构200运送到掩模剥离装置50的运送装置55.该装置可用于剥离仅用于堵塞掩蔽堵塞蜂窝的预定孔格的掩模24 结构200; 掩模24的面积大于结构端面的面积。

6. 发明授权

EP1469981B1 DISPOSITIF DE COUPE DE COUCHE D'UN SUBSTRAT ET PROCÉDÉ ASSOCIÉ 有权
标题翻译：设备用于切割的基材层和相应的方法
公开(公告)号：EP1469981B1
公开(公告)日：2009-03-18
申请号：EP03712201.7
申请日：2003-01-02
申请人： S.O.I.Tec Silicon on Insulator Technologies
发明人： RAYSSAC, Olivier , LETERTRE, Fabrice
IPC分类号： B28D5/00
CPC分类号： H01L21/76254 , B28D5/0011 , B28D5/0023 , B28D5/0052 , B28D5/0064 , H01L21/2007 , Y10T29/53274 , Y10T83/0267 , Y10T83/04 , Y10T83/364 , Y10T156/1059 , Y10T156/1184 , Y10T156/1189 , Y10T156/1961 , Y10T156/1967 , Y10T156/1972 , Y10T225/10 , Y10T225/12 , Y10T225/30 , Y10T225/307 , Y10T225/35 , Y10T225/386
摘要： The invention concerns a device for automatic high-precision cutting of a material layer (20a) which is integral with a source substrate (20b) via a weakened zone (200c), the source substrate and the layer to be cut forming together an assembly to be cut (20), the device comprising cutting means (101, 102) as well as means for retaining (100a, 100b) the assembly to be cut. The invention is characterized in that the retaining means are designed for controlled displacement so as to accompany actively the divergence and/or the deformation of each part of the assembly to be cut, and to rectify said divergence and/or said deformation. The invention also concerns a corresponding automatic cutting method.

7. 发明授权

EP1310432B1 Laminating apparatus for optical disc 有权
标题翻译：贴合光盘
公开(公告)号：EP1310432B1
公开(公告)日：2006-02-08
申请号：EP02024969.4
申请日：2002-11-07
申请人： Lintec Corporation , SONY CORPORATION
发明人： Hayasaka, Takuya , Yamasaki, Takeshi , Yukumoto, Tomomi
IPC分类号： B65C9/18 , B65C1/02 , B65C9/26
CPC分类号： B32B38/10 , B29C63/0047 , B32B37/0015 , B32B37/003 , B32B38/1858 , B32B2038/1891 , B32B2309/06 , B32B2429/02 , B32B2519/00 , B65C1/021 , B65C9/1884 , B65C9/26 , B65C2009/0018 , B65C2009/0087 , G11B7/00 , Y10T156/1705 , Y10T156/171 , Y10T156/1744 , Y10T156/1751 , Y10T156/1972 , Y10T156/1983

8. 发明公开

EP1107295A3 Composite member separating method, thin film manufacturing method, and composite member separating apparatus 审中-公开
标题翻译：用于薄膜器件的复合部件的制造方法的分离方法，用于分离合成件
公开(公告)号：EP1107295A3
公开(公告)日：2005-04-13
申请号：EP00310899.0
申请日：2000-12-07
申请人： CANON KABUSHIKI KAISHA
发明人： Yanagita, Kazutaka , Ohmi, Kazuaki , Sakaguchi, Kiyofumi
IPC分类号： H01L21/20 , H01L21/762
CPC分类号： H01L21/67092 , H01L21/76259 , Y10T156/1972
摘要： This invention relates to a composite member separating method in which a first member (1) having a separation layer (4) and a transfer layer (5) on the separation layer (4) is bonded to a second member (2) is separated at a position different from the bonding interface between the first member (1) and the second member (2), the method comprising the steps of, applying a force asymmetric with respect to the interface to the end portion of the composite member to form a crack (7A) that runs from the surface of the first member (1) to the separation layer (4) through the transfer layer (5), and then, growing the crack is grown along the separation layer (4) to completely separate the composite member.

9. 发明公开

EP1424180A1 METHOD AND SYSTEM FOR REMOVING METAL WIRE IN TIRE THROUGH INDUCTION HEATING 有权
标题翻译： VERFAHREN UND SYSTEM ZUM ENTFERNEN VON METALLDRAHT AUS REIFEN DURCHINDUKTIONSERWÄRMUNG
公开(公告)号：EP1424180A1
公开(公告)日：2004-06-02
申请号：EP02705318.0
申请日：2002-03-19
申请人： National Institute of Advanced Industrial Science and Technology
发明人： YASUE, Kazuo AIST Chubu , YAMADA, Yasuo AIST Chubu
IPC分类号： B29B17/00
CPC分类号： B26D3/005 , B29B17/021 , B29B17/0412 , B29C2035/0811 , B29K2021/00 , B29K2705/12 , B29L2030/00 , Y02P70/183 , Y02W30/622 , Y02W30/625 , Y02W30/68 , Y10S156/939 , Y10T156/1153 , Y10T156/1189 , Y10T156/1972
摘要： The present invention provides a method of removing metal wires from a tire through induction heating, a method of collecting the metal wires and rubber part, and a method of reusing the metal wires and rubber part. The present invention relates to: a metal wire removal method for removing metal wires from a tire incorporated with metal wires using induction heating, wherein the metal wires in the tire are heated by induction heating, causing the rubber in the part contacting the metal wires to decompose and gasify to separate the metal wires and rubber part, whereupon the metal wires are removed; a method of collecting the metal wires and rubber part from the tire using the method described above; and a method of reusing the metal wires and rubber part collected using the method described above as metal and rubber resources. Thus the metal wires and rubber part can be separated from a used tire, collected at a high collection rate, and reused.
摘要翻译：本发明提供一种通过感应加热从轮胎去除金属丝的方法，收集金属线和橡胶部分的方法以及重新使用金属线和橡胶部分的方法。本发明涉及一种金属丝去除方法，其特征在于，使用感应加热从金属线的轮胎除去金属线，其中，所述轮胎中的金属线通过感应加热而被加热，使与所述金属线接触的部分中的橡胶分解气化，分离金属线和橡胶部分，然后去除金属线; 使用上述方法从轮胎收集金属线和橡胶部件的方法; 以及使用上述方法收集的金属线和橡胶部分作为金属和橡胶资源的方法。因此，金属线和橡胶部分可以与废旧轮胎分离，以高收集率收集并重新使用。

10. 发明公开

EP1342512A4 DEVICE AND METHOD FOR PEELING FILM 审中-公开
标题翻译： VORRICHTUNG UND VERFAHREN ZUM ABZIEHEN EINER FOLIE
公开(公告)号：EP1342512A4
公开(公告)日：2004-03-03
申请号：EP01270388
申请日：2001-12-05
申请人： SONY CORP
发明人： OHWADA YOSHIAKI , OZEKI AKIO , YUDA TAKESHI , OGAWA KUNIO
IPC分类号： H01J9/50 , B29B17/02 , B29C63/00 , H01J9/52 , B09B5/00 , B26D3/28 , B26D7/10
CPC分类号： B29B17/02 , B29B2017/044 , B29C63/0013 , B29L2007/007 , B29L2007/008 , B29L2031/3475 , Y02W30/521 , Y02W30/622 , Y02W30/625 , Y10T156/1189 , Y10T156/12 , Y10T156/1972
摘要： A film peeling device capable of peeling a film stuck on the external surface of an article such as a cathode ray tube, comprising a stage for placing thereon the article in the state of facing the film-stuck surface thereof upward, a blade tip for peeling off one end of the film stuck on the external surface of the article, a peeling means formed so as to heat the blade tip, a clamp means for clamping one end of the film peeled off by the peeling means, and a moving means for moving the clamp means, whereby the film stuck on the external surface of the article can be surely peeled off easily and rapidly.
摘要翻译：一种膜剥离装置，其能够剥离粘贴在阴极射线管等物品的外表面上的膜，该膜剥离装置包括用于在其上面放置物品的工作台，该工作台面向其贴膜表面向上，用于剥离的刀尖将粘贴在物品外表面上的薄膜的一端剥离，形成为加热刀尖的剥离装置，夹持由剥离装置剥离的薄膜的一端的夹紧装置和用于移动的移动装置夹紧装置，由此可以容易且迅速地将粘在物品外表面上的薄膜可靠地剥离。

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