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    • 10. 发明公开
    • Resist removing apparatus
    • Gerätzum Entschichten von Fotoresist
    • EP0774694A2
    • 1997-05-21
    • EP96118376.1
    • 1996-11-15
    • NITTO DENKO CORPORATION
    • Yamamoto, MasayukiMatsushita, Takao
    • G03F7/42
    • B08B7/0028G03F7/427H05K3/0079Y10T156/1189
    • A resist removing apparatus for removing unnecessary resist patterns from articles such as semiconductor substrates efficiently by using adhesive tape. A tape applicator unit is movable horizontally to apply the adhesive tape in strip form to a wafer supported on an applicator table. Then, a set of the tape applicator unit and a tape separator unit and a set of the applicator table and a separator table are moved horizontally relative to each other to shift the separator table under the wafer supported through the adhesive tape. A next wafer is transported to and placed on the applicator table in an unloaded state. The tape applicator unit and tape separator unit are moved horizontally and simultaneously to apply the adhesive tape to the wafer on the applicator table and separate the adhesive tape from the wafer on the separator table at the same time.
    • 一种抗蚀剂去除装置,用于通过使用胶粘带有效地从诸如半导体衬底的制品中去除不必要的抗蚀剂图案。 带施加器单元可水平移动以将带状的粘合带施加到支撑在施加器台上的晶片。 然后,一组带施加器单元和带分离器单元以及一组施加器台和分离器台相对于彼此水平移动,以将分离台移动到通过胶带支撑的晶片下方。 下一个晶片在卸载状态下被运送到施放台上并放置在敷料台上。 带施加器单元和带分离器单元水平地和同时移动,以将粘合带施加到施加器台上的晶片上,同时将胶带与分离器台上的晶片分离。