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1. 发明授权

EP3815476B1 ELEKTRONIKMODUL MIT STECKERANSCHLUSS 有权
公开(公告)号：EP3815476B1
公开(公告)日：2024-08-07
申请号：EP19729240.2
申请日：2019-06-04
IPC分类号： H05K5/00 , H05K5/06
CPC分类号： H05K5/0034 , H05K5/0069 , H05K5/065

2. 发明公开

EP3208902A1 CONTROLLER AND METHOD FOR MANUFACTURING CONTROLLER 审中-公开
标题翻译：控制器和制造控制器的方法
公开(公告)号：EP3208902A1
公开(公告)日：2017-08-23
申请号：EP15850561.0
申请日：2015-10-07
申请人： Mitsuba Corporation
发明人： OGANE, Takahiko , KOSHIO, Fumiaki , KUSUMOTO, Wataru , ISHII, Masamichi , YAMADA, Yoshihisa , TSURUBUCHI, Iwao
IPC分类号： H02G3/16 , H01R13/50 , H01R43/00
CPC分类号： H05K5/0017 , B29C70/72 , B29C70/84 , B29C70/882 , B29D99/006 , B29K2995/0069 , B29L2031/3481 , H01L25/07 , H01R13/50 , H01R27/02 , H01R43/18 , H02G3/105 , H05K5/0034 , H05K5/0217 , H05K5/065
摘要： A controller (1) includes a primary molded portion (11) in which a resin molded body (10) is integrated with a bus bar (100) using a resin, causing one end of the bus bar (100) to function as a connector terminal which protrudes into connector portions (13) to (15), and configured to form electronic component disposition portions (16a) to (16d) in which an electronic component (40) is disposed and a power device disposition portion (17) in which a power device (50) is disposed, and a secondary molded portion (21) integrated with the electronic component (40), the power device (50), and the primary molded portion (11) in a state in which the electronic component (40) is disposed at the electronic component disposition portions (16a) to (16d) and the power device (50) is disposed at the power device disposition portion (17).
摘要翻译：控制器（1）包括：一次成型部（11），其使用树脂将树脂成型体（10）与汇流条（100）一体化，使汇流条（100）的一端作为连接器（13）至（15）中突出并构造成形成电子部件（40）被布置在其中的电子部件布置部分（16a）至（16d）以及动力装置布置部分（17）的端子，在电子部件（50）和电子部件（40），电源装置（50）以及一次成型部（11）一体化的二次成型部（21） 40）配置在电子部件配置部（16a）〜（16d），功率器件（50）配置在功率器件配置部（17）。

3. 发明公开

EP2953210A4 VEHICLE-MOUNTED ELECTRONIC MODULE 有权转让
标题翻译：车辆内部的电子模块
公开(公告)号：EP2953210A4
公开(公告)日：2016-10-19
申请号：EP14746243
申请日：2014-01-17
申请人： HITACHI AUTOMOTIVE SYSTEMS LTD
发明人： KAJIWARA RYOICHI , ISHII TOSHIAKI , KAMOSHIDA MASARU
IPC分类号： H01R12/72 , H05K5/00
CPC分类号： H05K5/0069 , B60R16/0239 , H01R12/721 , H01R13/504 , H01R13/5202 , H01R13/5216 , H01R2201/26 , H05K1/181 , H05K5/0034 , H05K5/0056 , H05K5/006 , H05K7/20454 , H05K7/20854
摘要： There is provided an on-vehicle electronic module that includes an external connecting function and environment resistant reliability similar to a previous on-vehicle electronic module and that simultaneously achieves downsizing without a male connector housing component and cost reduction due to reduction of the number of components and assembly man-hours. There are included a circuit board 1 including a mounting region 2 and a terminal forming region 3, and a case housing the mounting region 2 of the circuit board 1. Electronic components 9 and 10 are mounted on the mounting region 2. A board terminal is formed in the terminal forming region 3. The case includes a case member 13 integrally formed with a wall surface and a male connector housing 13a. The wall surface forms a case internal space 21 that houses the mounting region 2. A female connector is mounted to the male connector housing 13a. The circuit board 1 penetrates the case member 13 such that the terminal forming region 3 is exposed to a housing space 22 side of the male connector housing 13a.

4. 发明授权

EP2548423B1 SCHALTUNGSANORDNUNG UND ZUGEHÖRIGES STEUERGERÄT FÜR EIN KRAFTFAHRZEUG 有权
标题翻译：汽车电路布置和相关控制单元
公开(公告)号：EP2548423B1
公开(公告)日：2016-01-13
申请号：EP11707683.6
申请日：2011-03-11
申请人： Robert Bosch GmbH
发明人： HEIM, Michael , KEIL, Stefan , BRAUN, Gerhard , VOEGELE, Georg
IPC分类号： H05K1/16 , H05K3/20 , H05K5/00 , H05K3/00 , H05K3/46
CPC分类号： H05K5/0034 , H05K1/162 , H05K3/0061 , H05K3/202 , H05K3/4685 , H05K2201/09118 , H05K2201/10924 , H05K2203/1316

5. 发明公开

EP2936075A1 ELEKTRONISCHE VORRICHTUNG UND VERFAHREN ZUR HERSTELLUNG EINER ELEKTRONISCHEN VORRICHTUNG 审中-公开
标题翻译：电子器件及其制造方法的电子设备
公开(公告)号：EP2936075A1
公开(公告)日：2015-10-28
申请号：EP13799036.2
申请日：2013-11-29
申请人： Continental Teves AG & Co. OHG
发明人： SCHILLINGER, Jakob , ROMHART, Günther , DINARD, Yann
IPC分类号： G01D11/24 , H05K3/28 , H05K1/02
CPC分类号： H05K5/0034 , G01D11/245 , G01D18/00 , G01R1/04 , G01R33/09 , H01L23/544 , H01L2223/54433 , H01L2223/54486 , H01L2224/48091 , H01L2224/48137 , H01L2924/1461 , H05K1/0266 , H05K3/284 , H05K5/0017 , H05K5/003 , H05K5/062 , Y10T29/49004 , Y10T29/49147 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to an electronic device (14) comprising: an electronic circuit (26) accommodated in a circuit housing (38) and a moulded body (40) which surrounds the circuit housing (38). The moulding compound (40) has a cut-out (41) that exposes the circuit housing (38), in which cut-out an identification (42) that characterizes the electronic circuit (26) is arranged.
摘要翻译：一种用于输出传感器开始检测到的物理变量，包括的基础上的电信号：容纳在一个壳体上并且能够通过在电信号连接接触外部电路的电路中的测量电路; 和保护体在开口用保护化合物组成，围绕该电路外壳与该开口暴露的电路壳体的一部分的化合物。电路外壳的表面具有模制的元件的所有这是由保护性化合物包围。

6. 发明公开

EP2191506A1 WRAP-AROUND OVERMOLD FOR ELECTRONIC ASSEMBLY 有权转让
标题翻译：封装，电子组件
公开(公告)号：EP2191506A1
公开(公告)日：2010-06-02
申请号：EP08830081.9
申请日：2008-09-12
申请人： Delphi Technologies, Inc.
发明人： DEGENKOLB, Thomas, A. , BRANDENBURG, Scott, D. , MANDEL, Larry, M. , CHOW, Kin, Yean , FANG, Ching, Meng , YONG, Sim, Ying
IPC分类号： H01L23/28
CPC分类号： H05K3/284 , H05K3/0061 , H05K3/0064 , H05K5/0034 , H05K5/065 , H05K7/20854 , H05K2201/10189 , H05K2203/1316
摘要： An improved overmolded electronic assembly includes a backplate provided with a recessed edge, a circuit substrate on the backplate, at least one electronic component mounted on the circuit substrate, conductive traces on the circuit substrate which together with the electronic component(s) defines a circuit device, an electrical connector, and an overmold body that has peripheral edges that wrap around sides of the backplate and onto the edge recesses. The resulting over wrap feature eliminates delamination problems that would otherwise occur during thermal cycling of the electronic assembly, improves corrosion resistance at connector-to-backplate interfaces, and enhances securement of the printed circuit board assembly and electrical connector to the assembly.

7. 发明公开

EP2043413A2 Method of overmolding an electronic assembly having an insert-moled vertical mount connector header 审中-公开
标题翻译：围绕电子组件铸造用的插入件的方法模制的垂直支撑连接头部
公开(公告)号：EP2043413A2
公开(公告)日：2009-04-01
申请号：EP08164258.9
申请日：2008-09-12
申请人： Delphi Technologies, Inc.
发明人： Brandenburg, Scott D. , Laudick, David A.
IPC分类号： H05K5/00
CPC分类号： H05K5/0034 , H05K3/284 , H05K2201/10303 , H05K2201/10424 , H05K2203/1316 , Y10T29/49158 , Y10T29/49176 , Y10T29/4922
摘要： An electronic assembly (10) including a vertical mount connector header (16) is overmolded to form an encapsulated module. Conductor pins (16c) retained in the connector header (16) are coupled to a circuit board (14) to support the connector header (16) with respect to the circuit board (14), leaving an open space between the connector header (16) and the circuit board (14). The electronic assembly (10) is then placed in a mold (30) for plastic encapsulation. The floor of the mold (30) has a well (36) sized to accommodate the conductor pins (16c) and shroud (16a) of the connector header (16), and the connector header (16) has a peripheral flange (16f) that seats against the floor of the mold (30) to keep encapsulant (20) out of the well (36). Encapsulant (20) fills open spaces inboard of the connector header (16), and a connector insert (40) disposed between the connector header (16) and the floor of the well (36) prevents distention of the connector header (16) and circuit board (14) due to the packing pressure of the encapsulant (20).
摘要翻译：一种电子组件（10）包括垂直安装的连接器头（16）被包覆模制，以形成包封的模块。导电销（16C）保持在所述连接器插头（16）被耦合到一个电路板（14）相对于所述电路板（14），以支持在连接器头（16），在离开连接器插头之间的开放空间（16 ）和电路板（14）。所述的电子组件（10）然后，在用于塑料封装的模具（30）放置。所述模具（30）的底板有一个孔（36）尺寸设计成容纳所述连接器头（16）和所述连接器插头（16）的导电销（16C）和护罩（16A）具有周边凸缘（16F）并针对模具（30）的地板席位，以保持密封件（20）出井（36）。密封剂（20）填充所述连接器插头（16）和所述井的底板（36）之间设置开放空间内侧的连接器插头（16），和一个连接器插头（40）的防止连接器插头的腹胀（16）和电路板（14）由于所述密封剂（20）的填充压力。

8. 发明公开

EP1734800A2 Technique for manufacturing an overmolded electronic assembly 有权转让
标题翻译：技术人士Herstellen von einer umgossenen elektronischen Baugruppe
公开(公告)号：EP1734800A2
公开(公告)日：2006-12-20
申请号：EP06076163.2
申请日：2006-06-02
申请人： Delphi Technologies, Inc.
发明人： Brandenburg, Scott D. , Laudick, David A.
IPC分类号： H05K3/28 , H05K3/00 , H05K5/00
CPC分类号： H01L23/3121 , H01L23/4334 , H01L25/0652 , H01L25/162 , H01L25/50 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/19041 , H05K1/0203 , H05K3/0061 , H05K3/284 , H05K5/0034 , H05K7/20854 , H05K2201/09063 , H05K2201/09745 , H05K2201/10189 , H05K2201/1056 , H05K2201/10674 , H05K2203/1316 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A technique for manufacturing an electronic assembly (300) includes a number of steps. Initially, a backplate (302) with a cavity (319) formed into a first side of the backplate (302) is provided. Next, a substrate (304) with a first side of an integrated circuit (IC) die (306A) mounted to a first side of the substrate (304) is provided. The IC die (306A) is electrically connected to one or more of a plurality of electrically conductive traces formed on the first side of the substrate (304). The substrate (304) includes a hole (320) approximate an outer edge of the IC die (306A). The first side of the substrate (304) is then positioned in contact with at least a portion of the first side of the backplate (302). The IC die (306A) is positioned within the cavity (319) with a second side of the IC die (306A) in thermal contact with the backplate (302). The substrate (304) and at least a portion of the backplate (302) are overmolded with an overmold material (350), which enters the cavity (319) through the hole to substantially underfill the IC die (306A) and substantially fill an unoccupied portion of the cavity (319).
摘要翻译：一种用于制造电子组件（300）的技术包括多个步骤。首先，设置有形成在背板（302）的第一侧上的空腔（319）的背板（302）。接下来，提供安装在基板（304）的第一侧的具有集成电路（IC）管芯（306A）的第一侧的基板（304）。 IC管芯（306A）电连接到形成在衬底（304）的第一侧上的多个导电迹线中的一个或多个。基板（304）包括近似于IC管芯（306A）的外边缘的孔（320）。然后将衬底（304）的第一侧定位成与背板（302）的第一侧的至少一部分接触。 IC模具（306A）位于空腔（319）内，IC芯片（306A）的第二面与背板（302）热接触。衬底（304）和背板（302）的至少一部分用包覆成型材料（350）包覆成型，该二次模制材料通过孔进入空腔（319），以基本上填充IC管芯（306A）并基本上填充未占用空腔（319）的一部分。

9. 发明公开

EP1643818A1 MODULE AND METHOD FOR FABRICATING THE SAME 审中-公开
标题翻译： VERFAHREN ZU SEINER HERSTELLUNG
公开(公告)号：EP1643818A1
公开(公告)日：2006-04-05
申请号：EP03817348.0
申请日：2003-07-03
申请人： Hitachi, Ltd. , Hitachi Car Engineering Co., Ltd.
发明人： EGUCHI, Syuuji c/o Hitachi, Ltd.,Intel.Prop.Group , ASANO, Masahiko c/o Hitachi Car Engineering Co.Ltd , SASAKI, Masahiro, Hitachi Car Engineering Co., Ltd , UCHIYAMA, Kaoru, c/o Hitachi, Ltd.,Int. Prop.Group
IPC分类号： H05K3/28
CPC分类号： H05K3/284 , H05K3/0061 , H05K3/0064 , H05K5/0034 , H05K5/0082 , H05K5/065 , H05K7/20854 , H05K2201/0191 , H05K2201/0209 , H05K2201/09072 , H05K2201/10189 , H05K2201/10734 , H05K2203/1316 , Y10T29/49146 , Y10T29/49171
摘要： A module having a smaller size with enhanced reliability and productivity, and a method for fabricating the module. The module comprises a connector (6) having metal terminals for connection, and a circuit board (1) mounting electronic components. The connector (6) and the board (1) are connected to each other through metal leads (7). The surface of the connector (6) on the side being connected to the board, the metal leads 7, and the electronic components are sealed with the same thermosetting resin (9). The thermosetting resin (9) is in solid state at temperatures of 40°C or below before curing, and the thickness of the thermosetting resin (9) sealing the electronic components is changed depending on the heights of the electronic components.
摘要翻译：具有更小尺寸，更高可靠性和生产率的模块，以及一种制造该模块的方法。该模块包括具有用于连接的金属端子的连接器（6）和安装电子部件的电路板（1）。连接器（6）和板（1）通过金属引线（7）彼此连接。连接到板的一侧的连接器（6）的表面，金属引线7和电子部件用相同的热固性树脂（9）密封。热固化性树脂（9）在固化前为40℃以下的固体状态，密封电子部件的热固性树脂（9）的厚度根据电子部件的高度而变化。

10. 发明授权

EP1262358B1 Vehicle instrument panel with flexible foam closure cap in which an electrical circuit board is embedded and vehicle component having an electrical circuit board at least partially embedded in a flexible foam material 有权
标题翻译：仪表板与盖由弹性泡沫材料，其中的电路板被嵌入，以及所述车辆的部分与电路板，其至少部分地嵌入在弹性泡沫的
公开(公告)号：EP1262358B1
公开(公告)日：2004-09-22
申请号：EP02253637.9
申请日：2002-05-23
申请人： Lear Corporation
发明人： Davis, Joseph J. Jr. , O'Brien, Timothy F.
IPC分类号： B60K37/00 , B60R13/08 , B60R16/02
CPC分类号： B60K37/00 , B60R13/0256 , B60R13/0815 , B60R2013/0287 , H05K3/284 , H05K5/0034

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