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1. 发明公开

EP2936076A2 ELEKTRONISCHE VORRICHTUNG UND VERFAHREN ZUR HERSTELLUNG EINER ELEKTRONISCHEN VORRICHTUNG 审中-公开
公开(公告)号：EP2936076A2
公开(公告)日：2015-10-28
申请号：EP13799037.0
申请日：2013-11-29
申请人： Continental Teves AG & Co. oHG
发明人： SCHILLINGER, Jakob , SCHRADER, Ulrich , HUBER, Dietmar
IPC分类号： G01D11/24 , H05K3/28 , G01D18/00 , H01L21/66 , H01L23/544 , H05K1/02
CPC分类号： H05K5/0034 , G01D11/245 , G01D18/00 , G01R1/04 , G01R33/09 , H01L23/544 , H01L2223/54433 , H01L2223/54486 , H01L2224/48091 , H01L2224/48137 , H01L2924/1461 , H05K1/0266 , H05K3/284 , H05K5/0017 , H05K5/003 , H05K5/062 , Y10T29/49004 , Y10T29/49147 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to an electronic device (14) comprising: an electronic circuit (26) accommodated in a circuit housing (38) having a first thermal expansion coefficient, and a moulded body (40) which surrounds the circuit housing (38), said body having a second thermal expansion coefficient that differs from the first thermal expansion coefficient. The moulded body (40) is fixed to the circuit housing (38) at least at two different mutually spaced (48) fixing points (46) on the circuit housing (38).
摘要翻译：本发明涉及一种电子设备（14），包括：容纳在具有第一热膨胀系数的电路外壳（38）中的电子电路（26）和包围电路外壳（38）的模制体（40），所述具有与第一热膨胀系数不同的第二热膨胀系数的主体。模制体（40）至少在电路壳体（38）上的两个不同的相互间隔（48）固定点（46）处固定到电路壳体（38）。

2. 发明公开

EP2894714A1 VEHICLE-MOUNTED ANTENNA DEVICE 审中-公开
标题翻译：天。。。。。。
公开(公告)号：EP2894714A1
公开(公告)日：2015-07-15
申请号：EP13833774.6
申请日：2013-06-20
申请人： Denso Corporation , Nippon Soken, Inc.
发明人： YUKIZAKI, Yasumune , SUZUKI, Tadao , KATAOKA, Ryohei , SUGIMOTO, Yuji
IPC分类号： H01Q1/32 , H01Q1/22
CPC分类号： H01Q1/3275 , H01Q1/02 , H01Q1/241 , H01Q1/42 , H01Q9/42 , H05K1/181 , H05K5/003 , H05K2201/10098 , H05K2201/10507
摘要： A vehicle-mounted antenna device (20) includes a base (22), a board (24), a circuit section (30), and a housing (32). The base is mountable on a roof (11) of a vehicle (10). The board has an antenna element section (26) and is stood on a surface (22a) of the base. The circuit section serves as at least part of a wireless communication circuit electrically connected to the antenna element section. The housing is made of a resin material and forms a projection of a vehicle outer shape. The board and the circuit section are located in space formed by the base and the housing. The board is stood on the surface of the base so that a first direction perpendicular to the surface of the base differs from a second direction equal to a thickness direction of the board. The circuit section is implemented on the board at a position away from the base in the first direction.
摘要翻译：车载天线装置（20）包括基座（22），电路板（24），电路部分（30）和壳体（32）。基座可安装在车辆（10）的屋顶（11）上。板具有天线元件部分（26）并且站在基座的表面（22a）上。电路部分用作电连接到天线元件部分的无线通信电路的至少一部分。壳体由树脂材料制成并形成车辆外形的突起。板和电路部分位于由基座和壳体形成的空间中。板位于基座的表面上，使得垂直于基座表面的第一方向与等于板的厚度方向的第二方向不同。电路部分在板上在第一方向远离基座的位置上实现。

3. 发明公开

EP2223393A4 ELECTRONIC ASSEMBLY AND METHOD OF MANUFACTURING SAME 审中-公开
标题翻译： ELEKTRONISCHE ANORDNUNG UND HERSTELLUNGSVERFAHRENDAFÜR
公开(公告)号：EP2223393A4
公开(公告)日：2014-04-09
申请号：EP08867449
申请日：2008-12-18
申请人： TRW AUTOMOTIVE US LLC
发明人： BLOSSFELD MIKE , SANCHEZ LUIS FERNANDO
IPC分类号： H01R13/66 , H01R12/72 , H01R13/447 , H01R13/506
CPC分类号： H05K5/006 , H01R12/724 , H01R13/41 , H01R13/447 , H01R13/506 , H01R13/6658 , H01R23/7073 , H01R43/16 , H01R43/18 , H01R43/20 , H01R43/205 , H01R2201/26 , H02G3/086 , H02G3/16 , H05K5/003 , H05K5/0047 , H05K5/0052 , H05K5/0239 , H05K7/1428 , Y10S439/941 , Y10T29/49002 , Y10T29/49117 , Y10T29/49204 , Y10T29/49208 , Y10T29/4922 , Y10T29/49222
摘要： An electronic assembly comprises a housing, a cover for the housing, a printed circuit board receivable in the housing, and a compliant pin header assembly. The compliant pin header assembly is mountable in the housing by interengaging features on the header assembly and the housing. The compliant pin header assembly has compliant pins for engaging corresponding features on the printed circuit board to connect the compliant pin header assembly electrically to the printed circuit board. The cover, when the electronic assembly is assembled, engages the housing and also engages the printed circuit board at a location spaced from an outer periphery of the printed circuit board.
摘要翻译：电子组件包括壳体，用于壳体的盖，可容纳在壳体中的印刷电路板以及柔性针头组件。柔性销头组件可通过头部组件和壳体上的相互接合的特征安装在壳体中。兼容的针头组件具有用于接合印刷电路板上的相应特征的柔性销，以将顺应性插头组件电连接到印刷电路板。当电子组件组装时，盖子接合壳体并且还在与印刷电路板的外周边隔开的位置处接合印刷电路板。

4. 发明授权

EP2894714B1 VEHICLE-MOUNTED ANTENNA DEVICE 有权
公开(公告)号：EP2894714B1
公开(公告)日：2018-11-14
申请号：EP13833774.6
申请日：2013-06-20
申请人： Denso Corporation , Nippon Soken, Inc.
发明人： YUKIZAKI, Yasumune , SUZUKI, Tadao , KATAOKA, Ryohei , SUGIMOTO, Yuji
IPC分类号： H01Q1/32 , H01Q1/22 , H01Q1/02
CPC分类号： H01Q1/3275 , H01Q1/02 , H01Q1/241 , H01Q1/42 , H01Q9/42 , H05K1/181 , H05K5/003 , H05K2201/10098 , H05K2201/10507
摘要： A vehicle-mounted antenna device (20) includes a base (22), a board (24), a circuit section (30), and a housing (32). The base is mountable on a roof (11) of a vehicle (10). The board has an antenna element section (26) and is stood on a surface (22a) of the base. The circuit section serves as at least part of a wireless communication circuit electrically connected to the antenna element section. The housing is made of a resin material and forms a projection of a vehicle outer shape. The board and the circuit section are located in space formed by the base and the housing. The board is stood on the surface of the base so that a first direction perpendicular to the surface of the base differs from a second direction equal to a thickness direction of the board. The circuit section is implemented on the board at a position away from the base in the first direction.

5. 发明公开

EP3364815A1 A HAIR CARE APPLIANCE 审中-公开
公开(公告)号：EP3364815A1
公开(公告)日：2018-08-29
申请号：EP16777756.4
申请日：2016-09-28
申请人： Dyson Technology Limited
发明人： SAUNDERS, Samuel , DONALD, Graham , BOBILLIER, Ben
IPC分类号： A45D20/12
CPC分类号： A45D20/10 , A45D20/12 , A45D2200/15 , G05D23/306 , H05K5/003 , H05K7/1401
摘要： A hair care appliance including a body having an outer wall and an inner wall, a fluid flow path extending from a fluid inlet to a fluid outlet wherein the fluid outlet is at least partially defined by the inner wall, a heater for heating fluid in the fluid flow path and, a thermistor for measuring the temperature of fluid between the heater and the fluid outlet, wherein the thermistor is retained with respect to a housing and the housing forms part of the inner wall. The housing may comprise a base that engages with the inner wall. The housing may further comprise an arm wherein the arm supports the thermistor and extends radially inwards of the inner wall. The housing may comprise two arms and the thermistor is suspended between the two arms. The inner wall may comprise an aperture into which the housing is inserted.

6. 发明公开

EP3089277A4 IN-VEHICLE ELECTRONIC MODULE 有权转让
标题翻译： EINEM FAHRZEUG的ELEKTRONISCHE VORRICHTUNG
公开(公告)号：EP3089277A4
公开(公告)日：2017-08-23
申请号：EP14874519
申请日：2014-11-17
申请人： HITACHI AUTOMOTIVE SYSTEMS LTD
发明人： KAJIWARA RYOUICHI , KAMOSHIDA MASARU , ISHII TOSHIAKI
IPC分类号： H01R13/03 , B23K1/00 , B23K1/08 , B23K35/02 , B23K35/22 , B23K35/26 , H05K1/09 , H05K1/11 , H05K3/28 , H05K3/34 , H05K5/00
CPC分类号： H05K5/0069 , B23K1/0016 , B23K1/08 , B23K35/0222 , B23K35/0244 , B23K35/226 , B23K35/26 , B23K35/262 , H05K1/117 , H05K3/282 , H05K3/3405 , H05K3/3463 , H05K5/003 , H05K5/0034 , H05K2201/015 , H05K2201/10189 , H05K2201/2045 , H05K2203/122
摘要： There is a problem that contact resistance increases due to formation of an oxide film on a contact interface or biting of abrasion powder caused by micro-sliding when a contact connecting portion of a connection terminal including non-noble metal members is exposed to high temperature environment or a repetitious temperature cycle. An object of the present invention is to provide an in-vehicle electronic module that has connection reliability equivalent to that of the conventional in-vehicle electronic module even when being placed in the environment of an engine compartment and can achieve cost reduction by reducing the number of parts and assembly steps. The electronic module includes a mounting board having a circuit board on which an electronic component is mounted, and a case member for accommodating and protecting the mounting board from surrounding environment, The electronic module has a connection structure in which a portion of the circuit board is protruded to the outside through an opening of the case and inserts a board terminal into an external female connector to obtain electrical continuity, and a portion of the case member forms a connector housing that receives the female connector and isolates a space in which the board terminal is present from surrounding environment and an insulating resin member for fixing the circuit board in the case is integrally molded or joined with the circuit board.
摘要翻译：当包括非贵金属构件的连接端子的接触连接部分暴露于高温环境时，存在由于在接触界面上形成氧化膜而导致接触电阻增加或由微滑动引起的磨损粉末咬入的问题或重复的温度循环。本发明的目的是提供一种车载电子模块，即使在将其放置在发动机舱的环境中时也具有与常规车载电子模块相同的连接可靠性，并且可以通过减少数量零件和组装步骤。电子模块包括：安装板，其具有其上安装电子部件的电路板以及用于容纳并保护安装板免受周围环境影响的壳体部件;电子模块具有连接结构，其中电路板的一部分是通过壳体的开口突出到外部，并且将电路板端子插入到外部母连接器中以获得电连续性，并且壳体构件的一部分形成连接器壳体，该连接器壳体接收母连接器并且隔离电路板端子存在于周围环境中，并且用于将电路板固定在壳体中的绝缘树脂构件与电路板一体地模制或接合。

7. 发明公开

EP2858184A1 Electronic assembly and method of manufacturing same 审中-公开
标题翻译：电子组件及其制造方法
公开(公告)号：EP2858184A1
公开(公告)日：2015-04-08
申请号：EP14192508.1
申请日：2008-12-18
申请人： TRW Automotive U.S. LLC
发明人： Blossfeld, Mike , Sanchez, Luis Fernando
IPC分类号： H01R43/16 , H01R43/18 , H05K5/00 , H01R43/20
CPC分类号： H05K5/006 , H01R12/724 , H01R13/41 , H01R13/447 , H01R13/506 , H01R13/6658 , H01R23/7073 , H01R43/16 , H01R43/18 , H01R43/20 , H01R43/205 , H01R2201/26 , H02G3/086 , H02G3/16 , H05K5/003 , H05K5/0047 , H05K5/0052 , H05K5/0239 , H05K7/1428 , Y10S439/941 , Y10T29/49002 , Y10T29/49117 , Y10T29/49204 , Y10T29/49208 , Y10T29/4922 , Y10T29/49222
摘要： An electronic assembly comprises a housing, a cover for the housing, a printed circuit board receivable in the housing, and a compliant pin header assembly. The compliant pin header assembly is mountable in the housing by interengaging features on the header assembly and the housing. The compliant pin header assembly has compliant pins for engaging corresponding features on the printed circuit board to connect the compliant pin header assembly electrically to the printed circuit board. The cover, when the electronic assembly is assembled, engages the housing and also engages the printed circuit board at a location spaced from an outer periphery of the printed circuit board.
摘要翻译：电子组件包括壳体，用于壳体的盖子，可容纳在壳体中的印刷电路板以及兼容的销头组件。顺应式插头组件可通过插头组件和壳体上的相互接合特征而安装在壳体中。顺应针头组件具有顺应针，用于接合印刷电路板上的相应特征以将顺应针头组件电连接到印刷电路板。当组装电子组件时，盖子接合壳体并且还在与印刷电路板的外周间隔开的位置处接合印刷电路板。

8. 发明公开

EP2840667A2 Electronic assembly and method of manufacturing same 有权
标题翻译： Elektronische Anordnung und Verfahren zur Herstellung davon
公开(公告)号：EP2840667A2
公开(公告)日：2015-02-25
申请号：EP14192549.5
申请日：2008-12-18
申请人： TRW Automotive U.S. LLC
发明人： Blossfeld, Mike , Sanchez, Luis Fernando
IPC分类号： H01R13/66 , H01R13/447 , H01R12/72 , H01R13/506 , H01R13/424 , H01R43/20 , H02G3/08
CPC分类号： H05K5/006 , H01R12/724 , H01R13/41 , H01R13/447 , H01R13/506 , H01R13/6658 , H01R23/7073 , H01R43/16 , H01R43/18 , H01R43/20 , H01R43/205 , H01R2201/26 , H02G3/086 , H02G3/16 , H05K5/003 , H05K5/0047 , H05K5/0052 , H05K5/0239 , H05K7/1428 , Y10S439/941 , Y10T29/49002 , Y10T29/49117 , Y10T29/49204 , Y10T29/49208 , Y10T29/4922 , Y10T29/49222
摘要： An electronic assembly comprises a housing, a cover for the housing, a printed circuit board receivable in the housing, and a compliant pin header assembly. The compliant pin header assembly is mountable in the housing by inter-engaging features on the header assembly and the housing. The compliant pin header assembly has compliant pins for engaging corresponding features on the printed circuit board to connect the compliant pin header assembly electrically to the printed circuit board. The cover, when the electronic assembly is assembled, engages the housing and also engages the printed circuit board at a location spaced from an outer periphery of the printed circuit board.
摘要翻译：电子组件包括壳体，用于壳体的盖，可容纳在壳体中的印刷电路板以及柔性针头组件。柔性销头组件可通过插头组件和壳体上的相互接合特征安装在壳体中。兼容的针头组件具有用于接合印刷电路板上的相应特征的柔性销，以将顺应性插头组件电连接到印刷电路板。当电子组件组装时，盖子接合壳体并且还在与印刷电路板的外周边隔开的位置处接合印刷电路板。

9. 发明公开

EP2777072A1 ELEKTRONIKMODUL FÜR EIN STEUERGERÄT 审中-公开
标题翻译： ELEKTRONIKMODULFÜREINSTEUERGERÄT
公开(公告)号：EP2777072A1
公开(公告)日：2014-09-17
申请号：EP12769608.6
申请日：2012-09-04
申请人： Robert Bosch GmbH
发明人： OTT, Harald
IPC分类号： H01L23/053 , H01L23/055 , H01L23/057 , H01L23/10 , H05K5/06
CPC分类号： H05K5/0082 , H01L23/057 , H01L23/10 , H01L2224/48227 , H01L2224/48245 , H01L2224/48247 , H01L2224/49175 , H01L2924/16152 , H05K1/0271 , H05K1/14 , H05K3/368 , H05K5/003 , H05K5/06 , H05K2201/10151 , H05K2203/049 , H01L2924/00
摘要： Electronic module (1) for a vehicle, comprising a covering element (4), a component-carrier printed circuit board element (2), a carrier element (7) having a first side and a second side, a printed circuit board element (3) and at least one contact-connection element (6), designed to provide a conductive contact-connection between component-carrier printed circuit board element (2) and printed circuit board element (3), wherein the covering element (4) and component-carrier printed circuit board element (2) are arranged on the first side of the carrier element (7), characterized in that the printed circuit board element (3) is arranged on the second side of the carrier element (7), the carrier element (7) has at least one opening (21), and the contact-connection element (6) is led through the opening (21).
摘要翻译：一种用于车辆的电子模块包括覆盖元件，部件载体印刷电路板元件，具有第一侧和第二侧的载体元件，印刷电路板元件和至少一个触点连接元件。接触连接元件被配置为在部件载体印刷电路板元件和印刷电路板元件之间提供导电接触连接。覆盖元件和分量载体印刷电路板元件位于载体元件的第一侧上，并且印刷电路板元件位于载体元件的第二侧上。载体元件具有至少一个开口，并且接触连接元件被引导通过开口。

10. 发明授权

EP1494517B1 Gehäuse zur Aufnahme eines Schaltungsträgers 有权
标题翻译：壳体用于容纳电路载体
公开(公告)号：EP1494517B1
公开(公告)日：2005-11-30
申请号：EP03015219.3
申请日：2003-07-04
申请人： Delphi Technologies, Inc.
发明人： Bergmann, Jürgen
IPC分类号： H05K5/00
CPC分类号： H05K5/003

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