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1. 发明公开

EP3366992A1 DEEPWATER LED LIGHTING SEALING STRUCTURE 审中-公开
公开(公告)号：EP3366992A1
公开(公告)日：2018-08-29
申请号：EP15895861.1
申请日：2015-11-09
申请人： Li, Feng
发明人： Li, Feng
IPC分类号： F21V31/00 , F21Y115/10
CPC分类号： F21V31/005 , F21V15/01 , F21V31/00 , F21Y2115/10 , H05K5/0013 , H05K5/065
摘要： A closing structure for a waterproof LED lamp contains: a first casing (10), a light power source (30), and a second casing (20). The light power source (30) is housed in an accommodation groove of a bottom of the first casing (10), and the first casing (10) is in connection with the second casing (20). A first closing film (41) is injection molded on a peripheral side of a first connection surface of the first casing (10) facing to the second casing (20), and a second closing film (42) is injection molded on a peripheral side of a second connection surface of the second casing (20) facing the first casing (10).

2. 发明公开

EP3351068A1 MEDIENDICHTES STEUERGERÄT FÜR EIN KRAFTFAHRZEUG UND VERFAHREN ZUR HERSTELLUNG DES STEUERGERÄTES 有权转让
公开(公告)号：EP3351068A1
公开(公告)日：2018-07-25
申请号：EP16758106.5
申请日：2016-08-16
申请人： Conti Temic Microelectronic GmbH
发明人： WITTMANN, Frieder , BEART, Karin , BOCK, Johannes , SCHMIDT, Thomas , SCHUCH, Bernhard
IPC分类号： H05K5/00
CPC分类号： H05K5/065 , H05K1/142 , H05K1/181 , H05K1/189 , H05K3/284 , H05K5/0017 , H05K5/0082 , H05K5/0247 , H05K5/03 , H05K2201/10015 , H05K2201/1003 , H05K2201/10287 , H05K2201/10371 , H05K2201/10522 , H05K2203/1316 , H05K2203/1327
摘要： The invention relates to a control device in a motor vehicle, comprising: a housing cover (4) which has a peripheral edge region (8); a flat, electrical connecting device (2, 3) which has integrated conductive tracks, the housing cover (4) being materially bonded to the connecting device (2, 3) in the edge region (8) and forming a cavity (9) with the connecting device (2, 3); at least one electronic component (7) within the cavity (9), the connecting device (2, 3) electrically connecting the at least one electronic component (7) to electronic components outside of the cavity (9), wherein the housing cover (4) is overmolded with a polymer (5) in a media-tight manner beyond the peripheral edge region (8).

3. 发明公开

EP3329751A1 ELEKTRONIKMODUL MIT ÜBER SOCKELELEMENT FLEXIBEL PLATZIERBAREM BAUELEMENT UND VERFAHREN ZUM FERTIGEN DESSELBEN 有权转让
公开(公告)号：EP3329751A1
公开(公告)日：2018-06-06
申请号：EP16729514.6
申请日：2016-06-06
申请人： Robert Bosch GmbH
发明人： LISKOW, Uwe
IPC分类号： H05K3/32 , H05K3/28 , H05K3/30 , H05K5/00
CPC分类号： H05K3/284 , H05K1/111 , H05K1/181 , H05K3/301 , H05K3/328 , H05K5/0082 , H05K5/065 , H05K2201/10151 , H05K2201/10189 , H05K2201/105 , H05K2201/10522 , H05K2201/10606 , H05K2201/2072 , H05K2203/1316 , H05K2203/1327
摘要： The invention relates to an electronic module (1) and a method for producing same. The electronic module has a circuit board (3), at least one first component (5), and a socket element (7) which has a first surface (6) and a second surface (8) opposite the first surface and the first surface (6) of which lies on a surface of the circuit board (3) and is fixed to the circuit board. The electronic module has a second component (9) which is secured to the socket element (7) and is electrically connected to the circuit board (3) via the socket element. Furthermore, a protective compound (11) is provided which is arranged on the surface of the circuit board (3) and encapsulates the first component (5). The electronic module (1) is characterized in that the socket element (7) is partly embedded into the protective compound (11) such that lateral flanks (10) of the socket element (7) are covered by the protective compound (11), and the second surface (8) of the socket element (7) protrudes out of the protective compound (11) in an exposed manner. Connection elements (19) of the socket element (7) and connections (17) of the second component (9) can be connected preferably via a welding connection (17) and can be encapsulated by a protective compound (21) or a cover. Second components (9), such as sensors or plugs for example, can thereby be attached to the circuit board (3) in a mechanically secured and electrically reliable manner. Because standard components and standard assembly methods can be used, changes to the design of the electronic module can be implemented easily and quickly.

4. 发明授权

EP2888330B1 HAFTKLEBEMASSE INSBESONDERE ZUR KAPSELUNG EINER ELEKTRONISCHEN ANORDNUNG 有权转让
公开(公告)号：EP2888330B1
公开(公告)日：2017-06-21
申请号：EP13735003.9
申请日：2013-07-04
申请人： tesa SE
发明人： KEITE-TELGENBÜSCHER, Klaus , ELLINGER, Jan
IPC分类号： C09J127/16 , C09K3/10 , H05K5/06 , H01L51/52 , G02F1/1339 , C08L27/16 , C08L93/04
CPC分类号： C09J127/12 , C08K3/22 , C08K11/00 , C08K2003/222 , C08L27/16 , C09J127/16 , H01L51/5253 , H01L2924/0002 , H05K5/065 , H01L2924/00

5. 发明授权

EP1736041B1 A HOUSING FOR A CIRCUIT THAT IS TO BE IMPLANTED IN-VIVO AND PROCESS OF MAKING THE SAME 有权
标题翻译：体内SCHALTKREISVERKAPPUNG IS生产同样植入过程
公开(公告)号：EP1736041B1
公开(公告)日：2013-06-12
申请号：EP05731370.2
申请日：2005-04-07
申请人： Senseonics, Incorporated
发明人： COLVIN, JR, Arthur E. , LORENZ, Carrie R. , O'CONNOR, Casey J. , WALTERS, Steven J.
IPC分类号： H05K5/06 , A61B5/00
CPC分类号： A61B5/0031 , H05K5/065

6. 发明公开

EP2259670A3 A housing for a circuit that is to be implanted in-vivo and process of making the same 审中-公开
标题翻译：住房的电路，体内生产该植入过程
公开(公告)号：EP2259670A3
公开(公告)日：2011-04-06
申请号：EP10182071.0
申请日：2005-04-07
申请人： Sensors for Medicine and Science, Inc.
发明人： Colvin, JR., Arthur E. , Lorenz, Carrie R. , O'Connor, Casey J. , Walters, Steven J.
IPC分类号： H05K5/06 , A61B5/00
CPC分类号： A61B5/0031 , H05K5/065
摘要： The present invention provides a biocompatible circuit assembly that includes a circuit encased within a housing. In some embodiments, the housing is a PMMA housing and before the circuit is enclosed within the housing the circuit is encased within a brick of epoxy.
摘要翻译：本发明提供了生物相容的电路组件确实包括外壳内包封的电路。在一些实施例中，壳体是PMMA壳体和电路被包围于外壳内之前该电路被环氧树脂的砖内包住。

7. 发明公开

EP2164312A1 ELECTRIC APPARATUS UNIT 有权
标题翻译：电气设备单元
公开(公告)号：EP2164312A1
公开(公告)日：2010-03-17
申请号：EP08764868.9
申请日：2008-05-29
申请人： Daikin Industries, Ltd.
发明人： YOSHIMOTO, Akio , TANAKA, Mitsuhiro
IPC分类号： H05K5/00 , H05K7/20
CPC分类号： H05K5/0034 , H05K3/284 , H05K5/006 , H05K5/061 , H05K5/065 , H05K7/1417 , H05K7/142 , H05K7/20418 , H05K2201/2018 , H05K2203/1316 , H05K2203/1581
摘要： The present invention is an electrical equipment unit capable of reducing the accuracy of a mold. A substrate (1) includes a pair of surfaces (1a, 1b) opposing to each other in a direction (D). First electronic components (2) are provided on one surface (1a). Second electronic components (3) lower than a maximum value of the height of the first electronic components (2) in a direction (D) are provided on the other surface (1b). Insulating resin (5) includes a covering part (5b) adhering and covering the second electronic components (3) and the other surface (1b), and side surface part (5a) extending from the periphery of the substrate (1) to a side of the second electronic components (2) along the direction (D). A lid (6) covers the first electronic components (2) from an opposite side of the substrate (1), and is fixed to the side surface part (5a) from the opposite side of the substrate (1).

8. 发明公开

EP2136612A1 Method for manufacturing water-proof electronic device 审中-公开
标题翻译： Verfahren zur Herstellung einer wasserdichten elektronischen Vorrichtung
公开(公告)号：EP2136612A1
公开(公告)日：2009-12-23
申请号：EP08158480.7
申请日：2008-06-18
申请人： ACA Digital Corporation
发明人： Pai, Chun-Chung
IPC分类号： H05K5/06
CPC分类号： H05K5/062 , H05K5/065
摘要： A method being applied to manufacture a water-proof electronic device is disclosed in the present invention. In the method, at least one inner component (31, 32, 33) is assembled into at least one water-proof shell (1, 2) to form at least one sub-assembly (100), which has a first water-proof portion (12) and a water-permeable portion (11 combining with 2); a injection molding die (5) is fitted around the water-permeable portion; and an injection molding treatment is executed for the injection molding die (5) with the water-permeable portion therein to form a second water-proof portion (6); and then the injection molding die (6) is removed after a cooling process, so as to manufacture the water-proof electronic device (200) with the first water-proof portion and the second water-proof portion.
摘要翻译：在本发明中公开了一种用于制造防水电子装置的方法。在该方法中，至少一个内部部件（31,32,33）组装成至少一个防水外壳（1,2）以形成至少一个子组件（100），其具有第一防水部分（12）和透水部分（11与2结合）; 注射成型模具（5）装配在透水部分周围; 对该注射成型模具（5）进行注射成型处理，其中透水部分形成第二防水部分（6）; 然后在冷却过程之后移除注射成型模具（6），以便制造具有第一防水部分和第二防水部分的防水电子装置（200）。

9. 发明公开

EP1903845A2 Electronics enclosure and method of fabricating an electronics enclosure 审中-公开
标题翻译：一种用于电子设备的壳体的电子装置及其制造方法壳体
公开(公告)号：EP1903845A2
公开(公告)日：2008-03-26
申请号：EP07075795.0
申请日：2007-09-12
申请人： Delphi Technologies, Inc.
发明人： Lawlyes, Daniel A.
IPC分类号： H05K5/00 , H05K5/02 , H05K5/06
CPC分类号： H05K5/0034 , H05K5/0082 , H05K5/065 , Y10S439/936
摘要： A device (10) for enclosing electronics and providing an electrical connection to the enclosed electronics is provided. The device (10) includes a housing (14) having alignment and barrier features (16,18), and a circuit board (20) having alignment features (28) and plated through-holes (22). The circuit board (20) is coupled to the housing (14) such that the alignment features (28,16) of the circuit board (20) and housing (14) are aligned, and such that the barrier features (18) of the housing (14) are located adjacent the plated through-holes (22). The device further includes an epoxy material (40) that at least partially coats the surfaces of the housing (14) and circuit board (20). The barrier features (18) separate the plated through-holes (22) from the epoxy material (40), such that the epoxy material (40) is not in contact with the interior surface of the plated through-holes (22). A method for enclosing electronics and providing an electrical connection to the enclosed electronics is also provided.
摘要翻译：一种用于封闭电子设备和所述封闭电子的电连接的提供装置（10）设置。的装置（10）包括一个壳体（14）具有对准和屏障功能（16,18），以及具有对准特征（28）的电路板（20）和电镀通孔（22）。的所述电路板（20）联接到所述壳体（14）做了检查所述电路板（20）和壳体（14）的对准特征（28,16）被对齐，并且这样做的屏障功能（18）壳体（14）被定位成邻近所述电镀通孔（22）。该装置包括在另外的环氧材料（40）做了至少部分地覆盖所述外壳（14）和电路板（20）的表面上。屏障功能（18）分开的环氧树脂材料（40）的电镀通孔（22）检测所做的环氧树脂材料（40）是不与电镀通孔（22）的内表面接触。因此本发明提供一种用于封闭电子设备和所述封闭电子的电连接的提供方法。

10. 发明授权

EP1093706B1 GEHÄUSE FÜR EINE ELEKTRONIK-EINHEIT, INSBESONDERE FÜR EIN AIRBAG-STEUERGERÄT 有权
标题翻译：外壳的电子设备，特别是对于气囊控制单元
公开(公告)号：EP1093706B1
公开(公告)日：2002-09-25
申请号：EP99945937.3
申请日：1999-07-07
申请人： TRW Automotive Electronics & Components GmbH & Co. KG
发明人： PETER, Cornelius , JOHN, Harry
IPC分类号： H05K9/00 , B60R16/02 , H05K5/00 , B29C45/14 , B32B3/24
CPC分类号： B60R16/0239 , H05K5/062 , H05K5/065 , H05K9/0049
摘要： The invention relates to a housing (1) for an electronics unit, especially for an airbag control unit, whereby at least the metal walls of the housing are provided with a moisture repellent coating. The inventive housing is made of bent, interconnecting sheet metal elements that are extrusion-coated with plastic (4) on at least one side.

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