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1. 发明公开

EP2850649A1 THREE-DIMENSIONAL MODULES FOR ELECTRONIC INTEGRATION 审中-公开
标题翻译：电子集成的三维模块
公开(公告)号：EP2850649A1
公开(公告)日：2015-03-25
申请号：EP13790666.5
申请日：2013-05-09
申请人： Eagantu Ltd.
发明人： DAKHIYA, Michael , SHAKED, Eran
IPC分类号： H01L21/00
CPC分类号： H05K1/0284 , H01L23/13 , H01L23/15 , H01L23/5381 , H01L23/5383 , H01L23/5384 , H01L25/0652 , H01L25/105 , H01L2224/16225 , H01L2924/1461 , H01L2924/15156 , H01L2924/15311 , H01L2924/1627 , H05K1/144 , H05K1/183 , H05K3/306 , H05K3/32 , H05K3/36 , H05K3/4697 , H05K2203/16 , H05K2203/171 , Y10T29/49004 , Y10T29/49126 , Y10T29/4913 , Y10T29/49139 , Y10T29/53022 , H01L2924/00
摘要： An electronic module (20, 39, 60, 80, 132, 140, 144) includes a substrate (21), which includes a dielectric material having a cavity (40, 42, 134, 142) formed therein. First conductive contacts (44) within the cavity are configured for contact with at least one first electronic component (32) that is mounted in the cavity. Second conductive contacts (44) on a surface of the substrate that surrounds the cavity are configured for contact with at least a second electronic component (28, 30) that is mounted over the cavity. Conductive traces (36, 48) within the substrate are in electrical communication with the first and second conductive contacts.
摘要翻译：电子模块（20,39,60,80,132,140,144）包括衬底（21），该衬底包括具有在其中形成的空腔（40,42,134,142）的电介质材料。空腔内的第一导电触点（44）被配置用于与安装在空腔中的至少一个第一电子部件（32）接触。围绕腔体的基板表面上的第二导电触点（44）被配置用于与安装在腔体上的至少第二电子部件（28,30）接触。衬底内的导电迹线（36,48）与第一和第二导电触点电连通。

2. 发明公开

EP3229565A1 SUBSTRATE UNIT AND METHOD OF MANUFACTURING SUBSTRATE UNIT 审中-公开
标题翻译：基板单元和制造基板单元的方法
公开(公告)号：EP3229565A1
公开(公告)日：2017-10-11
申请号：EP17165397.5
申请日：2017-04-07
申请人： Azbil Corporation
发明人： NAGOYA, Hiroaki
IPC分类号： H05K3/28 , H05K1/02
CPC分类号： H05K1/0209 , H05K1/0262 , H05K3/0091 , H05K3/284 , H05K7/205 , H05K7/209 , H05K2201/062 , H05K2201/068 , H05K2201/10174 , H05K2203/125 , H05K2203/16
摘要： To improve a substrate unit in which safety maintaining devices are mounted on a wiring substrate while suppressing manufacturing costs.
A substrate unit includes a wiring substrate, electronic components as safety maintaining devices arranged on the wiring substrate, plural metal components arranged on the wiring substrate at distances from the electronic components as the safety maintaining devices so as to satisfy a requirement for an intrinsically safe explosion-proof construction, and a resin film covering at least one of the plural metal components and the electronic components as the safety maintaining devices on the wiring substrate, in which the resin film has a thermal conductivity of at least 1.0W/mk and a dielectric breakdown strength of at least 3.0kV/mm.
摘要翻译：为了改善其中安全保持装置被安装在布线基板上的基板单元，同时抑制制造成本。基板单元包括布线基板，布置在布线基板上的作为安全维护装置的电子部件，布置在布线基板上与电子部件相距一定距离的多个金属部件作为安全维护装置，以满足本质安全爆炸的要求以及覆盖多个金属部件和电子部件中的至少一个的树脂膜，作为布线基板上的安全保持装置，其中树脂膜具有至少1.0W / mk的导热率和电介质击穿强度至少为3.0kV / mm。

3. 发明公开

EP3163984A1 PRE-TIN SHAPING SYSTEM AND METHOD 有权
标题翻译： VORVERZINNUNGSFORMUNGSSYSTEM UND VERFAHREN
公开(公告)号：EP3163984A1
公开(公告)日：2017-05-03
申请号：EP16195933
申请日：2016-10-27
申请人： TYCO ELECTRONICS (DONGGUAN) LTD , TYCO ELECTRONICS (SHANGHAI) CO LTD , SHENZHEN AMI TECH CO LTD , TE CONNECTIVITY GERMANY GMBH
发明人： SHEN HONGZHOU , ZHANG DANDAN , ZENG QINGLONG , LU ROBERTO FRANCISCO-YI , DUBNICZKI GEORGE
IPC分类号： H05K1/11 , C25D5/50 , H05K3/34
CPC分类号： H05K3/403 , B23K1/0016 , B23K1/20 , B23K3/08 , H05K1/117 , H05K3/101 , H05K3/3405 , H05K2201/09381 , H05K2201/09745 , H05K2201/10287 , H05K2203/0165 , H05K2203/0195 , H05K2203/0278 , H05K2203/0392 , H05K2203/1105 , H05K2203/16
摘要： The present disclosure discloses pre-tin system shaping system and method. The pre-tin shaping system is adapted to shape a pre-tin on a pad (5) of a circuit board (4). The pre-tin shaping system includes: a board holding unit (2) for securely holding the circuit board; a heat-press unit (1) for performing a heat-press operation to the pre-tin on the pad of the circuit board so as to shape the pre-tin; and a motion unit (3) for moving the heat-press unit relative to the board holding unit; wherein the heat-press unit includes a heat presser (10) for shaping the pre-tin on the pad of the circuit board. With the pre-tin system shaping system and method provided herein, by performing a shaping operation to the pre-tin on the pad of the circuit board, position of an electrical contact on the pad of the circuit board during soldering will be precisely controlled, thereby guaranteeing soldering quality and reducing a risk of dry joint or faulty joint and the like.
摘要翻译：本公开公开了预锡系统整形系统和方法。预锡成形系统适于在电路板（4）的衬垫（5）上成形预锡。预锡成形系统包括：用于牢固地保持电路板的板保持单元（2）热压单元（1），用于对电路板的焊盘上的预锡进行热压操作以对预锡进行成形; 和用于相对于所述板保持单元移动所述热压单元的运动单元（3）其中所述热压单元包括用于在所述电路板的所述焊盘上成形所述预锡的热压器（10）。利用此处提供的预锡系统成形系统和方法，通过对电路板的焊盘上的预锡执行成形操作，焊接期间电接触垫在电路板的焊盘上的位置将被精确控制，从而保证了焊接质量并降低了干接点或有缺陷的接点等的风险。

4. 发明公开

EP2800965A1 INKJETSYSTEM FOR PRINTING A PRINTED CIRCUIT BOARD 有权
标题翻译： TINTENSTRAHLSYSTEM ZUM BEDRUCKEN EINER LEITERPLATTE
公开(公告)号：EP2800965A1
公开(公告)日：2014-11-12
申请号：EP12821205.7
申请日：2012-12-28
申请人： MuTracx B.V.
发明人： ZWIERS, Henk Jan , JANSSEN, Jacobus Hendricus Johannes , VEERMAN, Joost Anne
IPC分类号： G01N21/956 , G06T7/00 , H05K5/00 , H05K3/06
CPC分类号： H05K3/125 , B05B1/08 , B05B12/16 , B05B13/0221 , B41J2/16538 , B41J2/16544 , B41J2/2132 , B41J25/001 , G01N21/95607 , G01N2021/95615 , H01L21/288 , H01L22/12 , H01L23/544 , H01L2924/0002 , H05K1/092 , H05K3/0079 , H05K3/061 , H05K3/22 , H05K2203/013 , H05K2203/1461 , H05K2203/1563 , H05K2203/1572 , H05K2203/16 , H05K2203/162 , H05K2203/163 , H01L2924/00
摘要： A printing process for printing an ink pattern on a substrate is provided. The ink pattern to be printed is based on an available pattern layout. The pattern layout is separated in into at least one discrete contour layer comprising at least one contour (C) part and at least one discrete inner region layer comprising at least one inner region (F) part. The contour part has an orientation in an imaginary plane including a first (X) and second (Y) axis. The first axis is defined with respect to the ink jet system as extending in a direction perpendicular to a direction of movement of a linear movable substrate positioning stage. The second axis is oriented perpendicular to the first axis. A contour part in the contour layer is printed by contour droplets prior to printing an inner region of the pattern layout by fill-in droplets.
摘要翻译：提供了在基板上印刷（P）油墨图案的印刷方法。要打印的油墨图案基于可用的图案布局（R）。图案布局定义了要打印的墨水图案的期望布局。基于图案布局，生成用于分配墨图案的点位置的输入图像（rii）。打印处理包括将扫描（S）图像（rsi）与输入图像进行比较以执行质量检查（Q）以检测印刷油墨图案中的任何打印缺陷的步骤。打印过程包括对印刷的墨水图案的批准或拒绝提供决定（os）的步骤。在批准的情况下，可以将衬底提供给后续处理站（E）以最终确定衬底。在排斥的情况下，包含印刷缺陷的基材可以再循环（D）。

5. 发明授权

EP2932809B1 PORTABLE EQUIPMENT FOR MONITORING AND CONTROLLING THE LEVEL OF OXYGEN IN REFLOW OVEN ATMOSPHERE 有权
公开(公告)号：EP2932809B1
公开(公告)日：2018-09-12
申请号：EP13795509.2
申请日：2013-11-26
申请人： L'Air Liquide Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude
发明人： RODRIGUES, Luiz Felipe , NERYZ, Maicon Renan
IPC分类号： H05K3/34 , B23K35/38
CPC分类号： B23K35/383 , B23K1/0016 , B23K1/012 , B23K3/082 , B23K35/38 , H05K3/34 , H05K3/3494 , H05K2203/086 , H05K2203/16 , H05K2203/163
摘要： The present invention describes a portable device for monitoring and controlling the level of residual oxygen in reflow oven atmosphere (1). This referred equipment is able to determine the quality of the atmosphere of a reflow oven, using parameters predetermined by the user. Therefore, the equipment performs the monitoring of the reflow oven atmosphere (1) controlling the level of residual oxygen of the reflow oven (1) by increasing or decreasing of the feed flow rate of nitrogen by the control that the microcontroller exerts over the proportional valve of nitrogen flow control (9), by opening or closing the valves to kept such predetermined values.

6. 发明公开

EP3171678A1 CIRCUIT BOARDS AND CIRCUIT BOARD ASSEMBLIES 审中-公开
标题翻译：电路板和电路板组件
公开(公告)号：EP3171678A1
公开(公告)日：2017-05-24
申请号：EP16198932.2
申请日：2016-11-15
申请人： Hamilton Sundstrand Corporation
发明人： LIN, Tran
IPC分类号： H05K1/02 , H05K3/34
CPC分类号： H05K1/0268 , G01R31/026 , G01R31/046 , H01L23/15 , H01L23/3675 , H01L23/49827 , H01L23/50 , H05K1/0206 , H05K1/0215 , H05K1/111 , H05K1/181 , H05K3/225 , H05K3/3421 , H05K2201/094 , H05K2201/10628 , H05K2201/10689 , H05K2203/16 , H05K2203/162 , Y02P70/613
摘要： A printed circuit board includes a body and a belly pad seated within with the body. The belly pad (108) is electrically separated into a first pad (110) and a second pad (112). The first pad and the second pad are arranged to be electrically connected to one another by an interconnect (106) electrically connecting the belly pad to a conductive plane (126) of an electrical component, thereby allowing continuity testing across an interface between the first pad and the interconnect.
摘要翻译：印刷电路板包括主体和坐在主体内的腹垫。腹垫（108）电分离成第一垫（110）和第二垫（112）。第一衬垫和第二衬垫布置成通过将腹部衬垫电连接到电部件的导电平面（126）的互连件（106）彼此电连接，从而允许穿过第一衬垫之间的界面的连续性测试和互连。

7. 发明公开

EP3089562A1 PCB PROCESSING METHOD AND PCB 有权
标题翻译： VERARBEITUNGSVERFAHRENFÜRLEITERPLATTE UND LEITERPLATTE
公开(公告)号：EP3089562A1
公开(公告)日：2016-11-02
申请号：EP14875182.9
申请日：2014-05-21
申请人： ZTE Corporation
发明人： YI, Bi , MA, Fengchao , REN, Yonghui , XIONG, Wang , WANG, Yingxin
IPC分类号： H05K1/00 , H05K3/04
CPC分类号： H05K1/0298 , H05K1/09 , H05K1/115 , H05K3/0047 , H05K3/424 , H05K3/429 , H05K3/4611 , H05K3/4623 , H05K2201/10303 , H05K2203/0207 , H05K2203/16
摘要： The present invention discloses a PCB processing method and a PCB. The method includes: respectively carrying out laminating processing on a plurality of PCB daughter boards constituting a PCB according to PCB design requirements, and drilling and electroplating the top-most PCB daughter board to form a via hole; and laminating the plurality of PCB daughter boards together to form the PCB, and drilling and electroplating the formed PCB to form a through hole for mounting a connector, wherein a blind hole for mounting a connector is formed by the via hole, and a depth of the blind hole is greater than or equal to the length of a signal pin of the connector. By virtue of the technical scheme of the present invention, a space between wafers of the lower layer of PCBs may be doubled, and the space for layout between wafers may be doubled.
摘要翻译：本发明公开了一种PCB处理方法和PCB。该方法包括：根据PCB设计要求分别在构成PCB的多个PCB子板上进行层压处理，以及对最顶层PCB子板进行钻孔和电镀以形成通孔; 并且将多个PCB子板层压在一起以形成PCB，并且对所形成的PCB进行钻孔和电镀以形成用于安装连接器的通孔，其中用于安装连接器的盲孔由通孔形成，并且深度盲孔大于或等于连接器的信号引脚的长度。由于本发明的技术方案，PCB的下层的晶片之间的空间可以加倍，并且晶片之间的布局空间可以加倍。

8. 发明公开

EP3089562A4 PCB PROCESSING METHOD AND PCB 有权
公开(公告)号：EP3089562A4
公开(公告)日：2017-10-11
申请号：EP14875182
申请日：2014-05-21
申请人： ZTE CORP
发明人： YI BI , MA FENGCHAO , REN YONGHUI , XIONG WANG , WANG YINGXIN
IPC分类号： H05K3/46 , H05K1/11 , H05K3/42
CPC分类号： H05K1/0298 , H05K1/09 , H05K1/115 , H05K3/0047 , H05K3/424 , H05K3/429 , H05K3/4611 , H05K3/4623 , H05K2201/10303 , H05K2203/0207 , H05K2203/16

9. 发明公开

EP2850649A4 THREE-DIMENSIONAL MODULES FOR ELECTRONIC INTEGRATION 审中-公开
标题翻译：三MODULE FOR电子一体化
公开(公告)号：EP2850649A4
公开(公告)日：2015-12-23
申请号：EP13790666
申请日：2013-05-09
申请人： EAGANTU LTD
发明人： DAKHIYA MICHAEL , SHAKED ERAN
IPC分类号： H01L21/00 , H01L23/00 , H01L23/13 , H01L23/15 , H01L23/538 , H01L25/065 , H01L25/10 , H05K1/02 , H05K1/14 , H05K3/36
CPC分类号： H05K1/0284 , H01L23/13 , H01L23/15 , H01L23/5381 , H01L23/5383 , H01L23/5384 , H01L25/0652 , H01L25/105 , H01L2224/16225 , H01L2924/1461 , H01L2924/15156 , H01L2924/15311 , H01L2924/1627 , H05K1/144 , H05K1/183 , H05K3/306 , H05K3/32 , H05K3/36 , H05K3/4697 , H05K2203/16 , H05K2203/171 , Y10T29/49004 , Y10T29/49126 , Y10T29/4913 , Y10T29/49139 , Y10T29/53022 , H01L2924/00

10. 发明公开

EP2932809A1 PORTABLE EQUIPMENT FOR MONITORING AND CONTROLLING THE LEVEL OF OXYGEN IN REFLOW OVEN ATMOSPHERE 审中-公开
标题翻译：便携式设备在回流炉气氛监测和氧含量控制
公开(公告)号：EP2932809A1
公开(公告)日：2015-10-21
申请号：EP13795509.2
申请日：2013-11-26
申请人： L'Air Liquide Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude
发明人： RODRIGUES, Luiz Felipe , NERYZ, Maicon Renan
IPC分类号： H05K3/34 , B23K35/38
CPC分类号： B23K35/383 , B23K1/0016 , B23K1/012 , B23K3/082 , B23K35/38 , H05K3/34 , H05K3/3494 , H05K2203/086 , H05K2203/16 , H05K2203/163
摘要： The present invention describes a portable device for monitoring and controlling the level of residual oxygen in reflow oven atmosphere (1). This referred equipment is able to determine the quality of the atmosphere of a reflow oven, using parameters predetermined by the user. Therefore, the equipment performs the monitoring of the reflow oven atmosphere (1) controlling the level of residual oxygen of the reflow oven (1) by increasing or decreasing of the feed flow rate of nitrogen by the control that the microcontroller exerts over the proportional valve of nitrogen flow control (9), by opening or closing the valves to kept such predetermined values.

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