专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

EP3008979A1 CIRCUIT IMPRIME A STRUCTURE MULTICOUCHE A FAIBLES PERTES DIELECTRIQUES ET REFROIDI 有权
标题翻译：与低介电损耗风冷多层电路板
公开(公告)号：EP3008979A1
公开(公告)日：2016-04-20
申请号：EP14728590.2
申请日：2014-06-10
申请人： Thales
发明人： BONNET, Sébastien , VERDEYME, Serge , CAMPOVECCHIO, Michel , DRAVET, Alain , LIENHART, Marc-Yves
IPC分类号： H05K1/02 , H05K3/46
CPC分类号： H05K1/0203 , H05K1/0204 , H05K1/0237 , H05K1/115 , H05K1/183 , H05K3/0011 , H05K3/40 , H05K3/4623 , H05K3/4644 , H05K3/4697 , H05K2201/09072 , H05K2201/09845 , H05K2201/10416 , H05K2201/1056
摘要： The invention relates to the field of printed boards, and more specifically a printed circuit with a multi-layer structure. According to the invention, the printed circuit (100) with a multi-layer structure comprises: - a first layer (1) machined to form a spotface passing through the layer, - a second layer (2) comprising a first cavity (23) passing through the layer, - a third layer (3) comprising, on one face, an electronic component (33) such that it is in the first cavity, - a fourth layer (4) comprising a second cavity (43), - a heat conducting element with two parts: o one (13) made from metal called a thermal cover, inserted into the spotface (18) of the first layer so as to mechanically and electrically close the first cavity, o the other (14) made from a dielectric material with heat conduction >30W/(m.K), placed in the first cavity so as to be in contact with the electronic component.

2. 发明公开

EP2753159A4 LAMINATED SINTERED CERAMIC WIRING SUBSTRATE, AND SEMICONDUCTOR PACKAGE CONTAINING WIRING SUBSTRATE 审中-公开
标题翻译：叠层陶瓷GESINTERTERS配线基板和半导体封装的布线基板
公开(公告)号：EP2753159A4
公开(公告)日：2016-01-27
申请号：EP11871755
申请日：2011-08-29
申请人： NGK INSULATORS LTD
发明人： TANI MAKOTO , HIRAI TAKAMI , YANO SHINSUKE , TANABE DAISHI
IPC分类号： H05K3/46 , H01L23/498 , H01L23/522 , H01L23/528 , H05K1/02
CPC分类号： H05K3/4629 , H01L23/49822 , H01L23/49838 , H01L23/5283 , H01L2924/0002 , H05K1/0242 , H05K3/4623 , H05K2201/09227 , H05K2201/09236 , H05K2201/098 , H05K2201/09827 , H01L2924/00
摘要： In the laminated and sintered ceramic circuit board according to the present invention, at least a portion of the inplane conductor is fine-lined. Nevertheless, as described above, by means of the configuration that the shape of the cross-section of the fine-lined inplane conductor is trapezoid, and the height (a), the length (c) of the lower base and the length (d) of the upper base of the trapezoidal cross-section, and the interval (b) between the lower bases of the trapezoidal cross-section of the inplane conductors adjacent in a plane parallel to the principal surfaces of the board meet a certain relation, problems such as frequent occurrences of open of wiring (disconnection) and decrease in reliability under high temperature and high humidity environment can be suppressed. Namely, the present invention provides a laminated ceramic circuit board with low open failure rate, short-circuit failure rate and high reliability against high temperature and high humidity, in spite of its fine-lined wiring layer. In addition, the present invention provides a fast, downsized and short-in-height (thin) semiconductor package with high reliability by using such a circuit board.

3. 发明公开

EP2792223A1 PROCÉDÉ DE RÉALISATION DE CARTE IMPRIMÉE 审中-公开
标题翻译： PROCÉDÉDERÉALISATIONDE CARTEIMPRIMÉE
公开(公告)号：EP2792223A1
公开(公告)日：2014-10-22
申请号：EP12806408.6
申请日：2012-12-11
申请人： Thales
发明人： LEDAIN, Bernard , HENRIOT, Dominique , KERTESZ, Philippe
IPC分类号： H05K3/46
CPC分类号： H05K3/4623 , H05K1/0313 , H05K1/09 , H05K1/115 , H05K3/4614 , H05K2201/0129 , H05K2201/041 , H05K2201/10378 , H05K2203/063 , Y10T29/49124
摘要： The invention relates to a process for producing a printed circuit board comprising at least two elementary circuits (CE1, CE2) drilled with metallised holes (T
CE1 ) the apertures of which are covered with a first metal and at least one first intermediate layer (Cl1) made of a compressible material drilled with holes (T
C11 ) opposite elementary circuits (CE1, CE2) and the apertures of which are covered with a second metal, said first intermediate layer (Cl1) being placed between the two elementary circuits (CE1, CE2) and brazed to each of the circuits (CE1, CE2) by thermal diffusion of two metals forming an alloy at an alloy formation temperature (T). At least two second intermediate thermoplastic layers (CI2a, CI2b) having a melting point (Tf) above the alloy formation temperature (T) are provided between the first intermediate layer (Cl1) and said elementary circuits (CE1, CE2), these second layers not covering the first and second metal.
摘要翻译：本发明涉及一种用于制造印刷电路板的方法，该印刷电路板包括至少两个钻有金属化孔（T CE1）的基本电路（CE1，CE2），其孔隙用第一金属和至少一个第一中间层（C1 1 ）由可钻孔的可压缩材料制成，所述可钻孔具有与基本电路（CE1，CE2）相对的孔（T C11）并且其孔隙被第二金属覆盖，所述第一中间层（C1 1）位于两个基本电路（CE1， CE2）并且通过在合金形成温度（T）下形成合金的两种金属的热扩散钎焊到每个电路（CE1，CE2）。在第一中间层（Cl1）和所述基本电路（CE1，CE2）之间提供具有高于合金形成温度（T）的熔点（Tf）的至少两个第二中间热塑性塑料层（CI2a，CI2b），这些第二层不覆盖第一和第二金属。

4. 发明公开

EP2658356A1 MANUFACTURING METHOD FOR PRINTED CIRCUIT BOARD WITH INSULATED MICRO RADIATOR 审中-公开
标题翻译： HERSTELLUNGSVERFAHRENFÜRBESTÜCKTELEITERPLATTEN MIT EINEM ISOLIERTENMIKROHEIZKÖRPER
公开(公告)号：EP2658356A1
公开(公告)日：2013-10-30
申请号：EP11850812.6
申请日：2011-01-06
申请人： Rayben Technologies (Zhu Hai) Ltd
发明人： WANG, Zheng
IPC分类号： H05K3/46
CPC分类号： H05K1/0204 , H01L33/642 , H05K3/4623 , H05K2201/0187 , H05K2201/10106 , H05K2203/063
摘要： The invention relates to a manufacturing method for a printed circuit board (PCB) with an insulated micro radiator. Comparing with the manufacturing method for a conventional PCB, the method adds a step that: one or more one high thermal conductivity insulated micro radiators in cylindrical shape is embedded into the PCB, and heating component is provided on the top copper pattern of one or a number of insulated micro radiators. The invention combines the high thermal conductivity insulated micro radiator with a conventional rigid PCB. The PCB has the advantages of high thermal conductivity and heat transfer stability of the insulated micro radiator as well as the advantages of flexible routing and reliable electrical connection of the conventional PCB. Moreover, it can transmit the heat generated by the heating components such as LED components and so on out of the PCB during operation, timely and effectively. Therefore, it is an ideal carrier board for the heating component and an array thereof. The manufacturing method has the advantages of simple, convenience for operation and high productivity.
摘要翻译：本发明涉及一种具有绝缘微型散热器的印刷电路板（PCB）的制造方法。与传统PCB的制造方法相比，该方法增加了一个步骤：将一个或多个圆柱形的高导热绝缘微型散热器嵌入PCB中，并且在一个或多个PCB的顶部铜图案上提供加热部件绝缘微型散热器数量。本发明将高导热绝缘微型散热器与传统的刚性PCB组合在一起。该PCB具有绝缘微型散热器的高导热性和传热稳定性以及传统PCB柔性布线和可靠电连接的优点。此外，可以及时有效地将由LED部件等发热部件产生的热量传送出PCB。因此，它是用于加热部件的理想载体板及其阵列。该制造方法具有操作简便，生产效率高等优点。

5. 发明公开

EP2564677A1 METHODS OF MANUFACTURING PRINTED CIRCUIT BOARDS USING PARALLEL PROCESSES TO INTERCONNECT WITH SUBASSEMBLIES 审中-公开
标题翻译：过程与并行处理生产印刷电路板与组件连接
公开(公告)号：EP2564677A1
公开(公告)日：2013-03-06
申请号：EP10850903.5
申请日：2010-04-30
申请人： DDI Global Corp
发明人： KUMAR, Rajesh , DREYER, Monte, P. , TAYLOR, Michael, J.
IPC分类号： H05K1/16
CPC分类号： H05K3/4623 , H05K3/4069 , H05K3/4617 , H05K2201/09527 , H05K2201/096 , H05K2203/061
摘要： Methods of manufacturing printed circuit boards using parallel processes to interconnect with subassemblies are provided. In one embodiment, the invention relates to a method of manufacturing a printed circuit board including providing a core subassembly including at least one metal layer, providing a plurality of one-metal layer carriers after parallel processing each of the plurality of one-metal layer carriers, and attaching at least two of the plurality of one-metal layer carriers with each other and with the core subassembly.

6. 发明公开

EP2559327A1 VERFAHREN ZUR INTEGRATION EINES ELEKTRONISCHEN BAUTEILS IN EINE LEITERPLATTE SOWIE LEITERPLATTE MIT EINEM DARIN INTEGRIERTEN ELEKTRONISCHEN BAUTEIL 有权
标题翻译：法求解电子部件，电路板和电路板的带有内置集成IT电子元件
公开(公告)号：EP2559327A1
公开(公告)日：2013-02-20
申请号：EP11730863.5
申请日：2011-04-11
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： STAHR, Johannes , LEITGEB, Markus
IPC分类号： H05K1/18 , H05K3/46
CPC分类号： H05K1/185 , H05K1/0218 , H05K1/0298 , H05K1/115 , H05K1/14 , H05K1/144 , H05K1/181 , H05K1/186 , H05K3/4623 , H05K3/4697 , H05K2201/041 , H05K2201/042 , H05K2201/043 , H05K2201/045 , H05K2201/0723 , H05K2201/09036 , H05K2201/09072 , H05K2201/09618 , H05K2201/10 , H05K2201/10083 , H05K2201/10151 , Y10T29/49126 , Y10T29/49144
摘要： In a method for integrating a component (3) into a printed circuit board, the following steps are provided: - providing two completed printed circuit board elements (1, 4), which more particularly consist of a plurality of interconnected plies or layers (6, 7, 8), wherein at least one printed circuit board element (4) has a cutout or depression (10), - arranging the component (3) to be integrated on one of the printed circuit board elements (1) or in the cutout of the at least one printed circuit board element, and - connecting the printed circuit board elements (1, 4) with the component (3) being accommodated in the cutout (10), as a result of which it is possible to obtain secure and reliable accommodation of a component or sensor (3) in a printed circuit board. Furthermore, a printed circuit board of this type comprising an electronic component (3) integrated therein is provided.
摘要翻译：一种用于INTEGRA廷方法的部件到印刷电路板，包括以下步骤：提供两个完成印刷电路板元件，其更特别地由相互连接的板层或层中的多个，worin至少一个印刷电路板元件具有切口或凹陷，安排部件到印刷电路板元件中的一个或在所述至少一个印刷电路板元件的切口被集成，以及连接与所述部件的印刷电路板元件被容纳在该切口中，作为结果有可能在一个印刷电路板，以获得组件或传感器的安全和可靠的住宿。进一步，提供了一种这种类型的，其包括集成在其中的电子元件的的印刷电路板。

7. 发明授权

EP1811823B1 MULTILAYER PRINTED WIRING BOARD 有权
标题翻译：多层印刷线路板
公开(公告)号：EP1811823B1
公开(公告)日：2012-06-06
申请号：EP05790482.3
申请日：2005-10-04
申请人： Ibiden Co., Ltd.
发明人： ASAI, Motoo, c/o IBIDEN CO., LTD. , KODAMA, Hiroaki, c/o IBIDEN CO., LTD. , YAMADA, Kazuhito, c/o IBIDEN CO., LTD.
IPC分类号： G02B6/43 , H05K1/02 , H05K3/46
CPC分类号： G02B6/43 , H01L2224/16225 , H05K1/0274 , H05K3/4623 , H05K3/4652 , H05K2201/09536 , H05K2201/096 , H05K2203/061
摘要： Disclosed is a small-sized multilayer printed wiring board wherein the degree of freedom in design is improved. Such a multilayer printed wiring board is easily applicable to high density wiring. Specifically disclosed is a multilayer printed wiring board wherein a plurality of insulating layers, a conductor circuit and an optical wiring are formed in layers and on which an optical device is mounted. Such a multilayer printed wiring board is characterized in that the optical wiring is formed between the insulating layers.
摘要翻译：公开了一种小型多层印刷线路板，其中设计的自由度得到改善。这种多层印刷线路板容易应用于高密度布线。具体公开了多层印刷布线板，其中多层绝缘层，导体电路和光学布线形成为层并且光学器件被安装在该多层印刷布线板上。这种多层印刷线路板的特征在于，在绝缘层之间形成光配线。

8. 发明授权

EP2146557B1 Integrated microwave circuit 有权转让
标题翻译：微波集成电路
公开(公告)号：EP2146557B1
公开(公告)日：2012-05-16
申请号：EP09164411.2
申请日：2009-07-02
申请人： Thales Holdings UK Plc
发明人： Lawson, Graham , Loiselet, Emmanuel
IPC分类号： H05K1/02
CPC分类号： H05K1/0222 , H01L2224/48091 , H01L2224/48227 , H01L2924/15311 , H01L2924/16152 , H05K3/4614 , H05K3/4623 , H05K2201/09236 , H05K2201/09481 , H05K2201/09536 , H05K2201/09609 , H05K2201/09618 , H01L2924/00014
摘要： An hermetically sealed integrated microwave circuit comprising a coplanar waveguide on a PCB (3, 4) electrically connected on one major surface to an IC, and thermally and electrically connected to a BGA (5) on its opposite major surface, in which the PCB has at least first and second printed layers, a microwave signal path extends from a ball of the BGA through a through-hole in both printed layers to the coplanar wave guide, and plural ground paths extend from balls (51) of the BGA (5) through first through-holes in the first printed layer of the PCB and through second through-holes of the second printed layer of the PCB, the first and second through-holes being non-coincident, to allow for an hermetic seal across the PCB whilst introducing a predetermined impedance in the PCB between the signal and ground paths.

10. 发明公开

EP1434292A4 FUEL CELL AND ELECTRONIC DEVICE USING FUEL CELL 审中-公开
标题翻译： ELEKTRONISCHE EINRICHTUNG MIT DER BRENNSTOFFZELLE的BRENNSTOFFZELLE
公开(公告)号：EP1434292A4
公开(公告)日：2011-08-03
申请号：EP02772896
申请日：2002-09-25
申请人： SONY CORP
发明人： TAKAI YUICHI , WATANABE YASUHIRO
IPC分类号： G03F7/20 , H01M8/02 , H01M8/04 , H01M8/10 , H05K1/02 , H05K3/46
CPC分类号： H01M8/0228 , H01M8/0258 , H01M8/0269 , H01M8/04089 , H01M8/04201 , H01M8/1097 , H01M2250/30 , H05K1/0272 , H05K3/4623 , H05K3/4652 , H05K3/4697 , Y02B90/18 , Y02P70/56

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式