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    • 6. 发明公开
    • Composite piezoelectric component and chip-type composite piezoelectric component
    • Zusammengesetztes piezoelektrisches元素和芯片zusammengesetztes piezoelektrisches元素
    • EP1039634A3
    • 2001-09-19
    • EP00106454.2
    • 2000-03-24
    • Murata Manufacturing Co., Ltd.
    • Futakuchi, TomoakiHashimoto, Hisayuki
    • H03H9/58H03H9/13
    • H03H9/581
    • There is disclosed a composite piezoelectric component comprising: a plurality of piezoelectric resonant elements, each element comprising; a substrate including a first major surface and a second major surface opposed each other; a pair of vibrating electrodes disposed on the first and second major surfaces respectively so as to oppose each other via the substrate; a ground electrode connected to ground and disposed on at least one of the first and second major surfaces; and each of the plurality of piezoelectric resonant elements being deposited one on the other so that the major surface of one substrate opposes the major surface of another substrate; a conductive joining member electrically connecting at least two of the vibrating electrodes and the ground electrode of the plurality of piezoelectric resonant elements and mechanically bonding the deposited piezoelectric resonant elements; each of the substrates of one of the piezoelectric resonant elements other than the piezoelectric resonant element deposited on the top portion comprising: a plurality of piezoelectric substrate portions; a conductive material portion arranged between the plurality of piezoelectric substrate portions; the ground electrodes being provided on the first and second major surfaces of the substrate in the conductive material portion; and the plurality of ground electrodes of the piezoelectric resonant elements being electrically connected to one another via the conductive material portions and the conductive joining members.
    • 公开了一种复合压电元件,包括:多个压电谐振元件,每个元件包括: 基板,包括彼此相对的第一主表面和第二主表面; 一对振动电极,分别设置在所述第一和第二主表面上,以便经由所述基板彼此相对; 连接到地面并设置在第一和第二主表面中的至少一个上的接地电极; 并且所述多个压电谐振元件中的每一个彼此沉积,使得一个基板的主表面与另一个基板的主表面相对; 电连接所述多个压电谐振元件中的至少两个所述振动电极和所述接地电极的导电接合部件,并机械地结合所述沉积的压电谐振元件; 沉积在顶部上的压电谐振元件之外的压电谐振元件之一的每个基板包括:多个压电基板部分; 布置在所述多个压电基片部分之间的导电材料部分; 所述接地电极设置在所述导电材料部分中的所述基板的所述第一和第二主表面上; 并且压电谐振元件的多个接地电极经由导电材料部分和导电接合部件彼此电连接。