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    • 1. 发明公开
    • PIEZOELECTRIC DEVICE
    • PIEZOELEKTRISCHE VORRICHTUNG
    • EP2849342A4
    • 2015-11-04
    • EP13787154
    • 2013-03-14
    • DAISHINKU CORP
    • YANG LIYANNAKANISHI KENTARO
    • H03H9/10B06B1/06H01L41/053H01L41/09H01L41/18H03H9/02H03H9/05H03H9/13H03H9/17H03H9/19
    • H03H9/17B06B1/0648H01L41/053H03H9/02133H03H9/02157H03H9/0509H03H9/0514H03H9/0519H03H9/0523H03H9/1014H03H9/1021H03H9/132
    • The piezoelectric device according to the invention is provided with a rectangular crystal piece having driving electrodes on front and back main faces thereof, and a base member having two electrode pads near one short side of the crystal piece. The crystal piece is supported on the base member by first and second support portions near one short side thereof, and by an auxiliary support portion on the other short side thereof. A position of the auxiliary support portion relative to the other short side, where L is a distance between two short sides, and H is a distance from the other short side to a peripheral edge of the auxiliary support portion nearest to the other short side, is set to a position at which the distance H stays in a range of distances in which a maximum tensile stress acting on the auxiliary support portion and a maximum von Mises stress of the crystal piece are respectively within predetermined ranges of stress values. For a better resistance to impact, the position of the auxiliary support portion is set to a position at which a value of (H2+D)/L expressed in percentage is equal to or smaller than 20%, where H2 is a value included in the range of distances H in which these stresses are both maximized.
    • 根据本发明的压电装置设置有在其前后主驱动面上具有驱动电极的矩形晶体片,以及在该晶片的一个短边附近具有两个电极焊盘的基底部件。 该晶片通过靠近一个短边的第一和第二支撑部分和另一个短边上的辅助支撑部分支撑在基座构件上。 辅助支撑部分相对于另一个短边的位置,其中L是两个短边之间的距离,H是距辅助支撑部分的最靠近另一个短边的另一个短边到周边边缘的距离, 设定在距离H停留在作用在辅助支撑部上的最大拉伸应力和结晶片的最大von Mises应力的距离范围分别在预定应力值范围内的位置。 为了更好的抗冲击性,将辅助支撑部的位置设定为以(%+ D)/ L表示的百分比的值为20%以下的位置,其中H2为包含在 这些应力的两个距离H的范围都最大化。
    • 4. 发明公开
    • An electronic part and a method of production thereof
    • Elektronisches Bauteil und Herstellungsverfahren
    • EP0794616A3
    • 1998-05-27
    • EP97103617
    • 1997-03-05
    • MATSUSHITA ELECTRIC IND CO LTD
    • ONISHI KEJIIWAKI HIDEKISEKI SHUN-ICHITAGUCHI YUTAKASHIRAISHI TSUKASABESSHO YOSHIHIROKAWASAKI OSAMUEDA KAZUO
    • H03H3/08H03H9/10
    • H03H9/0509H01L2224/1134H01L2224/131H01L2224/13124H01L2224/13144H01L2224/45144H01L2924/00013H01L2924/09701H01L2924/16152H03H3/08H03H9/0585H03H9/059H03H9/1042H03H9/1071H03H9/1085H03H9/1092Y10T29/42Y10T29/4913Y10T29/49146H01L2924/014H01L2924/00014H01L2224/13099H01L2924/00
    • The present invention relates to an electronic part used for mobile communications apparatuses and the like, and more particularly to an electronic part, such as an acoustic surface-wave device, a piezoelectric ceramic device or the like, which requires an oscillation space near the surface of the functional device chip thereof, and a method of production thereof. With this method, a space retainer (5) for forming a sealed space (20) at the functional portion of the chip can be hermetically sealed and have high moisture resistance, and the process of forming the space retainer can be carried out easily.
      The electronic part of the present invention comprises a functional device chip (1), a space retainer for forming a sealed space at the functional portion of the chip, a circuit substrate (8) to which the chip is secured, electrode interconnection portions (6) for establishing electric connection between the chip and the circuit substrate, and a sealing resin (7) for covering and sealing at least the space retainer, wherein the space retainer comprises a support layer (52) made of a synthetic resin film, provided with an opening enclosing the functional portion and joined onto the main surface, and a cover (56) formed and joined onto the support layer so as to cover the functional portion and form a sealed space between the cover and the functional portion.
    • 用于移动通信设备等的电子部件技术领域本发明涉及用于移动通信设备等的电子部件,更具体地涉及在表面附近需要振荡空间的诸如声表面波器件,压电陶瓷器件等的电子部件 其功能器件芯片及其制造方法。 利用该方法,用于在芯片的功能部分处形成密封空间(20)的空间保持器(5)可以被气密地密封并且具有高防潮性,并且可以容易地执行形成空间保持器的过程。 本发明的电子部件包括功能器件芯片(1),用于在芯片的功能部分形成密封空间的空间保持器,固定芯片的电路衬底(8),电极互连部分(6 ),用于在所述芯片和所述电路基板之间建立电连接;以及密封树脂(7),用于至少覆盖和密封所述空间保持器,其中所述空间保持器包括由合成树脂膜制成的支撑层(52),所述支撑层 包围功能部并接合到主表面上的开口以及形成并接合到支撑层上以覆盖功能部并在盖和功能部之间形成密封空间的盖(56)。