会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 5. 发明公开
    • High density connector and method of manufacture
    • Steckverbinder hoher Kontaktdichte und Herstellungsverfahren
    • EP0836243A2
    • 1998-04-15
    • EP97117583.1
    • 1997-10-10
    • BERG ELECTRONICS MANUFACTURING B.V.
    • Lemke, Timothy A.Houtz, Timothy W.
    • H01R9/09H01R23/72
    • H01R12/57H01M2/30H01R12/716H01R12/727H01R43/0249H01R43/0256H01R43/0263H01R43/20H05K3/3426H05K3/3478Y10T29/49117Y10T29/49142Y10T29/49144Y10T29/49147Y10T29/49149
    • Electrical connectors capable of being mounted on circuit substrates by BGA techniques are disclosed. Also disclosed is a method for manufacturing such connectors. There is at least one recess (20,22,24,26,28) on the exterior side of the connector elements. A conductive contact (16) extends from adjacent the interior side of the into the recess on the exterior side of the housing. A controlled volume of solder paste is introduced into the recess. A fusible conductive element, in the form of solder balls (82,100) is positioned in the recess. The connector is subjected to a reflow process to fuse the solder ball (82,100) to the portion of the contact extending into said recess. Contacts (66) are secured in the insulative housing of the connector by deformable sections that minimize stress imposed on the housing, thereby reducing warpage. Solder resist areas are formed on central portions of the contacts to promote uniformity of solder volume. As a result of these features, substantial coplanarity of the BGA array along the mounting interface of the connector is achieved.
    • 公开了能够通过BGA技术安装在电路基板上的电连接器。 还公开了一种用于制造这种连接器的方法。 在连接器元件的外侧上具有至少一个凹部(20,22,24,26,28)。 导电触头(16)从外部的内侧延伸到壳体的外侧的凹部中。 将控制体积的焊膏引入凹槽中。 以焊球形式(82,100)形成的可熔导电元件位于凹槽中。 连接器经受回流处理以将焊球(82,100)熔合到延伸到所述凹部中的接触部分。 接触件(66)通过变形部分固定在连接器的绝缘壳体中,使得施加在壳体上的应力最小化,从而减少翘曲。 在触点的中心部分形成有阻焊区域,以促进焊料体积的均匀性。 作为这些特征的结果,实现了沿着连接器的安装界面的BGA阵列的显着的共面性。