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1. 发明授权

EP0634059B1 METHOD AND APPARATUS FOR FORMING AN ELECTRICAL CONNECTION 失效
标题翻译：方法和器具，用于产生的电气连接
公开(公告)号：EP0634059B1
公开(公告)日：1999-05-12
申请号：EP93907950.5
申请日：1993-03-30
申请人： RAYCHEM S.A.
发明人： DELALLE, Jacques , LAMOME, Alain , BRIENS, Sylvain
IPC分类号： H01R4/72 , H01R43/02
CPC分类号： H01R43/0242 , H01R4/723 , H01R9/0503 , H01R9/0512 , Y10S174/08 , Y10T29/49179 , Y10T29/49201

2. 发明授权

EP0789923B1 VERFAHREN UND VORRICHTUNG ZUM KONTAKTIEREN DES WICKLUNGSDRAHTES EINER SPULE 失效
标题翻译：方法和设备，用于接触线圈的绕组线
公开(公告)号：EP0789923B1
公开(公告)日：1998-06-17
申请号：EP95935844.1
申请日：1995-11-03
申请人： SIEMENS AKTIENGESELLSCHAFT
发明人： DITTMANN, Michael , VOJTA, Erich
IPC分类号： H01F41/10 , B23K1/00 , H01R4/02
CPC分类号： H01R43/0242 , B23K1/0008 , B23K2201/38 , H01F41/10 , H01R4/023
摘要： A connecting pin (10) of a coil, on the end section (11) of which is wound an end section (12) of a multi-turn winding, is first given a drop of fluxless soft solder (14) and then arranged near the points of two opposite electrodes (2, 3). An arc of given power and duration is then applied between the electrodes causing the soft solder (14) to melt and secure the winding wire (12) to the connecting pin (10). It is thus possible to solder the winding end without flux and with only a slight heat stress on the coil body (8) and the connecting pin (10).

3. 发明公开

EP0634059A1 METHOD AND APPARATUS FOR FORMING AN ELECTRICAL CONNECTION 失效
标题翻译：方法和设备用于生产电连接。
公开(公告)号：EP0634059A1
公开(公告)日：1995-01-18
申请号：EP93907950.0
申请日：1993-03-30
申请人： RAYCHEM S.A.
发明人： DELALLE, Jacques , LAMOME, Alain , BRIENS, Sylvain
IPC分类号： H01R4 , H01R43 , H01R9
CPC分类号： H01R43/0242 , H01R4/723 , H01R9/0503 , H01R9/0512 , Y10S174/08 , Y10T29/49179 , Y10T29/49201
摘要： A method of forming a solder connection between a plurality of elongate bodies, comprises: (i) forming an initial connection between the elongate bodies by inserting them into an induction heatable connecting element of a connector, the connector comprising a dimensionally heat-recoverable sleeve and, retained within the sleeve, the connecting element and a solder insert that is in thermal contact with the connecting element; and (ii) heating the connector (a) by subjecting the connecting element to an alternating magnetic field so that it is heated by induction thereby melting the solder insert, and (b) subjecting the sleeve to hot air and/or infrared radiation, thereby causing the sleeve to recover. Also disclosed is an apparatus for applying heat to an elongate connector, comprising a first heat source which comprises an induction coil, and a second heat source arranged to generate hot air or infrared radiation.

4. 发明授权

EP0371630B1 Self regulating temperature heater carrier strip 失效
标题翻译：自调节加热器标签条。
公开(公告)号：EP0371630B1
公开(公告)日：1994-03-09
申请号：EP89311471.0
申请日：1989-11-06
申请人： THE WHITAKER CORPORATION
发明人： Henschen, Homer Ernst , McKee, Michael John , Pawlikowski, Joseph Michael
IPC分类号： B23K3/04 , H05B3/12 , H01R43/02
CPC分类号： H01R43/0242 , B23K3/0475 , H01R4/02 , H05B3/12

5. 发明公开

EP0371645A1 Self regulating temperature heater as an integral part of a printed circuit board 失效
标题翻译： Selbstregulierendes Heizelement als integriertes Bestandteil einer Leiterplatte。
公开(公告)号：EP0371645A1
公开(公告)日：1990-06-06
申请号：EP89311662.4
申请日：1989-11-10
申请人： THE WHITAKER CORPORATION
发明人： Henschen, Homer Ernst , Pawlikowski, Joseph Michael , McKee, Michael John
IPC分类号： B23K3/04 , H05B3/12 , H01R43/02
CPC分类号： H01R43/0242 , B23K3/0475 , H01L2224/81234 , H01L2224/83234 , H01L2924/01079 , H01L2924/09701 , H01R4/02 , H05B3/12 , H05K1/0212 , H05K1/0242 , H05K1/167 , H05K3/3421 , H05K3/3494 , H05K3/363 , H05K3/4015 , H05K3/4611 , H05K2201/083 , H05K2201/1034 , H05K2201/10924 , H05K2203/1115
摘要： A heater (20) is secured to or embedded in a circuit board (10) and is selectively energizable by current to melt solder in a connection or disconnection operation. The heater (20) is spaced from circuit board contact pads (13) by circuit board structure material that transmits the generated thermal energy to the contact pads (13) to melt solder or other fusible material. The heater is preferably a self-regulating heater in the form of a copper substrate (12) having a thin surface layer (20) of magnetically permeable, high resistance material. An alternating current of constant amplitude and high frequency is passed through the heater and concentrated in the surface layer (20) at temperatures below the surface layer Curie temperature. At higher temperatures the current is distributed through the lower resistance substrate (12) to limit further heating. A current return path or bus (21) is disposed in closely-spaced parallel relation to the surface layer (20) and establishes an electric field between the substrate (12) and the return bus (21) to bias current in the substrate toward the surface layer (20). The return bus (21) may be embedded in the circuit board (10) or provided as part of external tooling employed to deliver energizing current.
摘要翻译：加热器（20）固定到电路板（10）中或嵌入电路板（10）中，并且可以通过电流选择性地激励以在连接或断开操作中熔化焊料。加热器（20）通过电路板结构材料与电路板接触焊盘（13）间隔开，所述电路板结构材料将产生的热能传递到接触焊盘（13）以熔化焊料或其它易熔材料。加热器优选为具有透磁性高电阻材料的薄表面层（20）的铜基底（12）形式的自调节加热器。恒定幅度和高频率的交流电流通过加热器并在低于表层居里温度的温度下集中在表面层（20）中。在较高的温度下，电流分布通过下电阻衬底（12）以限制进一步的加热。电流返回路径或总线（21）以与表面层（20）成间隔的平行关系设置，并且在衬底（12）和返回总线（21）之间建立电场，以将基板中的电流偏置到表面层（20）。返回总线（21）可以嵌入在电路板（10）中，或者作为用于传递激励电流的外部工具的一部分提供。

6. 发明公开

EP0206620A2 Self-heating, self-soldering bus bar. 失效
标题翻译：自热和selbstlötende母线。
公开(公告)号：EP0206620A2
公开(公告)日：1986-12-30
申请号：EP86304394
申请日：1986-06-09
申请人： METCAL INC
发明人： KRUMME JOHN F , COWELL MARK J
IPC分类号： H01B5/00 , H01B5/02 , H01L23/32 , H01R4/02 , H01R33/76 , H01R43/02 , H02G5/02 , H05K1/02 , H05K1/11 , H05K3/34
CPC分类号： H02G5/02 , H01R43/02 , H01R43/0242 , H05K1/0212 , H05K1/0242 , H05K3/3421 , H05K3/3494 , H05K2201/083 , H05K2201/10272 , H05K2201/10325 , H05K2201/10689 , H05K2203/104 , H05K2203/1115
摘要： A self-heating and self-soldering bus bar for use in many applications. The pins of the bus bar are quickly and directly heated to a predetermined autoregulated temperature without significantly raising the temperature of the body of the bus. Thusly a bus bar may be mounted while maintaining thermal balance and mechanical integrity of all work pieces. The present invention avoids the problems normally associated with excess thermal expansion experienced when a bus bar is heated incidental to the heating of its contact points. A majority of this incidental heating is eliminated by direct quick heating of the mounting pins.

7. 发明公开

EP3292596A1 VERFAHREN ZUM HERSTELLEN EINER LÖTVERBINDUNG, ELEKTRISCHER STECKVERBINDER ZUM VERLÖTEN MIT EINEM KOAXIALKABEL UND VERWENDUNG EINES SOLCHEN STECKVERBINDERS 有权
标题翻译：生产焊接连接器的方法，用于移除同轴电缆并使用这种连接器的电连接器
公开(公告)号：EP3292596A1
公开(公告)日：2018-03-14
申请号：EP16722842.8
申请日：2016-05-04
申请人： TELEGÄRTNER KARL GÄRTNER GMBH
发明人： VOGL, Manfred
IPC分类号： H01R43/02 , H01R9/05 , H01R4/02 , G01K13/12 , B23K1/002
CPC分类号： H01R43/0242 , B23K1/002 , B23K3/08 , B23K2101/38 , G01K13/125 , H01R4/025 , H01R9/05 , H01R24/40 , H01R2103/00
摘要： The invention relates to a method for producing a soldered connection between at least two components (10, 30), in which the components (10, 30) are heated to melt a solder in a solder region (24), wherein the solder region (24 and/or the supply of solder to the solder region (24) are heated according to the temperature which is determined by contactless detection of heat radiation emitted from at least one temperature measuring surface (38) of one of the components (10, 30). In order to develop the method such that the emissivity of the at least one temperature measuring surface (38) can be increased reliably and with only slight impairment of the electrical connection of the components (10, 30), it is proposed that the at least one temperature measuring surface (38) be heated locally to increase the emissivity thereof. An electrical plug-in connector (10) is also proposed for producing a soldered connection and a use of such a plug-in connector (10).

8. 发明公开

EP3045252A1 INDUKTIVES LÖTVERFAHREN UND VORRICHTUNG 审中-公开
标题翻译： INDUCTIVE焊接和设备
公开(公告)号：EP3045252A1
公开(公告)日：2016-07-20
申请号：EP15198181.8
申请日：2015-12-07
申请人： Elmotec AG
发明人： Müller, Albin
IPC分类号： B23K1/002 , B23K1/00 , B23K3/047 , B23K3/08 , B23K37/06 , H01R4/02 , H01R43/02 , B23K101/36
CPC分类号： B23K1/002 , B23K1/0016 , B23K3/0475 , B23K3/08 , B23K37/06 , B23K2201/36 , H01R4/187 , H01R43/0242
摘要： Ein Verfahren umfasst das induktive Erhitzen einer Verbindungsstelle zwischen einem ersten elektrischen Werkteil (5) und einem zweiten elektrischen Werkteil (6) mittels einem Hochfrequenzgenerator (2) und einer Induktionsspule (4), das Heranführen eines Lots (8) an die Verbindungsstelle zwischen den beiden elektrischen Werkteilen (5, 6) und das Schmelzen des Lots (8) an der Verbindungsstelle. Erfindungsgemäss wird ein Heissluftstrom (9') auf das geschmolzene Lot (8a) mittels eines Heissluftgebläses (9) in einer Richtung entgegen der Fliessrichtung des Lots (8a) gerichtet. Dies verhindert, dass das Lot (8a) über den Rand der Lötstelle hinwegfliesst. Die Erfindung wird insbesondere auf das Löten eines Autobatteriekabels und einem Kabelschuh (6) mit elektrischem Anschlusselement (7) angewendet. Es wird auch eine Vorrichtung (1) zur Durchführung des Verfahrens beansprucht.
摘要翻译：一种方法包括将第一电驱动部（5）和一个第二电驱动部（6）由一个高频发生器的装置（2）和一个感应线圈（4），其引入焊料（8），以两者之间的连接点之间的接合处的感应加热电动植物部分（5,6），并在连接处所述焊料（8）的熔化。根据本发明，由热空气鼓风机（9）的装置中的方向引导在熔融焊料（8a）的热空气（9“）的流相反的焊料（8a）的流动方向。这防止了焊料（8A）在焊接接头的边缘流出。本发明尤其适用于汽车电池电缆的钎焊和一个电缆接线片（6）与电连接元件（7）。这里还要求保护用于实施该方法的装置（1）。

9. 发明公开

EP1864143A4 MINI WAVE SOLDERING SYSTEM AND METHOD FOR SOLDERING WIRES AND PIN CONFIGURATIONS 审中-公开
标题翻译： MINI波峰焊和方法进行焊接WIRES和引脚
公开(公告)号：EP1864143A4
公开(公告)日：2009-11-25
申请号：EP06738795
申请日：2006-03-15
申请人： MEDCONX INC
发明人： KENT HAROLD B , LEVANTE JAMES J , FINE AARON T , LAYTON JOSEPH R , FOX SARAH
IPC分类号： H05K3/32
CPC分类号： H05K3/3447 , B23K3/0653 , B23K2201/32 , H01R4/023 , H01R43/0242 , H01R43/0256 , H05K1/0212 , H05K1/116 , H05K3/3494 , H05K2201/09781 , H05K2203/0195

10. 发明授权

EP0492492B1 Method of securing a connector to a circuit element and soldering lead frame for use therein 失效
标题翻译：一种用于将连接器附接到一个电路元件，以及以Lötanschlussrahmen方法
公开(公告)号：EP0492492B1
公开(公告)日：1996-05-08
申请号：EP91121924.4
申请日：1991-12-20
申请人： THE WHITAKER CORPORATION
发明人： Henschen, Homer, Ernst , McKee, Michael, John , Pawlikowski, Joseph, Michael , Schaeffer, Richard, Lloyd , Scholz, James, Paul , Shaffer, David, Todd , Sharpe, Alexander, Michael
IPC分类号： H01R43/02
CPC分类号： H01R43/02 , B23K3/0475 , H01R43/0242 , H01R43/16 , H05K1/0212 , H05K3/3494 , H05K2201/083 , H05K2201/09709 , H05K2201/10189 , H05K2201/10424 , H05K2201/10446 , H05K2201/10924 , H05K2203/107 , H05K2203/1115

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