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    • 1. 发明公开
    • Method of joining a plurality of associated pairs of electrical conductors
    • Verfahren zum paarweisen Verbinden mehrerer elektrischer Leiter。
    • EP0371455A1
    • 1990-06-06
    • EP89121932.1
    • 1989-11-28
    • THE WHITAKER CORPORATION
    • Beinhaur, Ernest LloydHenschen, Homer ErnstMcKee, Michael JohnPawlikowski, Joseph Michael
    • H01R4/72B23K3/04
    • B23K3/0475H01R4/723H01R43/02H01R43/0207
    • A strap (100) comprised of a layer of magnetic material (108) on a layer of nonmagnetic conductive metal (106) comprises a self-regulating heater, which is wrapped around a length of heat recoverable tubing disposed around a terminal being terminated to a conductor wire (70), or a pair of wires being spliced. When energized, the strap (100) generates thermal energy melting solder of a preform within the tubing, terminating the terminal to the wire (70), or the two wires together, and sealing the termination simultaneously. A plurality of terminals in a connector housing (40) include solder tails extending rearwardly from the housing (40) so that respective wire ends may be placed therealong within solder preforms within heat recoverable tubing therearound. A strap (100) comprising a self-regulating temperature source is wrapped around the array of solder tails and wire ends (76) and is energized to solder the array and seal the terminations. A high frequency alternating current induced in or transmitted to the magnetic layer (108) of the strap (100) causes the strap to generate thermal energy sufficient to melt the solder and shrink the tubing. The strap (100) may have several layers and may be shapable to conform to the outer surfaces of the heat recoverable tubing lengths. A strap may seal an open end of a length of heat recoverable tubing having a sealant preform therewithin, when wrapped therearound and energized.
    • 由非磁性导电金属层(106)上的一层磁性材料(108)构成的带(100)包括一个自调节加热器,该自调节加热器围绕设置在端子周围的一段可热回收的管子上, 导体线(70)或一对电线被拼接。 当通电时,带(100)产生在管道内的预成型件的热能熔化焊料,将端子终止于导线(70),或将两根导线连接在一起,并同时密封终端。 连接器壳体(40)中的多个端子包括从壳体(40)向后延伸的焊接尾部,使得相应的导线末端可以在其周围的可热回收管内的焊料预制件内放置。 包括自调节温度源的带(100)缠绕在焊料尾部和线端(76)的阵列周围,并且被通电以焊接阵列并密封端子。 在带(100)中感应或传输到磁性层(108)的高频交流电导致带产生足以熔化焊料并收缩管的热能。 带(100)可以具有几层,并且可以是可成形的以符合可热回收管长度的外表面。 带子可以密封一段长度的可热回收管道的开口端,当其包裹并通电时,其具有密封剂预制件。
    • 5. 发明公开
    • Connector housing assembly for discrete wires
    • VerbindergehäuseanordnungfüreinzelneDrähte。
    • EP0570832A1
    • 1993-11-24
    • EP93107756.4
    • 1993-05-12
    • THE WHITAKER CORPORATION
    • Henschen, Homer ErnstKurtz, JosephPawlikowski, Joseph MichaelWolfe, Brian Alfred
    • H01R43/02
    • B23K3/0475H01R4/023H01R43/0207
    • A connector (10) having two rows of signal terminals (20) is easily terminated to conductors (106) of discrete wires (14) by providing rear sections (28) of the terminals extending from the front housing member (30). A wire-carrying subassembly (130) having the discrete wires secured thereto is moved against the rear (36) of the front housing member (30) to place stripped conductor portions (108) adjacent the rear terminal sections (28) to be soldered. The wire-carrying subassembly (130) includes a body member (50) having upper and lower arrays grooves (56) therealong between a front support ledge (60) and a rear support section (62), and upper and lower forward and rearward clamping bars (72, 82) securable to the body member to clamp the wires (14) thereto by clamping insulated end portions (104) forwardly of stripped conductor portions (108) within the grooves (56) and insulated wire portions behind the grooves, with the rear terminal sections (28) receivable into the grooves.
    • 具有两排信号端子(20)的连接器(10)通过提供从前壳体(30)延伸的端子的后部(28)容易地终止于离散导线(14)的导体(106)。 具有固定到其上的分立线的导线承载子组件(130)抵靠前壳体构件30的后部(36)移动,以将邻近后端子部分(28)的剥离导体部分(108)放置在待焊接的位置。 线载子组件(130)包括主体构件(50),其在前支撑凸缘(60)和后支撑部分(62)之间具有上排和下排阵列凹槽(56),以及上下前后夹紧 通过将沟槽(56)内的剥离导体部分(108)的前方的绝缘端部(104)夹在绝缘端部(104)之间,以及槽后面的绝缘线部分 后端子部分(28)可接收到凹槽中。
    • 6. 发明公开
    • Self regulating temperature heater as an integral part of a printed circuit board
    • Selbstregulierendes Heizelement als integriertes Bestandteil einer Leiterplatte。
    • EP0371645A1
    • 1990-06-06
    • EP89311662.4
    • 1989-11-10
    • THE WHITAKER CORPORATION
    • Henschen, Homer ErnstPawlikowski, Joseph MichaelMcKee, Michael John
    • B23K3/04H05B3/12H01R43/02
    • H01R43/0242B23K3/0475H01L2224/81234H01L2224/83234H01L2924/01079H01L2924/09701H01R4/02H05B3/12H05K1/0212H05K1/0242H05K1/167H05K3/3421H05K3/3494H05K3/363H05K3/4015H05K3/4611H05K2201/083H05K2201/1034H05K2201/10924H05K2203/1115
    • A heater (20) is secured to or embedded in a circuit board (10) and is selectively energizable by current to melt solder in a connection or disconnection operation. The heater (20) is spaced from circuit board contact pads (13) by circuit board structure material that transmits the generated thermal energy to the contact pads (13) to melt solder or other fusible material. The heater is preferably a self-regulating heater in the form of a copper substrate (12) having a thin surface layer (20) of magnetically permeable, high resistance material. An alternating current of constant amplitude and high frequency is passed through the heater and concentrated in the surface layer (20) at temperatures below the surface layer Curie temperature. At higher temperatures the current is distributed through the lower resistance substrate (12) to limit further heating. A current return path or bus (21) is disposed in closely-spaced parallel relation to the surface layer (20) and establishes an electric field between the substrate (12) and the return bus (21) to bias current in the substrate toward the surface layer (20). The return bus (21) may be embedded in the circuit board (10) or provided as part of external tooling employed to deliver energizing current.
    • 加热器(20)固定到电路板(10)中或嵌入电路板(10)中,并且可以通过电流选择性地激励以在连接或断开操作中熔化焊料。 加热器(20)通过电路板结构材料与电路板接触焊盘(13)间隔开,所述电路板结构材料将产生的热能传递到接触焊盘(13)以熔化焊料或其它易熔材料。 加热器优选为具有透磁性高电阻材料的薄表面层(20)的铜基底(12)形式的自调节加热器。 恒定幅度和高频率的交流电流通过加热器并在低于表层居里温度的温度下集中在表面层(20)中。 在较高的温度下,电流分布通过下电阻衬底(12)以限制进一步的加热。 电流返回路径或总线(21)以与表面层(20)成间隔的平行关系设置,并且在衬底(12)和返回总线(21)之间建立电场,以将基板中的电流偏置到 表面层(20)。 返回总线(21)可以嵌入在电路板(10)中,或者作为用于传递激励电流的外部工具的一部分提供。
    • 9. 发明公开
    • Self regulating temperature heater with thermally conductive extensions
    • Selbstregulierendes Heizelement mitwärmeleitendenVerlängerungen。
    • EP0371646A1
    • 1990-06-06
    • EP89311663.2
    • 1989-11-10
    • THE WHITAKER CORPORATION
    • Henschen, Homer ErnstMcKee, Michael JohnPawlikowski, Joseph Michael
    • B23K3/04H05B3/12H01R43/02
    • H05K1/0212B23K3/0475H01R43/0242H05B3/12H05K1/0242H05K1/117H05K3/244H05K3/3494H05K3/363H05K3/4015H05K2201/083H05K2201/1028H05K2201/10924H05K2203/1115
    • Spaced contact pads (23) on a printed circuit board (19) are soldered to respective spaced contacts (21) in a cable or connector assembly by means of respective spaced connecting members (15) interposed between contacts (21) to be soldered. The connecting members (15) are typically electrically and thermally conductive finger-like projections formed as part of a heater body (10) and are readily severable from the heater body (10) after soldering to thereby remain part of the final solder connection. A prescribed amount of fusible material (e.g., solder) is pre-deposited on the connecting members (15) or contacts (21) and is melted when the heater is actuated. The heater body (10) may be a self-regulating heater in the form of a copper substrate (11) having a thin surface layer (13) of magnetically permeable, high resistance alloy. An alternating current of constant amplitude and high frequency is passed through the heater body (10) and is concentrated in the surface layer at temperatures below the surface layer Curie temperature. At higher temperatures the current is distributed through the lower resistance substrate (11) to limit further heating. During the time interval required for the surface layer to reach its Curie temperature, the resistive power dissipation creates sufficient thermal energy to melt the pre-deposited solder. The connecting members (15) are positioned and configured as necessary to reach their respective connection sites.
    • 印刷电路板(19)上的间隔接触焊盘(23)通过介于待焊接的触头(21)之间的相应间隔开的连接构件(15)焊接到电缆或连接器组件中的相应间隔的触点(21)。 连接构件(15)通常是导电和导热的指状突起,其形成为加热器主体(10)的一部分,并且在焊接之后容易地与加热器主体(10)分离,从而保持部分最终焊接连接。 预定量的可熔材料(例如焊料)预先沉积在连接构件(15)或触点(21)上,并在加热器被致动时熔化。 加热器主体(10)可以是具有透磁性高电阻合金薄表面层(13)的铜基板(11)形式的自调节加热器。 恒定振幅和高频的交流电流通过加热器主体(10),并且在低于表面层居里温度的温度下集中在表面层中。 在较高的温度下,电流分布通过下电阻衬底(11)以限制进一步的加热。 在表面层达到居里温度所需的时间间隔期间,电阻耗散产生足够的热能来熔化预沉积的焊料。 连接构件(15)根据需要定位和配置以到达它们各自的连接位置。
    • 10. 发明公开
    • Surface mount technology breakaway self regulating temperature heater
    • Abbrechbares selbstregulierendes HeizelementfürdieOberflächenmontagetechnik。
    • EP0371644A1
    • 1990-06-06
    • EP89311649.1
    • 1989-11-10
    • THE WHITAKER CORPORATION
    • Henschen, Homer ErnstMcKee, Michael JohnPawlikowski, Joseph Michael
    • B23K3/04H05B3/12H01R43/02
    • B23K3/0475H01R4/02H01R43/0242H05B3/12H05K1/0212H05K3/3494H05K2201/10189H05K2201/10924H05K2203/1115
    • Soldering of surface mount connector terminals to contact pads (41) on circuit board (40) is facilitated by configuring the terminals (33) and their solder tails (39) as spaced integrally-formed projections of a selectively actuable heater. Thermal energy developed in the heater(35) is conducted along the projections to the solder tails (39) to melt fusible conductive material (e.g., solder, at the connection sites). After cooling, the projections are severed from the heater (35). The terminals (33), which are formed at the distal ends of the projections, are typically supplied partially inserted in respective terminal-­receiving passages (31) of the connector housing (30). After the soldering operation, the terminals (33) are fully inserted into the passages (31). The heater (35) is preferably a self-regulating heater in the form of a copper substrate having a skin layer (13) of magnetically permeable, high resistance material. An alternating current of constant amplitude and high frequency is passed through the heater (35) and concentrated in the skin layer (13) at temperatures below the Curie temperature of the skin layer material. At higher temperatures, the current is distributed through the lower resistance substrate to limit further heating. During the time interval required for the surface layer (13) to reach its Curie temperature, the resistive power dissipation creates thermal energy that is conducted to the solder tails (39).
    • 通过将端子(33)及其焊接尾(39)配置为可选择致动的加热器的一体形成的突起,便于将表面安装连接器端子焊接到电路板(40)上的接触焊盘(41)。 在加热器(35)中产生的热能沿着凸起传导到焊料尾(39)以融化可熔导电材料(例如在连接部位的焊料)。 冷却后,突起从加热器(35)断开。 形成在突起的远端的端子(33)通常部分地插入连接器壳体(30)的各个端子接收通道(31)中。 在焊接操作之后,端子(33)完全插入通道(31)中。 加热器(35)优选为具有透磁性高电阻材料的表皮层(13)的铜基板形式的自调节加热器。 恒定幅度和高频率的交流电流通过加热器(35)并在低于表层材料的居里温度的温度下集中在表皮层(13)中。 在较高的温度下,电流分布在较低的电阻基板上,以限制进一步的加热。 在表面层(13)达到其居里温度所需的时间间隔期间,电阻功率耗散产生传导到焊料尾(39)的热能。