基本信息:
- 专利标题： METHOD OF MANUFACTURING AN ENCAPSULATED ELECTRONIC DEVICE
- 申请号：EP09711180.1 申请日：2009-02-13
- 公开(公告)号：EP2255399B1 公开(公告)日：2018-08-22
- 发明人： TOONEN, Leonardus Maria , RENSING, Petrus Alexander , VAN MOL, Antonius Maria Bernardus , LIFKA, Herbert , TANASE, Cristina
- 申请人： Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO , Koninklijke Philips N.V.
- 申请人地址： Anna van Buerenplein 1 2595 DA 's-Gravenhage NL
- 专利权人： Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO,Koninklijke Philips N.V.
- 当前专利权人： Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO,Koninklijke Philips N.V.
- 当前专利权人地址： Anna van Buerenplein 1 2595 DA 's-Gravenhage NL
- 代理机构： V.O.
- 优先权： EP08151524 20080215
- 国际公布： WO2009102201 20090820
- 主分类号： H01L51/56
- IPC分类号： H01L51/56 ; H01L51/52
摘要：
An encapsulated electronic device is described comprising: - a first barrier structure (20) comprising at least one inorganic (24) and at least one organic layer (23), - a second barrier structure (30) comprising at least one inorganic (31) and at least one organic layer (32), - an electronic device (10) arranged between the first and the second barrier structure (20, 30), characterized in that the at least one inorganic layer (24) of the first barrier structure (20) and the at least one inorganic (31) layer of the second barrier structure (30) contact each outside an area (A) occupied by the electronic device (10).
公开/授权文献:
- EP2255399A1 ENCAPSULATED ELECTRONIC DEVICE AND METHOD OF MANUFACTURING 公开/授权日：2010-12-01