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    • 9. 发明公开
    • Photosensor
    • 光传感器
    • EP2919281A1
    • 2015-09-16
    • EP15155639.6
    • 2015-02-18
    • OMRON CORPORATION
    • MIYATA, TsuyoshiOHTSUKI, KazuyaNAKAJIMA, JunMIYASHITA, SeijiIMAI, Kiyoshi
    • H01L31/167
    • H01L31/0203H01L31/0224H01L31/14H01L31/167H01L2224/05554H01L2224/48247H01L2224/49111H01L2224/49171H01L2924/181H01L2924/00012H01L2924/00
    • A photosensor simplifies the resin molding process for an emitter element (11), a receiver element (16), and a luminous element (42) forming an operation indicator lamp. The photosensor includes an emitter element (11), an emitter-encapsulating portion (12), a receiver element (16), a receiver-encapsulating portion (17), a circuit portion (40), and a circuit-encapsulating portion (90). The emitter-encapsulating portion (12) encapsulates the emitter element (11). The receiver-encapsulating portion (17) encapsulates the receiver element (16). The circuit portion (40) includes a luminous element (42) for indicating an operation. The circuit-encapsulating portion (90) encapsulates the circuit portion. The circuit-encapsulating portion includes an operation indicator (92) portion facing the luminous element. The emitter-encapsulating portion (12), the receiver-encapsulating portion (17), and the circuit-encapsulating portion (90) are connected to one another with a conductive leadframe (8). The emitter-encapsulating portion (12), the receiver-encapsulating portion (17), and the circuit-encapsulating portion (90) are formed from the same resin material containing a light diffusing agent.
    • 光电传感器简化了用于发射元件(11),接收元件(16)和形成操作指示灯的发光元件(42)的树脂模塑工艺。 光传感器包括发射极元件(11),发射极封装部分(12),接收器元件(16),接收器封装部分(17),电路部分(40)和电路封装部分 )。 发射极封装部分(12)封装发射极元件(11)。 接收器封装部分(17)封装接收器元件(16)。 电路部分(40)包括用于指示操作的发光元件(42)。 电路封装部分(90)封装电路部分。 电路封装部分包括面向发光元件的操作指示器(92)。 发射极封装部分(12),接收器封装部分(17)和电路封装部分(90)通过导电引线框架(8)彼此连接。 发射体封装部分(12),接收器封装部分(17)和电路封装部分(90)由含有光漫射剂的相同树脂材料形成。