专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

EP1202337A2 Probe pin for a probe card 有权
标题翻译： Herstellung von einer Testkarte
公开(公告)号：EP1202337A2
公开(公告)日：2002-05-02
申请号：EP01125135.2
申请日：2001-10-23
申请人： NEC CORPORATION
发明人： Mikami, Kazunari, c/o NEC Yamaguchi, Ltd.
IPC分类号： H01L21/66
CPC分类号： H01L24/10 , G01R1/0675 , G01R1/06761 , H01L21/4885 , H01L24/13 , H01L2224/13 , H01L2224/13099 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/181 , H01L2924/00 , H01L2224/0401
摘要： A probe card includes a card plate (14) and a plurality of probe pins (16) fixed onto the card plate (14). Each of the probe pins (16) has a metallic body (32) made of rhenium-containing tungsten, and a nickel film (34) and a rhodium film (36) consecutively formed on the metallic body (32) by a plating technique using a liquid flow of a plating liquid.
摘要翻译：探针卡包括固定在卡板（14）上的卡板（14）和多个探针（16）。每个探针（16）具有由含铼钨制成的金属体（32）和通过电镀技术连续形成在金属体（32）上的镍膜（34）和铑膜（36），使用电镀液体的液体流动。

2. 发明授权

EP0404760B1 HALBLEITERBAUELEMENT MIT ZWEI ANSCHLÜSSEN, DESSEN HERSTELLVERFAHREN UND AUSFÜHRUNGSVORRICHTUNG DAFÜR 失效
标题翻译：带两个连接的半导体元件，完成这个及其制造方法和设备。
公开(公告)号：EP0404760B1
公开(公告)日：1994-02-23
申请号：EP88902139.0
申请日：1988-03-05
申请人： Deutsche ITT Industries GmbH
发明人： MICIC, Ljubomir , GÄRTLEIN, Günter , SCHMITT, Eberhard , MÜLLER, Alex , SENG, Egon , SPINDLER, Siegfried
IPC分类号： H01L21/50 , H01L23/04
CPC分类号： H01L24/01 , H01L21/4885 , H01L23/041 , H01L23/24 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082
摘要： A semiconductor component has two leads (3) arranged on the same axis and a prefabricated plastic casing (1) filled with a plastics material. One bump passes through the base (1a) of the casing (1). A prefabricated semiconductor body (4) is fastened between the facing sides of the inner ends (60, 70) of the leads (3). These various elements are inserted in the casing (1) and bent inside the latter. The starting point of the manufacturing process is totally different from that of conventional processes for manufacturing leads in that the wire (30) unwound from a roll of wire (39) remains continuous throughout most of the production stages and is separated among the individual semiconductor elements only when the casings (1) have been mounted.

3. 发明公开

EP0396248A3 Electrical pin and method for making same 失效
标题翻译：电引脚及其制造方法
公开(公告)号：EP0396248A3
公开(公告)日：1991-05-02
申请号：EP90303252.2
申请日：1990-03-27
申请人： THE WHITAKER CORPORATION
发明人： Nakamura, Keiichi , Oshima, Tsutomu , Kitai, Toshihiko , Fukuda, Katsunori
IPC分类号： H01R13/04
CPC分类号： H05K3/3426 , H01L21/4885 , H01L23/49811 , H01L2924/0002 , H01R12/52 , H01R43/16 , Y02P70/613 , H01L2924/00
摘要： An electrical pin (1) comprises an electrically-conductive pin member (2) having the same diameter over its entire length and head members (3) secured at both ends of the pin member and having an enlarged surface greater in diameter than the pin member and in the same plane of the end surfaces of the pin member. A plurality of the pins (1) are maintained in alignment at a predetermined pitch by means of an electrically conductive layer (10) to which the head members (3) at one end of each pin member (1) is adhered and a dielectric member (13) to which the electrically conductive layer (10) is secured.

4. 发明公开

EP0396248A2 Electrical pin and method for making same 失效
标题翻译： Elektrischer Steckerstift und Verfahren zu seiner Herstellung。
公开(公告)号：EP0396248A2
公开(公告)日：1990-11-07
申请号：EP90303252.2
申请日：1990-03-27
申请人： THE WHITAKER CORPORATION
发明人： Nakamura, Keiichi , Oshima, Tsutomu , Kitai, Toshihiko , Fukuda, Katsunori
IPC分类号： H01R13/04
CPC分类号： H05K3/3426 , H01L21/4885 , H01L23/49811 , H01L2924/0002 , H01R12/52 , H01R43/16 , Y02P70/613 , H01L2924/00
摘要： An electrical pin (1) comprises an electrically-conductive pin member (2) having the same diameter over its entire length and head members (3) secured at both ends of the pin member and having an enlarged surface greater in diameter than the pin member and in the same plane of the end surfaces of the pin member. A plurality of the pins (1) are maintained in alignment at a predetermined pitch by means of an electrically conductive layer (10) to which the head members (3) at one end of each pin member (1) is adhered and a dielectric member (13) to which the electrically conductive layer (10) is secured.
摘要翻译：电引脚（1）包括在其整个长度上具有相同直径的导电销构件（2）和固定在销构件的两端处的头部构件（3），并且具有比销构件更大的直径的扩大表面并且在销构件的端面的同一平面中。多个销（1）通过导电层（10）以预定间距保持对准，每个销构件（1）一端的头部构件（3）粘附到该导电层上，并且电介质构件（13），所述导电层（10）固定到所述导电层（13）。

5. 发明授权

EP1202337B1 Fabrication of a probe card 有权
标题翻译：测试卡的制备
公开(公告)号：EP1202337B1
公开(公告)日：2006-06-14
申请号：EP01125135.2
申请日：2001-10-23
申请人： NEC Electronics Corporation
发明人： Mikami, Kazunari, c/o NEC Yamaguchi, Ltd.
IPC分类号： H01L21/66
CPC分类号： H01L24/10 , G01R1/0675 , G01R1/06761 , H01L21/4885 , H01L24/13 , H01L2224/13 , H01L2224/13099 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/181 , H01L2924/00 , H01L2224/0401

6. 发明授权

EP0258056B1 Integrated circuit package having coaxial pins 失效
标题翻译：具有同轴引脚的集成电路封装
公开(公告)号：EP0258056B1
公开(公告)日：1991-11-06
申请号：EP87307594.9
申请日：1987-08-27
申请人： NEC CORPORATION
发明人： Watari, Toshihiko c/o NEC Corporation
IPC分类号： H01L23/50 , H01L25/04 , H05K7/10 , H01L23/52
CPC分类号： H01L21/4885 , H01L23/50 , H01L23/5384 , H01L2224/16225 , H01L2924/01019 , H01L2924/15312 , H01L2924/3011 , H01L2924/3025

7. 发明公开

EP0399721A1 Electrical conductors and methods of making them 失效
标题翻译： Elektrische Leiter und Verfahren zu ihrer Herstellung。
公开(公告)号：EP0399721A1
公开(公告)日：1990-11-28
申请号：EP90305266.0
申请日：1990-05-16
申请人： THE GENERAL ELECTRIC COMPANY, p.l.c.
发明人： Humpston, Giles , Jacobson, David Michael
IPC分类号： C22C5/02 , C22F1/14 , C22F1/10
CPC分类号： H01L21/4821 , C22C5/02 , C22F1/14 , H01L21/4885 , H01L23/48 , H01L2924/0002 , H01L2924/00
摘要： A method of making material in the form of a fine wire or thin strip or sheet suitable for use as electrical conductors comprises: forming an ingot substantially consisting of an alloy of gold and one or more of the metals titanium, lutetium, zirconium, scandium and hafnium, the amount of the or each of said one or more of the metals in the alloy lying in the range from substantially 0.1 at % to an upper limit comprising the atomic percentage of that metal corresponding to the maximum solubility of that metal in the alloy; solution heat treating the ingot and then quenching the ingot from the solution heat treatment temperature; mechanically working the ingot to have a maximum dimension in at least one direction of not greater than 250 µm; and heat treating the resulting material at a temperature below its solvus temperature in an ambient atmosphere containing oxygen and/or nitrogen in the ambient atmosphere.
The conductors exhibit high tensile strength and resistance to elongation under load and retention of such properties after being heated to elevated temperatures for extended periods of time, such as to render them particularly suitable for use as bond-wires in integrated circuit packages.
摘要翻译：制造适合用作电导体的细线或薄条或片的形式的材料的方法包括：形成基本上由金与一种或多种金属钛，镥，锆，钪和铪，合金中所述一种或多种金属中的每种或每种的量在大约0.1at％至上限的范围内，包括对应于该金属在合金中的最大溶解度的该金属的原子百分比 ; 固溶热处理锭，然后从固溶热处理温度淬火锭; 对锭进行机械加工以至少在一个方向上的最大尺寸不大于250μm; 并在环境气氛中在含有氧和/或氮气的环境气氛中，在低于其固溶温度的温度下对所得材料进行热处理。导体表现出高的拉伸强度和耐负载伸长率，并且在长时间加热到升高的温度之后保持这些性能，使得它们特别适合用作集成电路封装中的接合线。

8. 发明公开

EP0002166A3 Carrier for mounting an integrated-circuit chip and method for its manufacture 失效
标题翻译：用于安装集成电路芯片的载体及其制造方法
公开(公告)号：EP0002166A3
公开(公告)日：1979-08-08
申请号：EP78430015
申请日：1978-10-04
申请人： International Business Machines Corporation
发明人： Hammer, Robert , Sachar, Kenneth Selig , Sampogna, Michael
IPC分类号： H01L23/32 , H01L23/48 , H01L21/96 , H05K01/04 , B23P01/08
CPC分类号： H01L21/568 , H01L21/4885 , H01L21/6835 , H01L23/49811 , H01L2924/0002 , H01L2924/00
摘要： Le support comprend une couche diélectrique (2) d'où fait saillie un réseau de broches (6) munies d'un épaulement (7), isolées électriquement entre elles, et un plan de masse (5) isolé électriquement des broches, mais composé du même matériau que celles-ci. Un revêtement isolant (8) couvre le plan (5) et entoure les broches. La fabrication est réalisée par l'électro-érosion d'un substrat du matériau des broches, adjacent à la couche (2), attachée à un support amovible (3). L'isolement électrique des broches est parachevé par une attaque chimique jusqu'à la couche (2) des restes de matériau du substrat laissé autour des broches par l'électro-érosion. Le procédé permet d'éviter tout traitement mécanique tel que l'abrasage ou polissage de la couche (2) en cas d'insertion mécanique de broches.
Peuvent être utilisés dans les dispositifs électroniques à circuits intégrés.
摘要翻译：所述支撑件包括电介质层（2），所述电介质层（2）从所述电介质层（2）突出，所述电介质层（2）从彼此电绝缘的位置突出配备有肩部（7）的销（6）的网络以及与所述引脚电绝缘的接地平面（5）由与后者相同的材料组成。绝缘覆盖物（8）覆盖平面（5）并围绕销。通过与附接到可移除支撑件（3）的层（2）相邻的销的材料的基底的电极化进行生产。只要通过电腐蚀留在引脚周围的基板材料的残留物层（2），化学侵蚀即可完善引脚的电绝缘。在机械插入销的情况下，该过程允许避免任何机械处理，例如层（2）的磨损或抛光。这些支撑件可以用于并入集成电路的电子设备中。

9. 发明公开

EP2674516A1 Méthode de fabrication de nanofils de CuSCN par voie électrochimique 审中-公开
标题翻译： Elektrochemisches Herstellungsverfahren von CuSCN-Nanodrähten
公开(公告)号：EP2674516A1
公开(公告)日：2013-12-18
申请号：EP13171592.2
申请日：2013-06-12
申请人： COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
发明人： CHAPPAZ GILLOT, Cyril , BERSON, Solenn , IVANOVA-HRISTOVA, Valentina , SALAZAR ROMERO, Raul
IPC分类号： C25D3/38 , C25D9/08
CPC分类号： H01L21/4885 , C25D3/38 , C25D9/08
摘要： Ce procédé d'élaboration, sur un substrat conducteur ou semi-conducteur, de nanofils à base de CuSCN comprenant les étapes suivantes :
- préparation d'une solution aqueuse électrolytique à partir d'un sel de Cu(II) à une concentration inférieure à 120 mM, d'un complexant de Cu(II) de la famille des acides aminocarboxyliques et d'un sel de thiocyanate, ladite solution présentant un pH compris entre 0,1 et 3 ;
- dépôt par voie électrochimique de la solution aqueuse électrolytique sur le substrat.
摘要翻译：在导电或半导体衬底上形成基于硫氰酸铜（I）的纳米线，包括：从浓度低于120mM的铜（II）盐制备含水电解液，来自氨基羧酸的铜（II）络合剂酸族和硫氰酸盐; 并将电解液沉积在基底上。溶液的pH值为0.1-3。还包括用于制造光电子器件的独立权利要求，包括通过上述方法在导体或半导体衬底上沉积透明p型半导体。

10. 发明公开

EP2645409A1 TRANSFER SUBSTRATE FOR FORMING METAL WIRING AND METHOD FOR FORMING METAL WIRING USING SAID TRANSFER SUBSTRATE 审中-公开
标题翻译：传输衬底形成用于形成金属布线与本转移基质金属布线和方法
公开(公告)号：EP2645409A1
公开(公告)日：2013-10-02
申请号：EP11843493.5
申请日：2011-11-18
申请人： Tanaka Kikinzoku Kogyo K.K.
发明人： OGASHIWA, Toshinori , KURITA, Masaaki , NISHIMORI, Takashi , KANEHIRA, Yukio
IPC分类号： H01L21/60
CPC分类号： H01L21/4885 , B22F7/08 , B23K1/0016 , B23K35/0244 , B23K35/3006 , B23K35/3013 , B23K35/322 , B23K2101/40 , B81C1/00095 , B81C1/00373 , B81C2201/0188 , B81C2201/0194 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/94 , H01L2224/03003 , H01L2224/031 , H01L2224/0312 , H01L2224/03334 , H01L2224/0401 , H01L2224/0508 , H01L2224/05082 , H01L2224/05083 , H01L2224/05139 , H01L2224/05144 , H01L2224/05166 , H01L2224/05169 , H01L2224/05639 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05669 , H01L2224/0567 , H01L2224/05671 , H01L2224/05673 , H01L2224/05676 , H01L2224/05678 , H01L2224/05681 , H01L2224/05684 , H01L2224/11003 , H01L2224/111 , H01L2224/1112 , H01L2224/11334 , H01L2224/13082 , H01L2224/13083 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13166 , H01L2224/13169 , H01L2224/1317 , H01L2224/13171 , H01L2224/13173 , H01L2224/13176 , H01L2224/13178 , H01L2224/13181 , H01L2224/13184 , H01L2224/94 , H01L2924/01006 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/01073 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/1461 , H01L2924/15788 , H01L2224/05644 , H01L2924/00014 , H01L2924/01046 , H01L2924/00012 , H01L2924/00 , H01L2224/11
摘要： The present invention provides a transfer substrate for transferring a metal wiring material to a transfer-receiving object, the transfer substrate comprising a substrate, at least one metal wiring material formed on the substrate and an underlying metal film formed between the substrate and the metal wiring material, wherein the metal wiring material is a molded article prepared by sintering, e.g., gold powder having a purity of 99.9% by weight or more and an average particle size of 0.01 µm to 1.0 µm and the underlying metal film is composed of a metal such as gold or an alloy. The transfer substrate is capable of transferring a metal wiring material to the transfer-receiving object even at a temperature for heating the transfer-receiving object of 80 to 300°C.
摘要翻译：本发明提供了一转印衬底转移环的金属布线材料到转印接收对象，包括：基板上的转印用基板中，至少一个金属布线的材料形成的基材和对底层金属膜形成的基板和金属布线之间材料，worin金属布线材料是通过烧结制备的模制品，例如，具有按重量计以上且上的0点01微米至1.0微米的平均粒径和底层金属电影的纯度99.9％的金粉末是由金属的：诸如金或合金制成。转印基板能够传递环的金属布线材料到转印接收对象的甚至在温度为80转印接收对象加热至300℃

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式