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1. 发明授权

EP3107684B1 BRAZING ALLOY WIRES AND METHOD OF BRAZING 有权
公开(公告)号：EP3107684B1
公开(公告)日：2018-09-26
申请号：EP15705027.9
申请日：2015-02-19
申请人： Morgan Advanced Ceramics, Inc.
发明人： MIKLOS, Mark , ZIANI, Abdelouahab
IPC分类号： B22F1/00 , B22F3/17 , B22F7/08 , C22F1/14 , B23K35/30 , B22F5/12 , B23K35/40 , B23K35/02 , C22C19/05 , C22C5/02 , C21D7/10 , B21C1/02
CPC分类号： B23K35/0227 , B21C1/02 , B22F1/0011 , B22F3/17 , B22F5/12 , B22F7/08 , B22F2998/10 , B23K35/0244 , B23K35/0261 , B23K35/0266 , B23K35/3013 , B23K35/3033 , B23K35/304 , B23K35/40 , B23K35/406 , C21D7/10 , C22C5/02 , C22C19/058 , C22C30/00 , C22F1/10 , C22F1/14 , B22F2003/248
摘要： Brazing alloy wire formed from a composite comprising a sheath of at least one ductile first phase and a core comprising particles of a different composition to the sheath, in which: the sheath has an annealing temperature in degrees K the particles have a melting point at least 20% above the annealing temperature of the sheath the particles have a size distribution in which 25% by weight or less comprise particles less than 25 μm in size the particles are discrete.

2. 发明公开

EP3322549A1 STABLE UNDERCOOLED METALLIC PARTICLES FOR ENGINEERING AT AMBIENT CONDITIONS 审中-公开
公开(公告)号：EP3322549A1
公开(公告)日：2018-05-23
申请号：EP16824809.4
申请日：2016-07-12
申请人： Iowa State University Research Foundation, Inc.
发明人： THUO, Martin , CINAR, Simge , TEVIS, Ian, D.
IPC分类号： B22F9/24 , B22F3/105 , B33Y30/00
CPC分类号： C22C28/00 , B22D27/08 , B22D27/11 , B22F1/0062 , B22F1/02 , B22F7/064 , B23K35/0244 , B23K35/262 , B23K35/264 , B23K35/3006 , B23K35/3013 , B23K35/3618
摘要： Undercooled liquid metallic core-shell particles, whose core is stable against solidification at ambient conditions, i.e. under near ambient temperature and pressure conditions, are used to join or repair metallic non-particulate components. The undercooled-shell particles in the form of nano-size or micro-size particles comprise an undercooled stable liquid metallic core encapsulated inside an outer shell, which can comprise an oxide or other stabilizer shell typically formed in-situ on the undercooled liquid metallic core. The shell is ruptured to release the liquid phase core material to join or repair a component(s).

3. 发明公开

EP3124166A4 COATED SOLDER MATERIAL AND METHOD FOR PRODUCING SAME 审中-公开
标题翻译： BESCHICHTETESLÖTMATERIALUND VERFAHREN ZUR HERSTELLUNG DAVON
公开(公告)号：EP3124166A4
公开(公告)日：2017-09-27
申请号：EP15769736
申请日：2015-03-24
申请人： SUMITOMO METAL MINING CO
发明人： KOBAYASHI HIROSHI , YAMABE HIDETOSHI , MIYAUCHI KYOKO
IPC分类号： B23K35/26 , B23K35/02 , B23K35/14 , B23K35/28 , B23K35/30 , B23K35/36 , B23K35/363 , B23K35/38 , B23K35/40 , C23C16/26 , C23C16/50
CPC分类号： B23K35/0233 , B23K35/02 , B23K35/0222 , B23K35/0227 , B23K35/0244 , B23K35/26 , B23K35/262 , B23K35/264 , B23K35/268 , B23K35/28 , B23K35/282 , B23K35/3013 , B23K35/3612 , B23K35/3613 , B23K35/38 , B23K35/383 , B23K35/40 , B23K35/404 , C23C16/26 , C23C16/50
摘要： The present invention provides a coated solder material that is capable of preventing the advancement of oxidation of the surface during long-term storage and when melted, and that has excellent wetting extendability and bondability, without the occurrence of gaps in the bonded areas. A coating film is formed on the surface of a solder material; the coating film including a carbon compound that is formed by introducing an organic compound having a carbon number of 8 or less together with a carrier gas into a reaction gas that has been plasmatized under atmospheric pressure, and after a radicalized organic compound has been formed by radicalizing the organic compound, causing the radicalized organic compound to react with the metal on the surface of the solder material; the thickness of the coating film is 4 nm to 200 nm, and when heated at 150°C to 300°C and melted, the mass-reduction rate is 60% or greater.
摘要翻译：本发明提供一种涂层焊料，其能够防止长期储存期间和熔融时表面氧化的进展，并且具有优异的润湿延伸性和粘合性，而不会在粘合区域出现间隙。在焊料材料的表面上形成涂膜; 所述涂膜包含通过将碳数为8以下的有机化合物与载气一起导入在大气压下等离子体化的反应气体中，并在形成自由基化有机化合物之后形成的碳化合物自由基化有机化合物，使自由基化的有机化合物与焊料表面上的金属反应; 涂膜的厚度为4nm〜200nm，在150℃〜300℃下加热熔融时，质量减少率为60％以上。

4. 发明公开

EP2121231A4 HIGH TEMPERATURE SOLDER MATERIALS 审中-公开
标题翻译： HOCHTEMPERATUR-LÖTMATERIALIEN
公开(公告)号：EP2121231A4
公开(公告)日：2016-12-28
申请号：EP08728001
申请日：2008-01-22
申请人： UNIV OF MARYLAND
发明人： MCCLUSKEY F PATRICK , QUINTERO PEDRO
IPC分类号： B23K1/19 , B23K20/16 , B23K20/22 , B23K35/24 , B23K35/36
CPC分类号： B23K35/262 , B23K35/3006 , B23K35/3013 , B23K35/302
摘要： A solder material is formed utilizing a transient liquid phase sintering process, where a precursor material is first formed. The precursor material comprises a plurality of metal particles including a first metal having a first melting point temperature and a second metal having a second melting point temperature, the first melting point temperature being greater than the second melting point temperature. The precursor material is heated to a process temperature (Tp) that is greater than the second melting point temperature and less than the first melting point temperature, and the precursor material is isothermally held at the process temperature (Tp) for a preselected holding period so as to form a metal alloy material having a melting point temperature that is greater than the process temperature. The solder material can be used to bond two components together in a device specified for use at an application temperature (Ta), where Ta/Tp>1.
摘要翻译：使用瞬态液相烧结工艺形成焊料材料，其中首先形成前体材料。前体材料包括多个金属颗粒，其包括具有第一熔点温度的第一金属和具有第二熔点温度的第二金属，第一熔点温度大于第二熔点温度。将前体材料加热到大于第二熔点温度并小于第一熔点温度的工艺温度（Tp），并将前体材料在加工温度（Tp）下恒温保持预选保持期，从而以形成熔点温度大于工艺温度的金属合金材料。可以使用焊料材料将两个部件连接在规定用于应用温度（Ta）的器件中，其中Ta / Tp> 1。

5. 发明公开

EP3079764A1 DIRECT INTEGRATION OF FEEDTHROUGH TO IMPLANTABLE MEDICAL DEVICE HOUSING USING A GOLD ALLOY 审中-公开
标题翻译：通过在壳体中直接积分与金合金的可植入医疗装置
公开(公告)号：EP3079764A1
公开(公告)日：2016-10-19
申请号：EP14833382.6
申请日：2014-12-10
申请人： Heraeus Deutschland GmbH & Co. KG
发明人： MARKHAM, Jacob , HAUSCH, Ulrich
IPC分类号： A61N1/375 , B23K1/00 , B23K1/008 , B23K35/02
CPC分类号： A61N1/3754 , B23K1/0008 , B23K1/0016 , B23K1/008 , B23K1/20 , B23K35/007 , B23K35/0222 , B23K35/0244 , B23K35/0255 , B23K35/28 , B23K35/30 , B23K35/3013 , B23K35/38 , B23K35/383 , B23K2101/36 , B23K2103/14 , C21D9/50 , C22C5/02
摘要： One aspect provides a method of attaching a feedthrough to a titanium housing of an implantable medical device. The method includes providing the housing with a flange forming a recess about an opening through the housing, the opening disposed within the recess. A feedthrough is positioned within the recess so as to form a gap between the flange and an insulator of the feedthrough. A braze preform is then positioned within the recess about the insulator, the braze preform comprising a biocompatible braze material having a melting point less than a β-transus temperature of the titanium of the housing. The preform is melted at a temperature less than the β-transus temperature of the titanium of the housing such that the melted braze material fills at least the gap, and then cooled to form a braze joint which bonds the insulator to the housing and hermetically seals the opening.
摘要翻译：一个方面提供了通过可植入医疗装置的外壳钛附的进料的方法。该方法包括提供具有凸缘在大约通过壳体开口，在凹部内设置在所述开口中形成的凹部的壳体。甲馈通在凹部内定位，以便形成凸缘之间，并且在穿通线的绝缘体的间隙。甲钎焊预制件然后在绝缘体中，钎焊预成形件，其包括具有熔点低于所述壳体的钛的β转变温度的生物相容的钎焊材料在凹部内的位置。预成型体在低于壳体搜索的钛的β转变温度的温度下熔化，DASS模具熔融钎焊材料填充至少所述间隙，然后冷却，以形成钎焊接头哪个结合所述绝缘体到所述外壳和气密地密封开口。

7. 发明公开

EP2998048A1 Metallsinterzubereitung und deren Verwendung zum Verbinden von Bauelementen 审中-公开
标题翻译：烧结金属的制备和它们用于连接结构元件使用
公开(公告)号：EP2998048A1
公开(公告)日：2016-03-23
申请号：EP14185159.2
申请日：2014-09-17
申请人： Heraeus Deutschland GmbH & Co. KG
发明人： Nachreiner, Jens , Schäfer, Michael
IPC分类号： B22F1/00 , B22F7/06 , B23K35/34 , H01L23/00
CPC分类号： B22F1/0062 , B22F1/0055 , B22F7/062 , B22F2001/0066 , B23K35/286 , B23K35/3006 , B23K35/3013 , B23K35/302 , B23K35/322 , B23K35/34 , B23K35/36 , B23K35/3612 , H01L24/83 , H01L2224/8384 , H01L2924/13055 , H01L2924/00
摘要： Metallsinterzubereitung, die (A) 50 bis 90 Gew.-% wenigstens eines Metalls, das in Form von Partikeln vorliegt, die ein Coating aufweisen, das wenigstens eine organische Verbindung enthält, und (B) 6 bis 50 Gew.-% eines Gemischs mindestens zweier organischer Lösemittel umfasst, dadurch gekennzeichnet, dass das Lösemittelgemisch (B) 30 bis ≤ 70 Gew.-% Adipinsäuredimethylester als eines der organischen Lösemittel und weniger als 30 Gew.-% Glutarsäuredimethylester plus Bernsteinsäuredimethylester enthält.
摘要翻译：金属烧结组合物，包括（A）50〜90重量％的至少一种金属存在于具有含有至少一种有机化合物，和（B）的涂层的颗粒的形式的％6至50重量的混合物的％的至少两种有机溶剂包括，其特征在于，所述溶剂混合物（B）为30〜70‰¤包括重量的己二酸二甲酯的％作为有机溶剂中的一个和戊二酸二甲酯琥珀酸二甲酯的小于30重量％尤佳。

8. 发明公开

EP2833393A1 CONDUCTIVE PASTE FOR DIE BONDING, AND DIE BONDING METHOD USING CONDUCTIVE PASTE FOR DIE BONDING 审中-公开
标题翻译：导电膏芯片安装和芯片安装方法使用芯片安装导电膏
公开(公告)号：EP2833393A1
公开(公告)日：2015-02-04
申请号：EP13767655.7
申请日：2013-03-21
申请人： Tanaka Kikinzoku Kogyo K.K.
发明人： OGASHIWA, Toshinori , SHIOYA, Akikazu , MIYAIRI, Masayuki
IPC分类号： H01L21/52 , H01B1/00 , H01B1/22
CPC分类号： H01L24/83 , B22F1/0074 , B22F1/025 , B23K1/203 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/226 , B23K35/3006 , B23K35/3013 , B23K35/302 , B23K35/322 , B23K2201/40 , H01B1/22 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/81 , H01L2224/0401 , H01L2224/04026 , H01L2224/05082 , H01L2224/05166 , H01L2224/05169 , H01L2224/05644 , H01L2224/11312 , H01L2224/11318 , H01L2224/1132 , H01L2224/11416 , H01L2224/13294 , H01L2224/13339 , H01L2224/13347 , H01L2224/13364 , H01L2224/13444 , H01L2224/16227 , H01L2224/27312 , H01L2224/27318 , H01L2224/2732 , H01L2224/27416 , H01L2224/29294 , H01L2224/29339 , H01L2224/29347 , H01L2224/29364 , H01L2224/29444 , H01L2224/32225 , H01L2224/81192 , H01L2224/81203 , H01L2224/81444 , H01L2224/8184 , H01L2224/83192 , H01L2224/83203 , H01L2224/83444 , H01L2224/8384 , H01L2924/01029 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01203 , H01L2924/014 , H01L2924/10253 , H01L2924/15747 , H01L2924/351 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： The present invention provides a conductive paste for die bonding comprising a metal powder and an organic solvent, the metal powder comprising: one or more metal particles selected from a silver powder, a palladium powder, and a copper powder, the metal particles having a purity of 99.9% by mass or higher and an average particle size of 0.01 µm to 1.0 µm; and a coating layer made of gold covering at least part of the metal particles. The conductive paste according to the present invention can suppress the occurrence of defects such as voids in a bonded part when a semiconductor element or the like is die-bonded to a substrate.
摘要翻译：本发明提供的导电性糊的芯片接合包括金属粉末和溶剂的有机，金属粉末，其包括：一个或由银粉末，钯粉末，和铜粉选择多种金属颗粒，具有纯度金属粒子的质量或更高，上的0点01微米的平均颗粒尺寸为1.0微米的99.9％; 和涂膜层由金制成的覆盖所述金属颗粒的至少一部分。导电膏gemäß到本发明可以抑制缺陷的发生：例如在接合部的空隙当半导体元件等被管芯键合到基材上。

9. 发明公开

EP2734330A1 METHOD FOR BRAZING METAL PARTS COMPRISING COPPER, SILVER AND/OR GOLD AND ONE PART HAVING A LAYER OF SUCH BASE MATERIAL AND PHOSPHORUS 审中-公开
标题翻译：方法钎具铜，银和/或金及部分金属部件与这样的基础材料和磷层
公开(公告)号：EP2734330A1
公开(公告)日：2014-05-28
申请号：EP12745604.4
申请日：2012-07-20
申请人： Harris, Joseph, W.
发明人： Harris, Joseph, W.
IPC分类号： B23K1/00 , B23K1/19 , A44C27/00 , B23K35/30 , C22C5/02 , C22C5/08 , C22C9/00
CPC分类号： B23K1/0008 , B23K1/19 , B23K35/3006 , B23K35/3013 , B23K35/302 , B23K2201/06 , B23K2203/08 , B23K2203/12 , C22C5/08 , C22C9/00
摘要： A method of forming a brazed joint (40) is provided in which a surface portion (12) of a first metal part (10) is placed in contact with a surface portion (22) of a second metal part (20) to form a contact area (30) therebetween, and the first metal part (10) and second metal part (20) include copper, silver and/or gold as the primary base metal (s) and at least the surface portion (12) of the first metal part (10) is a modified alloy of the primary base metal (s) having 0.5-12 wt. % phosphorus as a modifier. The surface portion (12) of the first metal part (10) is heated to a temperature sufficient to cause the phosphorus to wet the surface portion (22) of the second metal part (20) and to flow a low melting portion of the surface portion (12) of the first metal part (10) into the contact area (30) by capillary attraction to form the brazed joint (40) between the first metal part (10) and the second metal part (20).

10. 发明公开

EP2726138A1 A GUIDE WIRE DEVICE INCLUDING A SOLDERABLE LINEAR ELASTIC NICKEL-TITANIUM DISTAL END SECTION AND METHODS OF PREPARATION THEREFOR 审中-公开
标题翻译： FÜHRUNGSDRAHTVORRICHTUNG麻醉师EINERLÖTFÄHIGENLINEARELASTISCHEN尼克 - 蒂坦 - 维多利亚VERFAHREN ZU IHRER HERSTELLUNG
公开(公告)号：EP2726138A1
公开(公告)日：2014-05-07
申请号：EP12733280.7
申请日：2012-06-18
申请人： Abbott Cardiovascular Systems Inc.
发明人： PURTZER, Raleigh, A.
IPC分类号： A61M25/09 , C21D7/02
CPC分类号： A61M25/09 , A61M2025/09083 , A61M2025/09108 , A61M2025/09133 , B23K35/007 , B23K35/025 , B23K35/30 , B23K35/3006 , B23K35/3013 , B23K2203/05 , B23K2203/14 , B23K2203/26 , C21D7/02 , C21D2201/01 , C21D2211/001 , C21D2211/008 , C22F1/006 , C22F1/10 , C22F1/183
摘要： Shapeable guide wire devices and methods for their manufacture. Guide wire devices include an elongate shaft member having a shapeable distal end section that is formed from a linear pseudoelastic nickel-titanium (Ni—Ti) alloy that has linear pseudoelastic behavior without a phase transformation or onset of stress-induced martensite. Linear pseudoelastic Ni—Ti alloy, which is distinct from non-linear pseudoelastic (i.e., superelastic) Ni—Ti alloy, is highly durable, corrosion resistant, and has high stiffness. The shapeable distal end section is shapeable by a user to facilitate guiding the guide wire through tortuous anatomy. In addition, linear pseudoelastic Ni—Ti alloy is more durable tip material than other shapeable tip materials such as stainless steel.
摘要翻译：可塑导丝装置及其制造方法。导丝装置包括细长轴构件，其具有由线性假弹性镍钛（Ni-Ti）合金形成的可成形的远端部分，所述线性假弹性镍 - 钛（Ni-Ti）合金具有线性假弹性特性而没有相变或应力诱发的马氏体的开始。与非线性假弹性（即超弹性）Ni-Ti合金不同的线性假弹性Ni-Ti合金具有高耐用性，耐腐蚀性，并且具有高刚度。可成形的远端部分可由使用者塑造，以便于通过曲折的解剖结构引导导丝。此外，线性假弹性Ni-Ti合金比其他可成型的尖端材料（如不锈钢）更耐用。

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