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1. 发明公开

EP0560096A3 Apparatus for measuring bend amount of IC leads 失效
标题翻译：用于测量IC引线弯曲量的装置
公开(公告)号：EP0560096A3
公开(公告)日：1993-11-03
申请号：EP93102569.6
申请日：1993-02-18
申请人： NEC CORPORATION
发明人： Kida, Tomoyuki, c/o NEC Corporation
IPC分类号： H01L21/66
CPC分类号： H01L21/67288 , G01N21/95684 , G01N2021/8887 , G01N2021/95661 , G01N2201/102 , G01R31/311 , H01L21/67271 , H01L22/00 , H05K13/08
摘要： A lead-bend measuring apparatus comprising: an illuminating device (4a-4e) for projecting light onto leads projecting from a package of an integrated circuit device; an imaging device (1,10,11) for imaging light reflected from and transmitted through the leads; a cutout device (16,19b) for fetching an image of the imaged light and dividing the image into a plurality of sections; a binarization processing device (17,20b) for processing gradations of the image with different binarization levels for each of the divided sections; a profile counter device (21) for preparing profiles of various portions of the leads corresponding to the respective sections from binarized data subjected to processing by the binarization processing device; a calculating device (22,25) for calculating a deviation of each of the prepared profiles from a reference profile and determining an amount of bend of each of the leads; and a device (24) for determining a non-defective or defective state by making a comparison between the amount of bent calculated and allowable values. The respective sections are processed by corresponding binarization levels to measure the bend of leads, so that clear binarized images are obtained even if the illuminance of the various portions of the leads is not uniform.
摘要翻译：一种铅笔测量装置，包括：照明装置（4a-4e），用于将光投射到从集成电路装置的封装突出的引线上; 用于对从所述引线反射并透过所述引线的光成像的成像装置（1,10,11）切割装置（16,19b），用于取出成像光的图像并将图像分割成多个部分; 二进制化处理装置（17,20b），用于处理每个分割部分的不同二值化级别的图像的灰度; 配置计数器装置（21），用于从二进制化处理装置进行处理的二值化数据中准备对应于各个部分的引线的各部分的轮廓; 计算设备（22,25），用于计算每个准备的轮廓与参考轮廓的偏差并确定每个引线的弯曲量; 以及通过比较弯曲计算量和允许值之间的比较来确定无缺陷状态或故障状态的装置（24）。相应的部分由相应的二值化级别处理以测量引线的弯曲，使得即使引线的各个部分的照度不均匀，也可以获得清晰的二值化图像。

2. 发明公开

EP1297326A2 OPTICAL SYSTEM 审中-公开
标题翻译：光学系统
公开(公告)号：EP1297326A2
公开(公告)日：2003-04-02
申请号：EP01950394.5
申请日：2001-06-22
申请人： TERADYNE, INC.
发明人： SCHMIDT, Peter, E. , LIPSON, Pamela R. , BOWMAN, John, C.
IPC分类号： G01N21/956 , G01N21/88 , G01R31/309
CPC分类号： G01N21/8806 , G01N21/95684 , G01N2021/8812 , G01N2021/8816 , G01N2021/8825 , G01N2021/8838 , G01N2021/8845 , G01N2021/95638 , G01N2021/95661 , G01N2021/95669 , G01N2201/062
摘要： An optical system for use in an inspection system is described. The optical system includes an imaging system which may be provided as a multi-spectral band pass image recording system and a lighting system which includes at least one coaxial light and at least one side light to provide spectral discrimination and to provide contrast between a first surface made from a first material and a second surface made from a second different material.
摘要翻译：描述了用于检查系统的光学系统。该光学系统包括可以作为多光谱带通图像记录系统提供的成像系统以及包括至少一个同轴光和至少一个侧光的照明系统，以提供光谱区分并提供第一表面由第一材料制成，第二表面由第二种不同材料制成。

3. 发明授权

EP1217357B1 Inspection apparatus and method for electrode plate-connected structure for secondary cell 有权
标题翻译：的方法和装置，用于二次电池电极板的连接结构的验证
公开(公告)号：EP1217357B1
公开(公告)日：2015-10-28
申请号：EP01129102.8
申请日：2001-12-07
申请人： Panasonic Corporation , TOYOTA JIDOSHA KABUSHIKI KAISHA
发明人： Nakanishi, Toshiaki , Nakagawa, Yugo
IPC分类号： G01N21/88 , H01M2/26 , H01M10/42 , G01N21/956 , H01M10/34
CPC分类号： G01N21/88 , G01N2021/95661 , H01M2/266 , H01M10/34 , H01M10/4285

4. 发明公开

EP2492633A1 Three-dimensional shape measurement apparatus and three-dimensional shape measurement method 有权转让
标题翻译： Verfahren und Vorrichtungfürdreidimensionale Formvermessung
公开(公告)号：EP2492633A1
公开(公告)日：2012-08-29
申请号：EP11186829.5
申请日：2011-10-27
申请人： OMRON Corporation
发明人： Ogino, Hirotaka , Honma, Yuki , Wada, Hirotaka
IPC分类号： G01B11/06 , G01B11/25 , G01N21/956
CPC分类号： G01B11/0608 , G01B11/2522 , G01N21/95684 , G01N2021/95661 , G01N2021/95669
摘要： A three-dimensional shape measurement apparatus is provided that calculates the height of solder accurately. An approximation surface of a wiring pattern is prepared for an inspection block prior to the application of solder (S22). Furthermore, an approximation surface of lands is prepared for an inspection block prior to the application of solder (S23). Then, based on the prepared approximation surface Sr of the wiring pattern and the approximation surface Sl of the lands, an offset, that is, the distance between the approximation surface Sr of the wiring pattern and the approximation surface Sl of the lands is calculated (S24). Then, the calculated offset is stored in a RAM or the like (S25). Then, after the application of solder, the stored offset is read out, and the height of the solder is calculated.
摘要翻译：提供了一种准确计算焊料的高度的三维形状测量装置。在施加焊料之前准备用于检查块的布线图案的近似表面（S22）。此外，在施加焊料之前，为检查块准备焊盘的近似表面（S23）。然后，基于布线图案的准备的近似表面Sr和焊盘的近似表面S1，计算偏移，即布线图案的近似表面Sr与焊盘的近似表面S1之间的距离（ S24）。然后，计算的偏移量存储在RAM等中（S25）。然后，在施加焊料之后，读出所存储的偏移量，并计算焊料的高度。

5. 发明公开

EP1809087A3 Verfahren und Vorrichtung zur Koplanaritätsmessung von Bauelementanschlüssen 审中-公开
标题翻译：用于组分引线的共面性的方法和装置
公开(公告)号：EP1809087A3
公开(公告)日：2013-07-24
申请号：EP07100456.8
申请日：2007-01-12
申请人： ASM Assembly Systems GmbH & Co. KG
发明人： Besch, Karl-Heinz , Hedrich, Matthias , Neumaier, Klaus
IPC分类号： H05K13/04 , H05K13/08
CPC分类号： H05K13/08 , G01N2021/95661
摘要： Die vorliegende Erfindung beschreibt Vorrichtung zur Lagevermessung von Bauelementanschlüssen (32, 232, 432, 532) eines Bauelements (30, 230),
mit einem Laser (40, 240, 440, 540) zum Ausstrahlen von Laserlicht (42, 242, 542), insbesondere eines Laserstrahls (42, 242, 542), in Richtung der Bauelementanschlüsse (32, 232, 432, 532),
mit einer Kamera (50, 250, 450, 550) zum Aufnehmen von Bilddaten des von den Bauelementanschlüssen (32, 232, 432, 532) rückgestreuten Lichts (44, 244),
mit einer Bildauswerteeinrichtung (350) zur Bestimmung der Lage der Bauelementanschlüsse (32, 232, 432, 532) mittels der Bilddaten, insbesondere zur Höhenbestimmung und/oder Koplanaritäts-Überprüfung der Bauelementanschlüsse (32, 232, 432, 532),
wobei Laser (40, 240, 440, 540) und Kamera (50, 250, 450, 550) in Bezug auf eine Mittelachse (238, 538) der Bauelementanschlüsse (32, 232, 432, 532) oder in Bezug auf eine Oberflächennormale (238, 538) des Bauelements (30, 230) auf einer Seite angeordnet sind.

6. 发明公开

EP1210638A4 METHOD/SYSTEM MEASURING OBJECT FEATURES WITH 2D AND 3D IMAGING COORDINATED 审中-公开
标题翻译：方法/测量系统的对象属性，并协调2D和3D图像
公开(公告)号：EP1210638A4
公开(公告)日：2008-07-16
申请号：EP00936499
申请日：2000-06-07
申请人： ROBOTIC VISION SYSTEMS
发明人： LIU KUO-CHING
IPC分类号： G02B26/10 , G01B11/00 , G01B11/03 , G01B11/245 , G01N21/88 , H01L21/66
CPC分类号： G01B11/002 , G01B11/245 , G01N21/8806 , G01N21/8851 , G01N21/95684 , G01N2021/95661
摘要： A system and method are disclosed for highly efficient imaging of selected object features utilizing, in combination, a 2D imaging subsystem (100) and a 3D imaging subsystem (110) wherein data from the 2D imaging subsystem (100) is used to predetermine areas containing 3D features of interest such that delay attributable to imaging of areas of non-interest for 3D features is minimized.

7. 发明公开

EP1217357A2 Inspection apparatus and method for electrode plate-connected structure for secondary cell 有权
标题翻译：的方法和装置，用于二次电池电极板的连接结构的验证
公开(公告)号：EP1217357A2
公开(公告)日：2002-06-26
申请号：EP01129102.8
申请日：2001-12-07
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , TOYOTA JIDOSHA KABUSHIKI KAISHA
发明人： Nakanishi, Toshiaki , Nakagawa, Yugo
IPC分类号： G01N21/84 , G01N21/95 , H01M10/14
CPC分类号： G01N21/88 , G01N2021/95661 , H01M2/266 , H01M10/34 , H01M10/4285
摘要： The present invention provides an inspection apparatus for an electrode plate-connected structure for a secondary cell for inspecting each bonding portion of an electrode plate-connected structure for a secondary cell including a plurality of electrode plates which are arranged in parallel to one another at prescribed intervals and are perpendicularly connected to a power collecting plate. The apparatus is characterized by including: a lighting section for irradiating light to each of the bonded portions of the plurality of electrode plates and the power collecting plate; a light receiving section for detecting a projected image of each of the bonded portions based on the light irradiated to the electrode plate-connected structure by the lighting section; and an evaluation section for evaluating a bonding state of each of the bonding portions based on the projected image of each of the bonded portions detected by the light receiving section.
摘要翻译：本发明提供了到检查装置上电极板连接的结构的二次电池用于检查的电极板连接结构的每个接合部分，用于包括电极板的多个（11）布置在平行于一个二次电池另一以预定的间隔和垂直地连接到集电板（12）。该装置是由包括为特征：发光部（4），用于将光照射到每个电极板和集电板的所述多个键合部; 用于检测各基于照射到由照明部的电极板连接的结构中的光的接合部分中的投影图像光接收部（5）; 和评定每个基于由所述光接收部检测到的键合部分中的投影图像上的键合部的的接合状态评价部。

8. 发明公开

EP1809087A2 Verfahren und Vorrichtung zur Koplanaritätsmessung von Bauelementanschlüssen 审中-公开
标题翻译： Verfahren und Vorrichtung zurKoplanaritätsmessungvonBauelementanschlüssen
公开(公告)号：EP1809087A2
公开(公告)日：2007-07-18
申请号：EP07100456.8
申请日：2007-01-12
申请人： SIEMENS AKTIENGESELLSCHAFT
发明人： Besch, Karl-Heinz , Hedrich, Matthias , Neumaier, Klaus
IPC分类号： H05K13/04
CPC分类号： H05K13/08 , G01N2021/95661
摘要： Die vorliegende Erfindung beschreibt Vorrichtung zur Lagevermessung von Bauelementanschlüssen (32, 232, 432, 532) eines Bauelements (30, 230),
mit einem Laser (40, 240, 440, 540) zum Ausstrahlen von Laserlicht (42, 242, 542), insbesondere eines Laserstrahls (42, 242, 542), in Richtung der Bauelementanschlüsse (32, 232, 432, 532),
mit einer Kamera (50, 250, 450, 550) zum Aufnehmen von Bilddaten des von den Bauelementanschlüssen (32, 232, 432, 532) rückgestreuten Lichts (44, 244),
mit einer Bildauswerteeinrichtung (350) zur Bestimmung der Lage der Bauelementanschlüsse (32, 232, 432, 532) mittels der Bilddaten, insbesondere zur Höhenbestimmung und/oder Koplanaritäts-Überprüfung der Bauelementanschlüsse (32, 232, 432, 532),
wobei Laser (40, 240, 440, 540) und Kamera (50, 250, 450, 550) in Bezug auf eine Mittelachse (238, 538) der Bauelementanschlüsse (32, 232, 432, 532) oder in Bezug auf eine Oberflächennormale (238, 538) des Bauelements (30, 230) auf einer Seite angeordnet sind.
摘要翻译：该方法包括使用激光器（240）在组件（230）的电路点（232）的方向上发射激光束。使用相机（250）记录从分量电路点反向散射的光。确定组件电路点的共面性。照相机和激光器相对于侧面上的部件电路点的中心轴线（238）布置。还包括用于位置测量的装置的独立权利要求。共面度测量，元件电路点。

9. 发明公开

EP1217357A3 Inspection apparatus and method for electrode plate-connected structure for secondary cell 有权
标题翻译：的方法和装置，用于二次电池电极板的连接结构的验证
公开(公告)号：EP1217357A3
公开(公告)日：2006-05-31
申请号：EP01129102.8
申请日：2001-12-07
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , Toyota Jidosha Kabushiki Kaisha
发明人： Nakanishi, Toshiaki , Nakagawa, Yugo
IPC分类号： G01N21/84 , G01N21/95 , H01M10/14
CPC分类号： G01N21/88 , G01N2021/95661 , H01M2/266 , H01M10/34 , H01M10/4285
摘要： The present invention provides an inspection apparatus for an electrode plate-connected structure for a secondary cell for inspecting each bonding portion of an electrode plate-connected structure for a secondary cell including a plurality of electrode plates (11) which are arranged in parallel to one another at prescribed intervals and are perpendicularly connected to a power collecting plate (12). The apparatus is characterized by including: a lighting section (4) for irradiating light to each of the bonded portions of the plurality of electrode plates and the power collecting plate; a light receiving section (5) for detecting a projected image of each of the bonded portions based on the light irradiated to the electrode plate-connected structure by the lighting section; and an evaluation section for evaluating a bonding state of each of the bonding portions based on the projected image of each of the bonded portions detected by the light receiving section.

10. 发明公开

EP1210638A1 METHOD/SYSTEM MEASURING OBJECT FEATURES WITH 2D AND 3D IMAGING COORDINATED 审中-公开
标题翻译：方法/测量系统的对象属性，并协调2D和3D图像
公开(公告)号：EP1210638A1
公开(公告)日：2002-06-05
申请号：EP00936499.3
申请日：2000-06-07
申请人： Robotic Vision Systems Inc.
发明人： LIU, Kuo-Ching
IPC分类号： G02B26/10 , G01B11/03
CPC分类号： G01B11/002 , G01B11/245 , G01N21/8806 , G01N21/8851 , G01N21/95684 , G01N2021/95661
摘要： A system and method are disclosed for highly efficient imaging of selected object features utilizing, in combination, a 2D imaging subsystem (100) and a 3D imaging subsystem (110) wherein data from the 2D imaging subsystem (100) is used to predetermine areas containing 3D features of interest such that delay attributable to imaging of areas of non-interest for 3D features is minimized.

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