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1. 发明授权

EP1703465B1 Color-based inspection of printed circuit boards 有权
标题翻译：印刷电路板的基于颜色的检查
公开(公告)号：EP1703465B1
公开(公告)日：2009-12-23
申请号：EP06111295.9
申请日：2006-03-17
申请人： OMRON CORPORATION
发明人： Nakajima, Akira , Shimizu, Atsushi , Moriya, Toshihiro , Wada, Hirotaka , Katahata, Takatoshi
IPC分类号： G06T7/00
CPC分类号： G06T7/001 , G06T2207/30141 , G06T2207/30148 , G06T2207/30152

2. 发明公开

EP2492633A1 Three-dimensional shape measurement apparatus and three-dimensional shape measurement method 有权转让
标题翻译： Verfahren und Vorrichtungfürdreidimensionale Formvermessung
公开(公告)号：EP2492633A1
公开(公告)日：2012-08-29
申请号：EP11186829.5
申请日：2011-10-27
申请人： OMRON Corporation
发明人： Ogino, Hirotaka , Honma, Yuki , Wada, Hirotaka
IPC分类号： G01B11/06 , G01B11/25 , G01N21/956
CPC分类号： G01B11/0608 , G01B11/2522 , G01N21/95684 , G01N2021/95661 , G01N2021/95669
摘要： A three-dimensional shape measurement apparatus is provided that calculates the height of solder accurately. An approximation surface of a wiring pattern is prepared for an inspection block prior to the application of solder (S22). Furthermore, an approximation surface of lands is prepared for an inspection block prior to the application of solder (S23). Then, based on the prepared approximation surface Sr of the wiring pattern and the approximation surface Sl of the lands, an offset, that is, the distance between the approximation surface Sr of the wiring pattern and the approximation surface Sl of the lands is calculated (S24). Then, the calculated offset is stored in a RAM or the like (S25). Then, after the application of solder, the stored offset is read out, and the height of the solder is calculated.
摘要翻译：提供了一种准确计算焊料的高度的三维形状测量装置。在施加焊料之前准备用于检查块的布线图案的近似表面（S22）。此外，在施加焊料之前，为检查块准备焊盘的近似表面（S23）。然后，基于布线图案的准备的近似表面Sr和焊盘的近似表面S1，计算偏移，即布线图案的近似表面Sr与焊盘的近似表面S1之间的距离（ S24）。然后，计算的偏移量存储在RAM等中（S25）。然后，在施加焊料之后，读出所存储的偏移量，并计算焊料的高度。

3. 发明授权

EP1694109B1 Printed circuit board inspecting method and apparatus inspection logic setting method and apparatus 有权
标题翻译：用于检查印刷电路，以及装置和方法，用于产生检查逻辑的方法和装置
公开(公告)号：EP1694109B1
公开(公告)日：2015-05-06
申请号：EP06110203.4
申请日：2006-02-21
申请人： OMRON CORPORATION
发明人： Moriya, Toshihiro , Wada, Hirotaka , Onishi, Takako , Shimizu, Atsushi , Nakajima, Akira
IPC分类号： H05K13/08
CPC分类号： H05K13/08

4. 发明授权

EP2492633B1 Three-dimensional shape measurement apparatus and three-dimensional shape measurement method 有权转让
公开(公告)号：EP2492633B1
公开(公告)日：2019-03-06
申请号：EP11186829.5
申请日：2011-10-27
申请人： OMRON Corporation
发明人： Ogino, Hirotaka , Honma, Yuki , Wada, Hirotaka
IPC分类号： G01B11/06 , G01B11/25 , G01N21/956

5. 发明公开

EP1694109A3 Printed circuit board inspecting method and apparatus inspection logic setting method and apparatus 有权
标题翻译：用于检查印刷电路，以及装置和方法，用于产生检查逻辑的方法和装置
公开(公告)号：EP1694109A3
公开(公告)日：2009-07-08
申请号：EP06110203.4
申请日：2006-02-21
申请人： OMRON CORPORATION
发明人： Moriya, Toshihiro , Wada, Hirotaka , Onishi, Takako , Shimizu, Atsushi , Nakajima, Akira
IPC分类号： H05K13/08
CPC分类号： H05K13/08
摘要： A PC board inspecting method capable of detecting deviation of an IC component at high speed with small storage capacity utilizes inspection logic particular to a component to be inspected. The inspection logic includes a color condition for specifying a color appearing in the body of the component to be inspected. The component is radiated with a plurality of color rays at different angles of incidence. An image formed by reflection light of the color rays is captured, and an inspection image including at least part of an edge (92) of the body of the component to be inspected is captured. By using the color condition, a component body area (91) satisfying the color condition is extracted from the inspection image by an image process. In one embodiment, an image process also specifies an edge (92) of the component body area (91). The value of a characteristic amount of the edge (92) is compared with a determination condition, thereby determining whether or not the component to be inspected is in a normal position.

6. 发明公开

EP1694109A2 Printed circuit board inspecting method and apparatus inspection logic setting method and apparatus 有权
标题翻译：用于检查印刷电路，以及装置和方法，用于产生检查逻辑的方法和装置
公开(公告)号：EP1694109A2
公开(公告)日：2006-08-23
申请号：EP06110203.4
申请日：2006-02-21
申请人： OMRON CORPORATION
发明人： Moriya, Toshihiro , Wada, Hirotaka , Onishi, Takako , Shimizu, Atsushi , Nakajima, Akira
IPC分类号： H05K13/08
CPC分类号： H05K13/08
摘要： A PC board inspecting method capable of detecting deviation of an IC component at high speed with small storage capacity utilizes inspection logic particular to a component to be inspected. The inspection logic includes a color condition for specifying a color appearing in the body of the component to be inspected. The component is radiated with a plurality of color rays at different angles of incidence. An image formed by reflection light of the color rays is captured, and an inspection image including at least part of an edge (92) of the body of the component to be inspected is captured. By using the color condition, a component body area (91) satisfying the color condition is extracted from the inspection image by an image process. In one embodiment, an image process also specifies an edge (92) of the component body area (91). The value of a characteristic amount of the edge (92) is compared with a determination condition, thereby determining whether or not the component to be inspected is in a normal position.
摘要翻译：能够以高速与小的存储容量检测的IC部件的偏差的PC基板检查方法利用检查逻辑的特殊到组件要被检查。检查逻辑包括被检查用于指定颜色的部件的主体亮相的颜色状态。该组件是用辐射在不同的入射角颜色光线的复数。由颜色光线的反射光形成的图像被捕获，并在检查图像包括所述部件的主体的边缘（92）要被检查被捕获的至少一部分。通过使用色彩调节，满足颜色条件的组件体区域（91）从所述检查图像通过图像处理提取。在一个，图像处理的方式，从而规定了该部件主体区（91）的边缘（92）。边缘（92）的特征量的值与判定条件进行比较，从而确定性采矿是否该组件将被检查处于正常位置。

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