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    • 1. 发明公开
    • TEMPERATURE SENSING DEVICE CAPABLE OF AUTOMATICALLY SWITCHING MODE AND METHOD THEREOF
    • 具有自动切换模式的温度感测装置及其方法
    • EP3318858A1
    • 2018-05-09
    • EP17200066.3
    • 2017-11-06
    • AViTA Corporation
    • SHIH, Hsuan HaoOU YANG, HsingYANG, Ta Chieh
    • G01K13/00
    • G01K7/021G01K7/04G01K13/002
    • The present disclosure illustrates a temperature sensing device capable of automatically switching mode, and a method thereof. The temperature sensing device includes a control unit configured to determine that the temperature sensing device is to enter or leave from a first mode or a second mode; a power supply unit configured to provide power required by the temperature sensing device; a power circuit including the power supply unit and is electrically connected to the control unit for power supply. The power circuit includes a detection unit electrically connected to the power supply unit and the control unit, and the detection unit is configured to detect when the temperature sensing device is moved from a standing state, and enable the control unit to determine that the temperature sensing device is to leave from the first mode and enter the second mode.
    • 本公开示出了能够自动切换模式的温度感测装置及其方法。 所述温度感测装置包括控制单元,所述控制单元被配置为确定所述温度感测装置将进入或离开第一模式或第二模式; 电源单元,被配置为提供温度感测设备所需的电力; 包括电源单元的电源电路,并且电连接到用于供电的控制单元。 所述电源电路包括电连接到所述电源单元和所述控制单元的检测单元,并且所述检测单元被配置为检测所述温度感测设备何时从站立状态移动,并且使得所述控制单元能够确定所述温度感测 设备将离开第一模式并进入第二模式。
    • 7. 发明公开
    • THERMOCOUPLE
    • 热电偶
    • EP2370996A4
    • 2017-02-01
    • EP09836647
    • 2009-12-02
    • ASM INC
    • DARABNIA BUZYEDNAK ANDYHALPIN MIKEJACOBS LORENAGGARWAL RAVINDER
    • H01L21/66G01K7/04G01K13/00H01L21/205
    • G01K7/04C23C16/46G01K13/00
    • A thermocouple for use in a semiconductor processing reaction is described. The thermocouple includes a sheath having a measuring tip and an opening at the opposing end. A support member that receives a portion of a first wire and a second wire is received within the sheath. The first and second wires form a junction that contacts the inner surface of the sheath at the measuring tip. A spacing member is secured at the opening of the sheath and receives the support member. The spacing member allows the support member, first wire, and second wire to freely thermally expand relative to each other without introducing compression or tension stresses therein.
    • 描述了用于半导体加工反应的热电偶。 热电偶包括具有测量尖端和相对端处的开口的护套。 接收第一导线和第二导线的一部分的支撑构件容纳在护套内。 第一和第二导线形成在测量尖端处与护套的内表面接触的连接点。 间隔构件固定在护套的开口处并接收支撑构件。 间隔构件允许支撑构件,第一线材和第二线材相对于彼此自由地热膨胀,而不会在其中引入压缩或拉伸应力。
    • 9. 发明公开
    • TEMPERATURE SENSING ASSEMBLY FOR MEASURING TEMPERATURE OF A SURFACE OF A STRUCTURE
    • TEMPERATURFÜHLENDEANORDNUNG ZUR MESSUNG DER TEMPERATUR EINEROBERFLÄCHEEINER STRUKTUR
    • EP2748571A1
    • 2014-07-02
    • EP12836216.7
    • 2012-09-14
    • Daily Instruments d/b/a Daily Thermetrics Corp.
    • DAILY, Jeffrey, N.WELCH, LarryCHAN, Yean, C.
    • G01K1/14G01K1/08G01K7/02
    • G01K1/143G01K1/026G01K7/04
    • A temperature sensing assembly for measuring the temperature of a surface of a structure includes a thermocouple device having a sheath containing a pair of conductors of dissimilar materials connected at a junction point to provide indications of temperature. The assembly further includes a docking device with a recess formed in a top surface to receive a portion of the sheath that is proximate the junction point. The bottom surface of the docking device is attached to the surface of the structure. The recess extends through the bottom surface of the docking device so that when the thermocouple device is positioned in the recess, the junction point is adjacent the surface of the tube. A heat shield can be attached to the docking device to shield the sheath proximate the junction point from direct and radiant heat sources.
    • 用于测量结构表面的温度的温度检测组件包括热电偶装置,其具有包含在连接点处连接的不同材料的一对导体的护套以提供温度指示。 组件还包括对接装置,其具有形成在顶表面中的凹部,以容纳靠近接合点的护套的一部分。 对接装置的底表面附接到结构的表面。 凹槽延伸穿过对接装置的底表面,使得当热电偶装置位于凹槽中时,连接点邻近管表面。 隔热罩可以连接到对接装置,以将护套靠近与直接和辐射热源的连接点。